- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
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- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Weight | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX233CJM4C NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | - | - | - | 169-LFBGA | - | - | - | - | - | Industrial grade | -40°C~85°C TA | Tray | 2004 | i.MX23 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MCIMX233 | - | - | - | - | - | - | - | - | - | - | - | - | 454MHz | - | - | ARM926EJ-S | - | - | - | - | - | - | - | - | - | - | - | - | 2.0V 2.5V 2.7V 3.0V 3.3V | - | - | 1 Core 32-Bit | No | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | - | - | - | - | Cryptography, Hardware ID | LCD, Touchscreen | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX257CJN4A NXP USA Inc. | 3000 |
| Datasheet | 15 Weeks | - | - | - | 347-LFBGA | YES | - | - | - | 6 | - | -40°C~85°C TA | Tray | 2005 | i.MX25 | e1 | - | Active | 3 (168 Hours) | 347 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.5mm | - | 40 | MCIMX257 | - | S-PBGA-B347 | - | - | 1.52V | 1.2/1.51.8/3.3V | 1.38V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | - | - | 26 | - | YES | YES | 16 | FIXED POINT | YES | 128000 | 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | I2C; USB | - | - | - | Keypad, LCD, Touchscreen | - | - | 1.52mm | 12mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6DP6AVT1AB NXP USA Inc. | 2571 |
| Datasheet | 12 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | - | - | Active | 3 (168 Hours) | 624 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM1808BZWTD4 Texas Instruments | 9000 | - | Datasheet | - | - | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | - | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | no | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | - | AM1808 | 361 | - | - | - | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.35V | 950mV | - | - | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | 32 | 32b | - | 23 | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | - | - | - | - | LCD | SATA 3Gbps (1) | - | - | - | - | - | - | No SVHC | ROHS3 Compliant | Lead Free | ||
 MPC8569ECVJAQLJB NXP USA Inc. | 274 | - | Datasheet | 12 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e1 | - | Last Time Buy | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | 30 | - | - | S-PBGA-B783 | - | - | 1.03V | 12.5/3.3V | 0.97V | - | - | - | - | - | 1.067GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | - | - | 16 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.0V 1.5V 1.8V 2.5V 3.3V | - | 10/100Mbps (8), 1Gbps (4) | 1 Core 32-Bit | No | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC | - | - | - | - | Cryptography, Random Number Generator | - | - | - | 3.94mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 MC68EN360CAI25L NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 240-BFQFP | YES | - | - | - | - | - | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | - | - | - | 40 | MC68EN360 | - | S-PQFP-G240 | - | - | - | - | - | - | - | - | - | - | 25MHz | - | RISC MICROCONTROLLER | CPU32+ | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8314VRADDA NXP USA Inc. | 5000 |
| Datasheet | 10 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8314 | - | S-PBGA-B620 | - | - | 1.05V | 13.3V | 0.95V | - | - | - | - | - | 266MHz | - | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | - | - | - | - | - | - | - | - | 2.46mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8377VRALGA NXP USA Inc. | 54 |
| Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | 32 | - | - | 15 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
 FS32V234CON1VUB NXP USA Inc. | 23 |
| Datasheet | 22 Weeks | - | - | - | 621-FBGA, FCBGA | YES | - | - | - | - | - | -40°C~105°C TA | - | 2015 | - | - | - | Active | 3 (168 Hours) | 621 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.65mm | - | 40 | - | - | S-PBGA-B621 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | 1GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A53, ARM® Cortex®-M4 | - | 64 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1V 1.8V 3.3V | - | 1Gbps | 4 Core 64-Bit/1 Core 32-Bit | Yes | DDR3, DDR3L, LPDDR2 | - | I2C, SPI, PCI, UART | Multimedia; NEON™ MPE | - | - | - | - | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | - | - | 2.44mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM3354BZCEA60 Texas Instruments | 36 |
| Datasheet | 8 Weeks | ACTIVE (Last Updated: 2 weeks ago) | Copper, Silver, Tin | - | 298-LFBGA | YES | 298 | - | Cache, RAM, ROM | - | - | -40°C~105°C TJ | Tube | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 298 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.1V | - | 600MHz | NOT SPECIFIED | AM3354 | - | - | Not Qualified | 1.1V | - | - | - | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | 32b | - | - | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | - | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | 1.3mm | - | 13mm | 13mm | 890μm | - | - | ROHS3 Compliant | Lead Free | ||
