- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
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- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
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Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Nominal Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | On Chip Program ROM Width | Max Frequency | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Number of ADC Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Number of I2C Channels | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | Number of SPI Channels | Number of DMA Channels | SATA | Number of Ethernet Channels | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 OMAP5910JZDY2 Texas Instruments | 70 | - | Datasheet | 6 Weeks | - | Surface Mount | 289-BGA | - | 289 | - | 1.241794g | FLASH | - | Industrial grade | - | -40°C~85°C TC | Tube | - | OMAP-59xx | e1 | yes | Active | 3 (168 Hours) | 289 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.6V | 1mm | 150MHz | - | OMAP5910 | 289 | - | - | 1.6V | - | - | - | 1.675V | I2C, MMC, SDIO, UART, USB | - | - | 32kB | - | 170mA | - | 160kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM9TDMI | - | - | 16 | 32b | 6 | 25 | - | 16 | - | YES | YES | - | - | - | FIXED POINT | YES | - | 1.8V 2.75V 3.3V | - | - | - | 1 Core 32-Bit | No | SDRAM | USB 2.0 (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | - | Signal Processing; C55x, System Control; CP15 | MROM | - | - | - | NO | MULTIPLE | - | Keypad, LCD | - | 6 | - | - | - | 2.32mm | 19mm | - | - | - | ROHS3 Compliant | Lead Free | ||
 MPC8541EVTAPF NXP USA Inc. | 154 | - | Datasheet | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8541 | - | R-PBGA-B783 | - | - | 1.26V | - | 1.14V | - | - | - | - | - | - | - | 833MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 166MHz | 32 | - | - | 64 | - | - | - | YES | YES | - | 64 | - | FLOATING POINT | YES | - | 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI | - | Security; SEC | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 3.75mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9XE128-QU Microchip Technology | 9638 | - | Datasheet | - | - | Surface Mount | 208-BFQFP | - | 208 | 208-PQFP (28x28) | - | FLASH, ROM | 96 | - | Yes | -40°C~85°C TA | Tray | 1997 | SAM9XE | - | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | -40°C | - | - | - | - | - | - | 180MHz | - | AT91SAM9XE128 | - | - | - | 3.3V | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 32kB | Internal | - | 180MHz | 16kB | - | ARM926EJ-S | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | - | 32b | 6 | - | ARM | - | 180MHz | - | - | - | - | 96 | - | - | - | 1.8V 2.5V 3.3V | 2 | 4 | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | 2 | - | - | - | LCD, Touchscreen | 2 | - | - | 1 | 3.6mm | - | 28mm | 28mm | No | No SVHC | ROHS3 Compliant | - | ||
 P1022NXE2LFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | P1022 | - | S-PBGA-B689 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | - | - | 1.055GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 133MHz | 32 | - | - | - | - | - | - | YES | YES | - | - | - | FIXED POINT | YES | - | - | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | Security; SEC | - | - | - | - | - | - | Cryptography, Random Number Generator | LCD | - | - | SATA 3Gbps (2) | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9XE256-CU Microchip Technology | 250 | - | Datasheet | - | - | Surface Mount | 217-LFBGA | - | 217 | 217-LFBGA (15x15) | - | FLASH, ROM | 96 | - | - | -40°C~85°C TA | Tray | 1997 | SAM9XE | - | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | -40°C | - | - | - | - | - | - | 180MHz | - | AT91SAM9XE256 | - | - | - | 3.3V | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 32kB | Internal | - | 180MHz | 32kB | - | ARM926EJ-S | Brown-out Detect/Reset, POR, PWM, WDT | - | - | 32b | 6 | - | ARM | - | 180MHz | - | - | - | - | 96 | - | - | - | 1.8V 2.5V 3.3V | - | - | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | - | - | - | - | LCD, Touchscreen | - | - | - | - | - | - | 15mm | - | No | - | ROHS3 Compliant | - | ||
 MCIMX534AVV8C NXP USA Inc. | 4657 | - | - | 15 Weeks | - | - | 529-FBGA | YES | - | - | - | - | - | Automotive grade | - | -40°C~125°C TJ | Tray | 2008 | i.MX53 | - | - | Active | 3 (168 Hours) | 529 | 5A992 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | NOT SPECIFIED | MCIMX534 | - | S-PBGA-B529 | Not Qualified | - | 1.15V | 1.11.31.8/3.3V | 1.05V | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 27MHz | 32 | - | - | 26 | - | - | - | YES | YES | AEC-Q100 | 32 | - | FLOATING POINT | YES | - | 1.3V 1.8V 2.775V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | SATA 1.5Gbps (1) | - | - | 1.85mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 AM3352ZCE50 Texas Instruments | In Stock | - | Datasheet | - | Copper, Silver, Tin | Surface Mount | 298-LFBGA | - | 298 | - | - | Cache, RAM, ROM | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | - | Obsolete | 3 (168 Hours) | 298 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 500MHz | - | AM3352 | - | - | - | - | - | - | - | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 1.89V | 1.71V | 320kB | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 32b | - | 16 | ARM | - | - | YES | YES | - | - | - | FIXED POINT | YES | - | 1.8V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | - | - | - | - | - | - | - | No | No SVHC | ROHS3 Compliant | - | ||
 MC9328MXLVM15 NXP USA Inc. | 213 | - | Datasheet | 26 Weeks | - | - | 256-LFBGA | YES | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | - | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | - | 40 | MC9328MXL | - | S-PBGA-B256 | - | - | 1.9V | - | 1.7V | - | - | - | - | - | - | - | 150MHz | - | MICROPROCESSOR, RISC | ARM920T | - | 16MHz | 32 | - | - | 25 | - | - | - | YES | YES | - | 32 | - | FIXED POINT | YES | - | 1.8V 3.0V | - | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | - | - | - | - | - | LCD | - | - | - | - | - | 1.6mm | 14mm | - | - | - | ROHS3 Compliant | - | ||
