- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
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Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Address Bus Width | Core Architecture | On Chip Program ROM Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Speed Grade | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8309VMAGDCA NXP USA Inc. | 217 |
| - | 10 Weeks | - | - | 489-LFBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 489 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MPC8309 | - | S-PBGA-B489 | - | - | 1.05V | 1V | 0.95V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | - | YES | - | 1.8V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM | - | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.61mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 OMAPL138EZWTA3E Texas Instruments | 5 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | - | 361-LFBGA | YES | 361 | - | - | - | -40°C~105°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 375MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR CIRCUIT | ARM926EJ-S | - | - | - | - | - | - | - | - | - | ARM | - | - | - | - | - | 375 MHz | - | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | - | Signal Processing; C674x, System Control; CP15 | - | 1 | I2C; SPI; UART; USB | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.4mm | - | 16mm | 16mm | 900μm | - | ROHS3 Compliant | Lead Free | ||
 P2020NXE2KFC NXP USA Inc. | 1000 | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2020 | - | S-PBGA-B689 | - | - | - | 1.05V | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR | PowerPC e500v2 | - | - | 32 | - | - | - | - | - | - | - | - | YES | - | - | FLOATING POINT | - | YES | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | - | - | Cryptography, Random Number Generator | - | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8349EVVALFB NXP USA Inc. | 2745 | - | - | 12 Weeks | - | - | 672-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8349 | - | S-PBGA-B672 | - | - | 1.26V | 1.22.5/3.3V | 1.14V | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e300 | - | 66MHz | 32 | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | - | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | - | 1.69mm | 35mm | - | - | - | ROHS3 Compliant | - | ||
 LS1043ASN7QQB NXP USA Inc. | 73 |
| Datasheet | 18 Weeks | - | - | 621-FBGA, FCBGA | - | - | - | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8247ZQTIEA NXP USA Inc. | 50 |
| Datasheet | 12 Weeks | - | - | 516-BBGA | YES | - | - | 57 | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8247 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | 1.425V | - | - | - | - | - | - | 400MHz | - | MICROCONTROLLER, RISC | PowerPC G2_LE | - | 66.7MHz | 32 | NO | YES | - | NO | - | 30 | - | - | - | - | 64 | - | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | 27mm | - | - | - | Non-RoHS Compliant | - | ||
 MPC8314CVRAGDA NXP USA Inc. | 200 |
| Datasheet | 10 Weeks | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8314 | - | S-PBGA-B620 | - | - | 1.05V | 13.3V | 0.95V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | - | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | - | - | - | - | - | - | - | - | 2.46mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8569EVJAUNLB NXP USA Inc. | 640 | - | Datasheet | 26 Weeks | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e1 | - | Last Time Buy | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 1.1V | 1mm | - | 30 | - | - | S-PBGA-B783 | - | - | 1.133V | 12.5/3.3V | 1.067V | - | - | - | - | - | - | 1.333GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 133MHz | 32 | - | - | - | - | - | 16 | - | - | YES | YES | 64 | FLOATING POINT | - | YES | - | 1.0V 1.5V 1.8V 2.5V 3.3V | - | 10/100Mbps (8), 1Gbps (4) | 1 Core 32-Bit | No | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | - | Communications; QUICC Engine, Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | - | 3.94mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8245LZU300D NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 352-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | - | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC8245 | - | S-PBGA-B352 | - | - | 2.1V | 23.3V | 1.7V | - | - | - | - | - | - | 300MHz | - | MICROPROCESSOR, RISC | PowerPC 603e | - | 66MHz | 32 | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | - | YES | - | 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | - | 1.65mm | 35mm | - | - | - | Non-RoHS Compliant | - | ||
 AM3358BZCE60 Texas Instruments | 36 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | - | 298-LFBGA | YES | 298 | - | - | - | 0°C~90°C TJ | - | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 298 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | 0.65mm | - | NOT SPECIFIED | AM3358 | - | - | - | - | 1.144V | - | 1.056V | - | - | - | - | - | - | 600MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 26MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | - | YES | - | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | 1.3mm | - | 13mm | 13mm | 890μm | - | ROHS3 Compliant | - | ||
