- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | ROM(word) | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6S5EVM10AD NXP USA Inc. | 680 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA | YES | - | - | - | - | 14 | - | - | - | -20°C~105°C TJ | Tray | - | i.MX6S | - | - | Active | 3 (168 Hours) | 624 | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | - | - | - | 1GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 26 | - | YES | - | 32 | - | - | 144K | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | - | 1.6mm | 21mm | - | - | ROHS3 Compliant | - | ||
 MCIMX6D4AVT10AD NXP USA Inc. | 2274 | - | Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | ROHS3 Compliant | - | ||
 MPC8536ECVJAULA NXP USA Inc. | 64 | - | Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Active | 3 (168 Hours) | 783 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | MPC8536 | - | S-PBGA-B783 | - | - | 1.05V | 11.5/1.81.8/3.3V | 0.95V | - | - | - | - | - | - | 1.333GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 133MHz | 32 | - | - | - | - | - | - | 16 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC | - | - | - | Cryptography | - | - | - | SATA 3Gbps (2) | - | 2.76mm | 29mm | - | - | ROHS3 Compliant | - | ||
 MCIMX515CJM6C NXP USA Inc. | 10000 |
| - | 15 Weeks | - | - | - | 529-LFBGA | YES | - | - | - | - | - | - | - | - | -40°C~95°C TC | Tray | 2008 | i.MX51 | - | - | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper - with Nickel barrier | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MCIMX515 | - | S-PBGA-B529 | Not Qualified | - | 1.1V | 1.2V | 0.95V | - | - | - | - | - | - | 600MHz | - | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2V 1.875V 2.775V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | - | Keypad, LCD | - | - | - | 1.6mm | 19mm | - | - | ROHS3 Compliant | - | ||
 MPC8272CVRTIEA NXP USA Inc. | 7 |
| Datasheet | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | 57 | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8272 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | 1.425V | - | - | - | - | - | - | 400MHz | - | MICROCONTROLLER, RISC | PowerPC G2_LE | - | 66.7MHz | 32 | NO | YES | - | NO | - | - | 30 | - | - | - | 64 | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 27mm | - | - | ROHS3 Compliant | - | ||
MPC8247CZQMIBA NXP USA Inc. | 38 |
| Datasheet | 8 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | 57 | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8247 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | 1.425V | - | - | - | - | - | - | 266MHz | - | MICROCONTROLLER, RISC | PowerPC G2_LE | - | 66.7MHz | 32 | NO | YES | - | NO | - | - | 30 | - | - | - | 64 | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | OTPROM | - | - | - | - | - | - | - | - | 2.55mm | 27mm | - | - | Non-RoHS Compliant | - | ||
 AT91SAM9CN12B-CU Microchip Technology | 36 | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 217-LFBGA | - | 217 | - | 2.169986g | L1 Cache, ROM, SRAM | 105 | - | - | Yes | -40°C~85°C TA | Tray | 2004 | SAM9CN | e1 | yes | Active | 3 (168 Hours) | 217 | - | TIN SILVER COPPER | - | BOTTOM | BALL | 260 | 1V | 0.8mm | 400MHz | 40 | AT91SAM9CN | - | - | - | - | - | - | - | - | 2-Wire, EBI/EMI, I2C, SPI, Serial, UART, USART, USB | 1.1V | 900mV | 128kB | Internal | - | 32kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | 32 | - | - | 32b | - | - | 2 | 26 | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | - | - | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | 1 | - | - | - | LCD, Touchscreen | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6Y1CVM05AB NXP USA Inc. | 3000 |
| Datasheet | 18 Weeks | - | - | - | 289-LFBGA | - | - | - | - | - | - | - | - | - | -40°C~105°C TJ | Tray | - | i.MX6 | e1 | - | Active | 3 (168 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 528MHz | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | - | - | - | A-HAB, ARM TZ, CSU, SJC, SNVS | - | Electrophoretic, LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 P1020NSN2HFB NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 689 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | P1020 | - | S-PBGA-B689 | - | - | - | 1V | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8245ARZU400D NXP USA Inc. | 576 | - | Datasheet | - | - | - | - | 352-LBGA | - | - | 352-TBGA (35x35) | - | - | - | - | - | - | 0°C~85°C TA | Tray | 2002 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8245 | - | - | - | - | - | - | - | - | - | - | - | - | - | 400MHz | - | - | PowerPC 603e | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 AM4376BZDND30 Texas Instruments | 7 |
| Datasheet | 12 Weeks | ACTIVE (Last Updated: 4 days ago) | - | Surface Mount | 491-LFBGA | - | 491 | - | - | - | - | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 0.95V | - | 300MHz | - | AM4376 | 491 | - | - | - | 1V | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | Crypto Accelerator | - | TSC, WXGA | - | - | 1.3mm | - | 17mm | 17mm | 900μm | ROHS3 Compliant | Lead Free | ||
