- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
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Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Number of ADC Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Number of PWM Channels | Bus Compatibility | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 ATSAMA5D27C-CNR Microchip Technology | 11 |
| Datasheet | 10 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Cut Tape (CT) | 2017 | SAMA5D2 | - | - | Active | 3 (168 Hours) | 289 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.2V | 0.8mm | - | - | - | ATSAMA5D27 | - | S-PBGA-B289 | - | 1.32V | - | 1.1V | - | - | - | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | 24MHz | - | - | - | - | - | 26 | - | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | - | Multimedia; NEON™ MPE | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | - | - | - | 1.4mm | 14mm | - | - | - | ROHS3 Compliant | - | ||
 MIMX8MQ6CVAHZAA NXP USA Inc. | 19 |
| Datasheet | 16 Weeks | - | - | - | 621-FBGA, FCBGA | YES | - | - | 16 | - | -40°C~105°C TJ | Tray | - | i.MX8MQ | - | - | Not For New Designs | 3 (168 Hours) | 621 | - | - | - | BOTTOM | BALL | 260 | 1V | 0.65mm | compliant | - | NOT SPECIFIED | - | - | S-PBGA-B621 | - | 1.05V | - | 0.9V | - | - | - | - | - | - | 1.3GHz | - | - | ARM® Cortex®-A53 | - | 40MHz | - | - | - | - | - | - | - | YES | - | - | - | - | 160K | - | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | - | ARM® Cortex®-M4 | - | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | - | - | 2.18mm | 17mm | - | - | - | RoHS Compliant | - | ||
 AT91SAM9M11B-CU Microchip Technology | 7 |
| Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 324-TFBGA | - | 324 | FLASH, ROM | 160 | - | -40°C~85°C TA | Tray | 2010 | SAM9M | - | yes | Active | 3 (168 Hours) | 324 | - | - | - | BOTTOM | BALL | - | 1V | - | - | 400MHz | - | AT91SAM9M11 | - | - | 1.95V | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB | 3.6V | 1.65V | 64kB | Internal | - | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | 32 | YES | YES | 32b | 2 | 26 | ARM | - | - | - | - | - | - | 1.8V 3.3V | - | 8 | 10/100Mbps | 1 Core 32-Bit | No | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | 4 | - | Cryptography | LCD, Touchscreen, Video Decoder | - | - | - | - | 15mm | - | - | No SVHC | ROHS3 Compliant | - | ||
 MC68302EH25C NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 132-BQFP Bumpered | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | 3A991.A.2 | - | 8542.31.00.01 | UNSPECIFIED | UNSPECIFIED | - | 5V | - | - | - | - | MC68302 | - | - | - | 5.5V | - | 4.5V | - | - | - | - | - | - | 25MHz | - | MICROPROCESSOR CIRCUIT | M68000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6DP4AVT1AA NXP USA Inc. | 1 |
| Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | 1.5V | - | 1.35V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | - | - | 26 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 AM1707BZKBA3 Texas Instruments | 116 |
| Datasheet | - | - | - | Surface Mount | 256-BGA | - | 256 | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | no | Obsolete | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | 0.5mm | - | 375MHz | - | AM1707 | 256 | - | 1.2V | - | - | - | 1.32V | I2C, SPI, UART | 1.32V | 1.14V | 16kB | - | - | 8kB | - | ARM926EJ-S | - | - | 32 | - | - | 32b | - | 16 | RISC | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | - | System Control; CP15 | - | - | - | LCD | - | - | - | 2.05mm | 17mm | - | - | - | ROHS3 Compliant | Contains Lead | ||
 AM4372BZDNA60 Texas Instruments | 3945 | - | Datasheet | 12 Weeks | ACTIVE (Last Updated: 6 days ago) | - | - | 491-LFBGA | YES | 491 | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.1V | 0.65mm | - | - | - | AM4372 | - | - | - | 1.144V | - | 1.056V | - | - | - | - | - | - | 600MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 26MHz | 32 | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 65536 | 1.8V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | Crypto Accelerator | TSC, WXGA | 64 | - | 1.3mm | - | 17mm | 17mm | 900μm | - | ROHS3 Compliant | - | ||
 MPC860PZQ80D4 NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | 80MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX6S5EVM10ACR NXP USA Inc. | 500 |