 MCIMX6S1AVM08AC NXP USA Inc. | 900 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA | YES | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | - | - | 16 | - | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.6mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
P1020NSE2DFB NXP USA Inc. | 10487 |
| Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 689 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | P1020 | - | S-PBGA-B689 | - | - | - | 1V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 AM5726BABCXEA Texas Instruments | 10913 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | - | 760-BFBGA, FCBGA | YES | 760 | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | - | Active | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5726 | - | - | - | - | 1.2V | - | 1.11V | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | - | - | - | - | - | YES | YES | - | FLOATING POINT | NO | - | 1.8V 3.3V | 10 | GbE | 2 Core 32-Bit | No | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | - | DSP, IPU, VPE | - | - | - | - | - | - | SATA 3Gbps (1) | 2.96mm | - | 23mm | 23mm | 2.39mm | - | - | ROHS3 Compliant | Lead Free | ||
MCIMX6L7DVN10AB NXP USA Inc. | 200 | - | Datasheet | 12 Weeks | - | - | - | 432-TFBGA | YES | - | - | - | 162 | Commercial grade | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | - | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | - | 40 | MCIMX6 | - | S-PBGA-B | Not Qualified | - | 1.5V | - | 1.375V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | - | - | 16 | - | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.1mm | 13mm | - | - | - | - | ROHS3 Compliant | - | ||
 P1010NXE5HHB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 425-FBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 425 | - | - | 8542.31.00.01 | - | - | - | 1V | - | - | - | P1010 | - | - | - | - | - | 1V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | - | - | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
OMAPL138BZWT4 Texas Instruments | 27 | - | Datasheet | - | - | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | - | Cache, RAM, ROM | - | - | 0°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1V | 0.8mm | 456MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | 1.35V | Ethernet, MMC, SATA, SD, UART, USB | 1.35V | 1.25V | 32kB | - | 40kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | 32b | 4 | - | ARM | YES | YES | - | FLOATING POINT | - | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | - | - | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | - | - | 16mm | - | - | - | No SVHC | ROHS3 Compliant | Lead Free | ||
 MCIMX31CVMN4C NXP USA Inc. | 10000 | - | Datasheet | 15 Weeks | - | - | - | 473-LFBGA | YES | - | - | - | - | - | -40°C~85°C TA | Tray | 2004 | i.MX31 | e1 | - | Active | 3 (168 Hours) | 473 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | - | 40 | MCIMX31 | - | S-PBGA-B473 | Not Qualified | - | 1.47V | 1.53.3V | 1.22V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM1136JF-S | 75MHz | 32 | - | - | 26 | - | YES | YES | 16 | FLOATING POINT | YES | - | 1.8V 2.0V 2.5V 2.7V 3.0V | - | - | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | - | - | - | - | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | - | - | 1.54mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX6U7CVM08AB NXP USA Inc. | 1023 |
| Datasheet | - | - | - | - | 624-LFBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6DL | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | - | - | 26 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.6mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8321ECVRADDCA NXP USA Inc. | 40 |
| - | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | - | - | S-PBGA-B516 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | - | - | - | - | Cryptography | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM3354BZCZ30 Texas Instruments | 36 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | Surface Mount | 324-LFBGA | - | 324 | 1.713814g | Cache, RAM, ROM | - | - | 0°C~90°C TJ | Tube | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 324 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 300MHz | - | AM3354 | - | - | - | 1.1V | - | - | - | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | 32b | - | - | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | - | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | 1.4mm | - | 15mm | 15mm | 900μm | No | - | ROHS3 Compliant | Lead Free |