 MCIMX27VOP4AR2 NXP USA Inc. | 1000 |
| Datasheet | 15 Weeks | - | - | - | 404-LFBGA | YES | - | - | - | - | - | - | - | - | -20°C~85°C TA | Tape & Reel (TR) | 2004 | i.MX27 | e1 | - | Not For New Designs | 3 (168 Hours) | 404 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.65mm | - | 40 | MCIMX27 | - | S-PBGA-B404 | - | - | 1.52V | - | 1.38V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM926EJ-S | - | 32MHz | 32 | - | - | - | - | - | - | 26 | - | YES | YES | 32 | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | - | - | - | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | - | Keypad, LCD | - | - | - | 1.4mm | 17mm | - | - | ROHS3 Compliant | - | ||
 SPEAR300-2 STMicroelectronics | 155 | - | Datasheet | - | - | Copper, Silver, Tin | Surface Mount | 289-LFBGA | - | 289 | - | - | - | 62 | - | - | - | -40°C~85°C TC | Tray | - | SPEAr® | e1 | - | Active | 3 (168 Hours) | 289 | 5A002.A.4 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 333MHz | - | SPEAR300 | 289 | - | - | 1.2V | - | 1.21.83.3V | - | 3.6V | I2C, Serial, UART, USB | 2.5V | 1.14V | 32kB | - | - | 56kB | MICROCONTROLLER, RISC | ARM926EJ-S | - | - | 32 | YES | YES | 16b | NO | YES | 6 | - | ARM | - | - | - | - | - | - | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (3) | I2C, I2S, IrDA, Microwire, MMC/SDIO, SPI, UART | Security; C3 | FLASH | - | - | Cryptography | - | Keyboard, LCD, Touchscreen | - | - | - | 1.7mm | 15mm | - | - | ROHS3 Compliant | Lead Free | ||
 MC68302AG33C NXP USA Inc. | 80 |
| Datasheet | 8 Weeks | - | - | - | 144-LQFP | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68302 | - | - | - | - | - | - | - | - | - | - | - | - | - | 33MHz | - | - | M68000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX6G2CVM05AA NXP USA Inc. | 5000 |
| Datasheet | 12 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | - | - | -40°C~105°C TJ | Tray | 2014 | i.MX6UL | - | - | Obsolete | 3 (168 Hours) | 289 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | S-PBGA-B289 | - | - | 1.3V | - | 1.15V | - | - | - | - | - | - | 528MHz | - | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | 16 | - | YES | YES | 16 | FIXED POINT | YES | - | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | LCD, LVDS | - | - | - | 1.32mm | 14mm | - | - | ROHS3 Compliant | - | ||
 MVF61NN151CMK50 NXP USA Inc. | 65 | - | Datasheet | 15 Weeks | - | - | - | 364-LFBGA | YES | - | - | - | - | 131 | 0 | - | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | - | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | - | 40 | MVF61NN151 | - | S-PBGA-B364 | Not Qualified | - | 1.26V | 3.3V | 1.16V | - | - | - | - | - | - | 500MHz, 167MHz | - | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | 16 | YES | YES | - | NO | YES | - | 16 | - | - | - | 16 | - | - | - | 3.3V | - | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | - | - | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | 17mm | - | - | ROHS3 Compliant | - | ||
 MC9328MX21DVM NXP USA Inc. | 5 | - | - | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | - | - | -30°C~70°C TA | Tray | 2004 | i.MX21 | e1 | - | Not For New Designs | 3 (168 Hours) | 289 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.8mm | - | 40 | MC9328MX21 | - | S-PBGA-B289 | - | - | 1.65V | - | 1.45V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR | ARM926EJ-S | - | 32MHz | 32 | - | - | - | - | - | - | 26 | - | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | - | - | Keypad, LCD | - | - | - | 1.6mm | 17mm | - | - | ROHS3 Compliant | - | ||
 AM5716AABCDA Texas Instruments | 36 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | - | - | 760-BFBGA, FCBGA | YES | 760 | - | - | - | - | - | Automotive grade | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5716 | - | - | - | - | 1.2V | - | 1.11V | - | - | - | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | - | 38.4MHz | - | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | NO | - | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | - | - | - | - | - | - | - | SATA 3Gbps (1) | 2.96mm | - | 23mm | 23mm | 2.39mm | ROHS3 Compliant | - | ||
 MC68360CAI25L NXP USA Inc. | 800 | - | Datasheet | - | - | - | - | 240-BFQFP | YES | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | - | - | - | 40 | MC68360 | - | S-PQFP-G240 | - | - | - | - | - | - | - | - | - | - | - | 25MHz | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | - | 25MHz | - | - | - | - | - | - | - | 32 | - | YES | YES | 32 | - | - | - | 5.0V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | 68000 | - | 1.25 MBps | - | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8280VVUPEA NXP USA Inc. | 2577 |
| Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e1 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8280 | - | S-PBGA-B480 | - | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | - | 450MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | - | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | ROHS3 Compliant | - |