- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Manufacturer Package Identifier | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Number of ADC Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of PWM Channels | Bus Compatibility | Number of I2C Channels | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | Number of SPI Channels | SATA | Number of Ethernet Channels | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 LS1046AXE8T1A NXP USA Inc. | 2480 | - | Datasheet | 18 Weeks | - | - | - | 780-FBGA, FCBGA | YES | - | - | - | - | - | 76 | - | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 780 | - | - | - | - | - | BOTTOM | BALL | 250 | 1V | 0.8mm | - | 30 | - | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | - | - | - | - | - | - | 1.8GHz | - | - | ARM® Cortex®-A72 | - | - | - | - | - | - | - | - | - | 14 | - | - | YES | - | 64 | - | - | - | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | - | - | - | I2C, PCI, SPI, UART, USB | - | - | - | Secure Boot, TrustZone® | - | - | SATA 6Gbps (1) | - | - | 2.61mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP3515ECUS Texas Instruments | 286 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | - | Surface Mount | 423-LFBGA, FCBGA | - | 423 | - | - | - | L2 Cache, ROM, SRAM | - | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | - | Active | 4 (72 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | - | OMAP3515 | 423 | - | 1.8V | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | - | - | - | - | - | 32b | - | - | - | - | ARM | - | YES | YES | - | - | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | - | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | - | - | - | NO | SINGLE | - | LCD | - | - | - | 1.4mm | - | 16mm | 16mm | 960μm | No | - | ROHS3 Compliant | Lead Free | ||
 AM5726BABCX Texas Instruments | 2987 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | - | 760-BFBGA, FCBGA | YES | 760 | - | - | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | - | Active | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5726 | - | - | - | 1.2V | - | 1.11V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | - | 38.4MHz | - | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | NO | - | 1.8V 3.3V | 10 | - | GbE | 2 Core 32-Bit | No | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | - | DSP, IPU, VPE | - | - | - | - | - | - | - | - | - | - | SATA 3Gbps (1) | - | 2.96mm | - | 23mm | 23mm | 2.39mm | - | - | ROHS3 Compliant | Lead Free | ||
 AT91SAM9M10-CU Microchip Technology | In Stock | - | Datasheet | - | - | - | Surface Mount | 324-TFBGA | - | 324 | 324-TFBGA (15x15) | - | - | ROM, SRAM | 160 | - | -40°C~85°C TA | Bulk | 2010 | SAM9M | - | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | -40°C | - | - | - | - | - | - | 400MHz | - | AT91SAM9M10 | - | - | - | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, SPI, Serial, UART, USART, USB | 3.6V | 900mV | 64kB | Internal | 400MHz | 64kB | - | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | - | - | - | 32b | - | - | 2 | - | ARM | 400MHz | - | - | - | 5 | - | - | - | 1.8V 3.3V | 1 | 8 | 10/100Mbps | 1 Core 32-Bit | No | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | 4 | - | 2 | - | - | - | LCD, Touchscreen, Video Decoder | 2 | - | 1 | 800μm | - | 15mm | 15.05mm | - | No | No SVHC | ROHS3 Compliant | - | ||
 OMAPL137DZKBT3 Texas Instruments | 1350 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Copper, Silver, Tin | Surface Mount | 256-BGA | - | 256 | - | - | - | Cache, FLASH | - | - | -40°C~125°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.2V | - | 375MHz | - | OMAPL137 | - | - | - | - | - | - | - | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | 32kB | - | - | 128kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | - | - | - | 16b | - | - | - | - | ARM | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | 3 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | 3 | Signal Processing; C674x, System Control; CP15 | - | 1 | - | - | - | NO | SINGLE | - | LCD | - | - | - | 2.05mm | - | 17mm | 17mm | 1.36mm | - | - | ROHS3 Compliant | Lead Free | ||
 AM1808BZWT3 Texas Instruments | 5 | - | Datasheet | - | - | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | - | - | AM1808BZWT3 | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | - | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | - | AM1808 | 361 | - | - | - | - | - | 1.32V | I2C, SPI, UART, USB | 1.35V | 950mV | 64kB | - | - | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | - | - | 32b | - | - | 4 | 23 | ARM | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | - | System Control; CP15 | - | - | - | - | - | - | - | - | LCD | - | SATA 3Gbps (1) | - | - | - | 16mm | - | - | - | No SVHC | ROHS3 Compliant | Contains Lead | ||
 MPC8377VRANGA NXP USA Inc. | 2468 |
| Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | 1.1V | 1.051.8/2.52.5/3.3V | 1V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | - | 32 | - | - | - | - | - | - | 15 | - | - | YES | YES | 64 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
OMAP3503ECUS Texas Instruments | 500 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | - | Surface Mount | 423-LFBGA, FCBGA | - | 423 | - | - | - | L2 Cache, ROM, SRAM | - | Commercial grade | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | - | Active | 4 (72 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | - | OMAP3503 | 423 | - | 1.8V | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | - | - | - | - | - | 32b | - | - | - | - | ARM | - | YES | YES | - | - | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | - | - | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | - | - | - | NO | SINGLE | - | LCD | - | - | - | 1.4mm | - | 16mm | 16mm | 960μm | - | - | ROHS3 Compliant | Lead Free | ||