P1021NXN2HFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | P1021 | - | S-PBGA-B689 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | 32 | - | - | - | - | - | - | YES | YES | - | - | - | FIXED POINT | YES | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6S8DVM10AB NXP USA Inc. | 40 |
| Datasheet | 15 Weeks | - | - | 624-LFBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TJ | Tray | 2002 | i.MX6S | - | - | Not For New Designs | 3 (168 Hours) | 624 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | 26 | - | - | - | YES | YES | - | 32 | - | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | - | - | 1.6mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8313EVRAFFC NXP USA Inc. | 10000 |
| Datasheet | 8 Weeks | - | - | 516-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8313 | - | S-PBGA-B516 | - | - | 1.05V | 11.8/2.53.3V | 0.95V | - | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | 32 | - | - | - | YES | YES | - | 32 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | Security; SEC 2.2 | - | - | - | - | - | - | Cryptography | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | ROHS3 Compliant | - | ||
 MPC870VR66 NXP USA Inc. | 300 | - | Datasheet | 12 Weeks | - | - | 256-BBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC870 | - | S-PBGA-B256 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | 32 | - | - | - | YES | YES | - | 32 | - | FIXED POINT | YES | - | 3.3V | - | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | I2C, PCMCIA, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | ROHS3 Compliant | - | ||
 MPC855TVR50D4 NXP USA Inc. | 2108 | - | Datasheet | 8 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC855 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | 32 | - | - | - | YES | YES | - | 32 | - | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
AT91SAM9261SB-CU Microchip Technology | 4120 | - | Datasheet | - | - | Surface Mount | 217-LFBGA | - | 217 | 217-LFBGA (15x15) | - | ROM | 96 | - | - | -40°C~85°C TA | Tray | 1997 | AT91SAM | - | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | -40°C | - | - | - | - | - | - | 190MHz | - | AT91SAM9261 | - | - | - | 3.3V | - | - | - | - | 2-Wire, EBI/EMI, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 3V | 32kB | Internal | - | 190MHz | 160kB | - | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | - | 32b | 4 | - | ARM | - | 190MHz | - | - | - | - | 96 | - | - | - | 3.0V 3.3V | - | - | - | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | - | - | - | - | LCD | - | - | - | - | - | - | 15mm | - | - | No SVHC | ROHS3 Compliant | - | ||
 P2041NXN7NNC NXP USA Inc. | 860 | - | Datasheet | 12 Weeks | - | - | 780-BFBGA | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | - | - | 8542.31.00.01 | - | - | 245 | - | - | - | 30 | P2041 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.3GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC8548VJAQGD NXP USA Inc. | 2240 |
| Datasheet | 18 Weeks | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | Tin/Silver (Sn/Ag) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | - | 40 | MPC8548 | - | S-PBGA-B783 | - | - | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | - | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 133MHz | 32 | - | - | 16 | - | - | - | YES | YES | - | 64 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.38mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX353DJQ5C NXP USA Inc. | 1002 | - | - | 15 Weeks | - | - | 400-LFBGA | YES | - | - | - | - | 4 | - | - | -20°C~70°C TA | Tray | 2008 | i.MX35 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | MCIMX353 | - | S-PBGA-B400 | Not Qualified | - | 1.47V | - | 1.33V | - | - | - | - | - | - | - | 532MHz | - | MULTIFUNCTION PERIPHERAL | ARM1136JF-S | - | 24MHz | - | - | - | - | - | - | - | YES | - | - | - | - | - | - | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | - | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | - | - | - | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | - | - | - | - | - | 1.6mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8360EVVAGDGA NXP USA Inc. | 15 | - | Datasheet | 12 Weeks | - | - | 740-LBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 740 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8360 | - | S-PBGA-B740 | - | - | 1.26V | 1.8/2.53.3V | 1.14V | - | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | - | 66.67MHz | 32 | - | - | 32 | - | - | - | YES | YES | - | 32 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine, Security; SEC | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 1.69mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 P1010NSE5HHB NXP USA Inc. | 555 | - | Datasheet | 12 Weeks | - | - | 425-FBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 425 | - | - | - | - | 8542.31.00.01 | - | - | - | 1V | - | - | - | P1010 | - | - | - | - | - | 1V | - | - | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | - | Security; SEC 4.4 | - | - | - | - | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC8360EVVAJDGA NXP USA Inc. | 3600 | - | Datasheet | 12 Weeks | - | - | 740-LBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e1 | - | Active | 3 (168 Hours) | 740 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | - | 40 | MPC8360 | - | S-PBGA-B740 | - | - | 1.35V | 1.8/2.53.3V | 1.15V | - | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | - | 66.67MHz | 32 | - | - | 32 | - | - | - | YES | YES | - | 32 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine, Security; SEC | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 1.69mm | 37.5mm | - | - | - | ROHS3 Compliant | - |