 MPC860ENCZQ50D4 NXP USA Inc. | 149 | - | Datasheet | - | - | - | 357-BBGA | YES | - | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FIXED POINT | - | YES | - | 3.3V | - | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MVF60NN151CMK40 NXP USA Inc. | 40 | - | Datasheet | 15 Weeks | - | - | 364-LFBGA | YES | - | - | 131 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | - | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.23V | 0.8mm | - | 40 | MVF60NN151 | - | S-PBGA-B364 | Not Qualified | - | 1.26V | 3.3V | 1.16V | - | - | - | - | - | - | 400MHz, 167MHz | - | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | 16 | YES | YES | - | NO | YES | 16 | - | - | - | - | 16 | - | - | - | - | 3.3V | - | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | FLASH | - | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | 17mm | - | - | - | ROHS3 Compliant | - | ||
 MC7448HX1400ND NXP USA Inc. | 2184 |
| Datasheet | 12 Weeks | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | - | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.15V | 1.27mm | - | 40 | MC7448 | - | S-CBGA-B360 | - | - | 1.2V | 1.31.8/2.5V | 1.1V | - | - | - | - | - | - | 1.4GHz | - | MICROPROCESSOR, RISC | PowerPC G4 | - | 1400MHz | 32 | - | - | - | - | - | - | - | - | NO | YES | - | FIXED POINT | - | NO | - | 1.5V 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | - | 2.8mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 AT91SAM9G25-CU-999 Microchip Technology | 20000 |
| Datasheet | 10 Weeks | - | - | 217-LFBGA | YES | 217 | ROM | 105 | 65536 | -40°C~85°C TA | Cut Tape (CT) | 2004 | SAM9G | - | yes | Active | 3 (168 Hours) | 217 | - | - | - | - | BOTTOM | BALL | - | 1V | 0.8mm | 400MHz | - | AT91SAM9G25 | - | - | - | - | - | - | - | - | EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB | 1.1V | 900mV | 64kB | Internal | - | 32kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, POR, PWM, WDT | - | 32 | YES | YES | 32b | YES | NO | 26 | ARM | 8 | - | - | - | - | - | - | - | 1.8V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | No | DDR2, SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | FLASH | - | - | - | - | - | - | 1.4mm | 15mm | - | - | - | ROHS3 Compliant | Lead Free | ||
 MCIMX6X2AVN08AB NXP USA Inc. | 1000 |
| Datasheet | 26 Weeks | - | - | 400-LFBGA | YES | - | - | 14 | - | -40°C~125°C TJ | Tray | 2002 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | S-PBGA-B400 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | - | 200MHz, 800MHz | - | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | 15 | - | - | YES | - | 32 | - | - | - | 144K | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 2 | Multimedia; NEON™ MPE | - | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | 1.53mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
 AM1705DPTPD4 Texas Instruments | 40 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | - | 176-LQFP Exposed Pad | YES | 176 | - | - | - | -40°C~90°C TJ | Tube | - | Sitara™ | e4 | yes | Active | 4 (72 Hours) | 176 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | QUAD | GULL WING | - | 1.2V | 0.5mm | - | - | AM1705 | - | - | - | - | - | - | - | - | - | - | - | - | - | 456MHz | - | MICROPROCESSOR, RISC | ARM926EJ-S | - | 50MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | - | YES | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | - | System Control; CP15 | - | - | - | - | - | - | 1.6mm | - | 24mm | 24mm | 1.4mm | - | ROHS3 Compliant | Lead Free | ||
 MPC8308VMADDA NXP USA Inc. | 149 |
| - | 10 Weeks | - | - | 473-LFBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | - | - | - | 40 | MPC8308 | - | S-PBGA-B473 | - | - | - | - | - | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 AM3715CBC100 Texas Instruments | 1 |
| Datasheet | - | NRND (Last Updated: 1 week ago) | Copper, Silver, Tin | 515-VFBGA, FCBGA | YES | 515 | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 1GHz | - | AM3715 | 515 | - | - | 1.1V | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | - | 32kB | - | 1000 MHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | - | - | 32b | - | - | - | ARM | - | YES | YES | - | FLOATING POINT | - | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | LCD | - | 950μm | - | 14mm | 14mm | 630μm | No | ROHS3 Compliant | Lead Free | ||
 MPC875VR133 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 256-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC875 | - | S-PBGA-B256 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FIXED POINT | - | YES | - | 3.3V | - | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM, Security; SEC | - | - | - | Cryptography | - | - | - | 2.54mm | 23mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8572EVTAVNB NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 1023-BFBGA, FCBGA | - | - | - | - | - | 0°C~105°C TA | Tray | 2005 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | MPC8572 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5GHz | - | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | - | Signal Processing; SPE, Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | - | - | ROHS3 Compliant | - |