 MC68302EH16C NXP USA Inc. | 8 | - | Datasheet | 8 Weeks | - | - | - | 132-BQFP Bumpered | YES | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 132 | 3A991.A.2 | Tin (Sn) | - | - | 8542.31.00.01 | QUAD | GULL WING | 260 | - | - | - | 40 | MC68302 | - | S-PQFP-G132 | - | - | - | - | - | - | - | - | - | - | 16MHz | - | MICROCONTROLLER, RISC | M68000 | - | - | - | NO | YES | - | NO | NO | - | 20 | - | - | - | - | 16 | - | - | - | - | 5.0V | - | - | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | - | Communications; RISC CPM | FLASH | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8548ECVJAUJD NXP USA Inc. | 3600 | - | Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Active | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver (Sn/Ag) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | - | 40 | MPC8548 | - | S-PBGA-B783 | - | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | - | - | - | - | - | - | 1.333GHz | - | MICROPROCESSOR | PowerPC e500 | - | 133MHz | 32 | - | - | - | - | - | - | 64 | - | - | YES | YES | 64 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE, Security; SEC | - | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | 3.38mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9CN11-CUR Microchip Technology | 36 |
| Datasheet | 12 Weeks | - | - | - | 217-LFBGA | YES | - | - | - | - | - | - | - | -40°C~85°C TA | Cut Tape (CT) | 2004 | SAM9CN | e8 | yes | Discontinued | 3 (168 Hours) | 217 | - | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) | - | - | - | BOTTOM | BALL | - | - | 0.8mm | - | - | AT91SAM9CN | - | S-PBGA-B217 | 1V | - | 11.8/3.33.3V | - | - | - | - | - | - | - | 400MHz | 32kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | - | - | 32b | - | - | - | - | ARM | - | - | - | - | - | - | - | - | 1.8V 3.3V | - | - | - | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | - | - | - | - | - | LCD, Touchscreen | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8323ECVRAFDCA NXP USA Inc. | 650 | - | - | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | - | - | S-PBGA-B516 | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC e300c2 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; QUICC Engine, Security; SEC 2.2 | - | - | - | - | - | - | - | Cryptography | - | - | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6D5EYM10AE NXP USA Inc. | 10 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA, FCBGA | - | - | - | - | - | - | - | Commercial grade | -20°C~105°C TJ | Tray | 2002 | i.MX6D | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
AM3715CUSD100 Texas Instruments | 1000 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | - | 423-LFBGA, FCBGA | YES | 423 | - | - | - | ROM | 188 | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 1GHz | - | AM3715 | 423 | - | 1.1V | - | - | - | 1.8V | I2C, MMC, SD, SPI, UART, USB | 1.5V | - | 32kB | - | 1000 MHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | - | - | 16b | - | - | 16 | - | ARM | - | YES | YES | - | - | FLOATING POINT | YES | 65536 | - | 4 | - | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | - | - | LCD | - | - | - | 1.4mm | - | 16mm | 16mm | 960μm | No | - | ROHS3 Compliant | Lead Free | ||
P2041NSE7PNC NXP USA Inc. | 9240 | - | Datasheet | 12 Weeks | - | - | - | 780-BBGA, FCBGA | - | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P2 | - | - | Active | 3 (168 Hours) | - | 5A002.A.1 | - | - | - | 8542.31.00.01 | - | - | 245 | - | - | - | - | P2041 | - | - | - | - | - | - | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | Security; SEC 4.2 | - | - | - | - | - | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 SVF522R3K1CMK4 NXP USA Inc. | 5000 | - | - | 15 Weeks | - | - | - | 364-LFBGA | YES | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2014 | Vybrid, VF5xxR | e1 | - | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | - | 40 | SVF522 | - | S-PBGA-B364 | - | 3.6V | - | 3V | - | - | - | - | - | - | 400MHz, 133MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | - | - | - | - | - | - | - | 16 | - | - | YES | YES | 16 | - | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | - | - | - | - | - | - | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | 1.5mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
AM1707DZKBA3 Texas Instruments | 30 |
| Datasheet | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | - | Surface Mount | 256-BGA | - | 256 | - | 2.784008g | - | L1 Cache, RAM, ROM | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.2V | - | 375MHz | - | AM1707 | - | - | 1.2V | - | - | - | - | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | - | - | - | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | - | - | 32b | - | - | - | - | ARM | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | - | System Control; CP15 | - | 1 | - | - | - | - | - | - | LCD | - | - | - | 2.05mm | - | 17mm | 17mm | 1.36mm | - | - | ROHS3 Compliant | Lead Free | ||
 MC7448THX1400ND NXP USA Inc. | 925 | - | Datasheet | 12 Weeks | - | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC74xx | e0 | - | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.15V | 1.27mm | - | 40 | MC7448 | - | S-CBGA-B360 | - | 1.2V | 1.31.8/2.5V | 1.1V | - | - | - | - | - | - | 1.4GHz | - | MICROPROCESSOR, RISC | PowerPC G4 | - | 200MHz | 32 | - | - | - | - | - | - | 36 | - | - | YES | YES | 64 | - | FLOATING POINT | YES | - | 1.5V 1.8V 2.5V | - | - | - | 1 Core 32-Bit | No | - | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.8mm | 25mm | - | - | - | - | Non-RoHS Compliant | - | ||
 MPC866TCVR100A NXP USA Inc. | 50 | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC866 | - | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 100MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
 MC9328MX21CJM NXP USA Inc. | 3600 | - | - | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | Industrial grade | -40°C~85°C TA | Tray | 1994 | i.MX21 | e1 | - | Not For New Designs | 3 (168 Hours) | 289 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.8mm | - | 40 | MC9328MX21 | - | S-PBGA-B289 | - | 1.65V | - | 1.45V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR | ARM926EJ-S | - | 32MHz | 32 | - | - | - | - | - | - | 26 | - | - | YES | YES | 32 | - | FIXED POINT | YES | - | 1.8V 3.0V | - | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | - | - | - | - | - | - | Keypad, LCD | - | - | - | - | 1.6mm | 17mm | - | - | - | - | ROHS3 Compliant | - |