| Datasheet | 15 Weeks | - | - | - | 624-LFBGA | - | - | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC885CVR133 NXP USA Inc. | 3000 | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | - | - | 40 | MPC885 | - | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM, Security; SEC | - | - | Cryptography | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX233DJM4C NXP USA Inc. | 5 |
| Datasheet | 15 Weeks | - | - | - | 169-LFBGA | YES | - | - | 95 | - | -10°C~70°C TA | Tray | 2004 | i.MX23 | - | yes | Active | 3 (168 Hours) | 169 | - | - | - | BOTTOM | BALL | - | 1.35V | 0.8mm | - | - | - | MCIMX233 | - | S-PBGA-B169 | - | 1.55V | - | 1V | - | - | - | - | - | - | 454MHz | - | MULTIFUNCTION PERIPHERAL | ARM926EJ-S | - | 24MHz | - | - | - | - | - | - | - | YES | - | 16 | - | - | 32768 | 2.0V 2.5V 2.7V 3.0V 3.3V | - | - | - | 1 Core 32-Bit | No | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | Data; DCP | - | - | Cryptography, Hardware ID | LCD, Touchscreen | - | - | - | 1.43mm | 11mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6X2EVN10AB NXP USA Inc. | 656 | - | Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | 179 | - | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | - | S-PBGA-B400 | - | 1.5V | - | 1.35V | - | - | - | - | - | - | 227MHz, 1GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | 1000MHz | - | - | - | - | - | 15 | - | YES | - | 32 | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | - | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | 1.53mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
 P4080NSN7PNC NXP USA Inc. | 108 | - | Datasheet | 12 Weeks | - | - | - | 1295-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P4 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | - | 30 | P4080 | - | S-PBGA-B1295 | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | 133.3MHz | - | - | - | - | - | 32 | - | YES | YES | 16 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 1Gbps (8), 10Gbps (2) | 8 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | - | - | 3.53mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX535DVV2C NXP USA Inc. | In Stock | - | - | 15 Weeks | - | - | - | 529-FBGA | YES | - | - | - | - | -20°C~85°C TC | Tray | 2008 | i.MX53 | e2 | - | Not For New Designs | 3 (168 Hours) | 529 | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | - | - | 40 | MCIMX535 | - | S-PBGA-B529 | - | 1.4V | - | 1.3V | - | - | - | - | - | - | 1.2GHz | - | - | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.3V 1.8V 2.775V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 1.5Gbps (1) | - | 1.85mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
MCIMX6U5EVM10AD NXP USA Inc. | 891 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA | - | - | - | - | - | -20°C~105°C TJ | Tray | - | i.MX6DL | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC860SRZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
P3041NSN7PNC NXP USA Inc. | 202 |
| Datasheet | 12 Weeks | - | - | - | 1295-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | - | 30 | P3041 | - | S-PBGA-B1295 | - | 1.04V | - | 0.96V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | 133MHz | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | 1.5V 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | 3.53mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 T1042NSN7MQB NXP USA Inc. | 2706 | - | Datasheet | 18 Weeks | - | - | - | 780-FBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Bulk | 2014 | QorIQ T1 | - | - | Active | 3 (168 Hours) | 780 | 3A991.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | - | - | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | - | - | - | - | - | - | 1.4GHz | - | MICROPROCESSOR, RISC | PowerPC e5500 | - | 133.3MHz | 32 | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | - | - | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | 2.07mm | 23mm | - | - | - | ROHS3 Compliant | - | ||
MPC880VR133 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | - | 30 | MPC880 | - | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 P1020NSE2HFB NXP USA Inc. | 10486 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | - | P1020 | - | S-PBGA-B689 | - | 1.05V | 1V | 0.95V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | 32 | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | 2.5V 3.3V | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - |