- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | Operating Temperature (Max.) | ROM(word) | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | CPU Family | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Number of ADC Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of I2C Channels | Security Features | Display & Interface Controllers | Number of SPI Channels | SATA | Number of Ethernet Channels | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 AT91SAM9XE256-QU Microchip Technology | In Stock | - | Datasheet | - | - | - | Surface Mount | 208-BFQFP | - | 208 | 208-PQFP (28x28) | - | FLASH, ROM | 96 | - | - | Yes | -40°C~85°C TA | Tray | 2010 | SAM9XE | - | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | -40°C | - | - | - | - | - | - | 180MHz | - | AT91SAM9XE256 | - | - | - | 3.3V | - | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 32kB | Internal | 180MHz | 32kB | - | ARM926EJ-S | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | - | - | - | 32b | - | - | 6 | - | ARM | - | 180MHz | - | - | - | 96 | - | - | - | 1.8V 2.5V 3.3V | 1 | 4 | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | 2 | - | LCD, Touchscreen | 2 | - | 1 | 3.6mm | - | 28mm | 28mm | - | No | No SVHC | ROHS3 Compliant | - | ||
 MCIMX6U6AVM10AC NXP USA Inc. | 8 |
| Datasheet | 15 Weeks | - | - | - | 624-LFBGA | YES | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2017 | i.MX6DL | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.4V | - | - | - | - | - | - | 1GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | - | 1.6mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8360CVVAJDGA NXP USA Inc. | 105 | - | Datasheet | 12 Weeks | - | - | - | 740-LBGA | YES | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | - | 40 | MPC8360 | - | S-PBGA-B740 | - | - | 1.35V | 1.8/2.53.3V | - | 1.15V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | - | 66.67MHz | 32 | - | - | - | - | - | - | 32 | - | - | - | YES | YES | 32 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | 1.69mm | 37.5mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM1705DPTP3 Texas Instruments | 10006 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 2 days ago) | Gold | Surface Mount | 176-LQFP Exposed Pad | - | 176 | - | - | L1 Cache, RAM, ROM | - | - | - | - | 0°C~90°C TJ | Tube | - | Sitara™ | e4 | yes | Active | 4 (72 Hours) | 176 | - | - | - | - | - | QUAD | GULL WING | 260 | 1.3V | 0.5mm | 375MHz | - | AM1705 | - | - | - | 1.2V | - | - | - | - | - | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | 64kB | - | - | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | - | - | 32b | - | - | - | - | ARM | - | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | - | 1 | - | - | - | - | - | - | 1.6mm | - | 24mm | 24mm | 1.4mm | - | - | ROHS3 Compliant | Lead Free | ||
 MPC8358EVRAGDDA NXP USA Inc. | 77 |
| Datasheet | 12 Weeks | - | - | - | 668-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 668 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8358 | - | S-PBGA-B668 | - | - | 1.26V | 1.21.8/2.52.5/3.3V | - | 1.14V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | - | 66.67MHz | 32 | - | - | - | - | - | - | 32 | - | - | - | YES | YES | 32 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | 2.46mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM3352ZCZ60 Texas Instruments | 165 | - | Datasheet | - | - | Copper, Silver, Tin | - | 324-LFBGA | YES | 324 | - | 1.713814g | Cache, RAM, ROM | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 324 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 600MHz | - | AM3352 | 324 | - | - | - | - | - | - | - | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 1.144V | 912mV | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | - | - | 32b | - | - | - | 16 | ARM | - | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | - | - | - | - | - | - | - | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 MPC8247ZQMIBA NXP USA Inc. | 189 | - | Datasheet | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | 57 | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8247 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | - | 1.425V | - | - | - | - | - | - | 266MHz | - | MICROCONTROLLER, RISC | PowerPC G2_LE | - | 66.7MHz | 32 | NO | YES | - | NO | - | - | 30 | - | - | - | - | - | 64 | - | - | - | - | 3.3V | - | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | 27mm | - | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX6D6AVT10AC NXP USA Inc. | 10000 | - | Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.35V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR | ARM® Cortex®-A9 | - | 24MHz | - | - | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX7D2DVK12SC NXP USA Inc. | 40 | - | Datasheet | 18 Weeks | - | - | - | 488-TFBGA | YES | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2012 | i.MX7D | - | - | Active | 3 (168 Hours) | 488 | - | - | - | - | - | BOTTOM | BALL | 260 | 1.225V | 0.4mm | - | 40 | - | - | S-PBGA-B488 | - | - | 1.25V | - | - | 1.2V | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | - | 32 | - | - | - | - | - | - | 26 | - | - | - | YES | YES | 16 | - | FLOATING POINT | YES | - | 1.8V 3.3V | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | - | - | 1.1mm | 12mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8313VRAGDC NXP USA Inc. | 40 | - | - | 8 Weeks | - | - | - | 516-BBGA Exposed Pad | YES | - | - | - | - | - | 105°C | - | - | - | Tray | 2002 | - | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8313 | - | S-PBGA-B516 | Not Qualified | - | 1.05V | 11.8/2.53.3V | OTHER | 0.95V | - | - | - | - | - | - | 400 MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | - | 15 | - | - | - | YES | YES | 32 | - | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | - | - | - | ROHS3 Compliant | - | ||
 AM3703CBPD100 Texas Instruments | 100 |
| Datasheet | - | NRND (Last Updated: 3 days ago) | Copper, Silver, Tin | - | 515-WFBGA, FCBGA | YES | 515 | - | - | ROM | - | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.1V | - | 1GHz | - | AM3703 | 515 | - | - | 1.1V | - | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | - | 32kB | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | - | - | YES | YES | - | - | FLOATING POINT | YES | 65536 | - | 4 | - | - | 1 Core 32-Bit | No | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | LCD | - | - | - | 700μm | - | 12mm | 12mm | 500μm | - | - | ROHS3 Compliant | Lead Free | ||
 T1042NXE7WQB NXP USA Inc. | 2536 |
| Datasheet | 18 Weeks | - | - | - | 780-FBGA, FCBGA | YES | - | - | - | - | - | - | - | - | -40°C~105°C TA | - | 2014 | QorIQ T1 | - | - | Active | 3 (168 Hours) | 780 | 5A002.A.1 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | - | - | S-PBGA-B780 | - | - | 1.03V | - | - | 0.97V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e5500 | - | 133.3MHz | 32 | - | - | - | - | - | - | 16 | - | - | - | YES | YES | 64 | - | FIXED POINT | YES | - | - | - | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | SATA 3Gbps (2) | - | - | 2.07mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
 MVF50NN151CMK50 NXP USA Inc. | 450 | - | Datasheet | 15 Weeks | - | - | - | 364-LFBGA | YES | - | - | - | - | 131 | - | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | - | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | - | 40 | MVF50NN151 | - | S-PBGA-B364 | Not Qualified | - | 1.26V | 3.3V | - | 1.16V | - | - | - | - | - | - | 500MHz | - | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | - | - | 16 | YES | YES | - | NO | YES | - | 16 | - | CORTEX-A5 | - | - | - | 16 | - | - | - | - | 3.3V | - | - | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | - | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | - | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
MPC8313VRAFFB NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 516-BBGA Exposed Pad | - | - | 516-TEPBGA (27x27) | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2008 | MPC83xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8313 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 333MHz | - | - | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC860TZQ50D4 NXP USA Inc. | 4250 | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | - | - | YES | YES | 32 | - | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | Non-RoHS Compliant | - | ||
 MC9328MX21CVK NXP USA Inc. | 45 | - | - | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2006 | i.MX21 | e1 | - | Not For New Designs | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.65mm | - | 40 | MC9328MX21 | - | S-PBGA-B289 | - | - | 1.65V | - | - | 1.45V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR | ARM926EJ-S | - | 32MHz | 32 | - | - | - | - | - | - | 26 | - | - | - | YES | YES | 32 | - | FIXED POINT | YES | - | 1.8V 3.0V | - | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | - | Keypad, LCD | - | - | - | - | 1.49mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6D5EYM10ADR NXP USA Inc. | 1200 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA, FCBGA | - | - | - | - | - | - | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2011 | i.MX6D | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8280CZUUPEA NXP USA Inc. | 198 | - | Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8280 | - | S-PBGA-B480 | - | - | 1.6V | 1.53.3V | - | 1.45V | - | - | - | - | - | - | 450MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | - | 100MHz | 32 | - | - | - | - | - | - | 32 | - | - | - | YES | NO | 64 | - | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | - | Non-RoHS Compliant | - | ||
MPC8250ACZUMHBC NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | MPC8250 | - | S-PBGA-B480 | - | - | 2.2V | - | - | 1.9V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | - | - | 32 | - | - | - | - | - | - | 32 | - | - | - | YES | NO | 64 | - | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | - | Non-RoHS Compliant | - | ||
 AT91SAM9CN12B-CFUR Microchip Technology | 36 | - | Datasheet | 9 Weeks | - | Copper, Silver, Tin | Surface Mount | 247-LFBGA | - | 247 | - | 205.307246mg | L1 Cache, ROM, SRAM | 105 | - | - | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2004 | SAM9CN | e1 | yes | Active | 3 (168 Hours) | 247 | - | TIN SILVER COPPER | - | - | - | BOTTOM | BALL | - | 1V | 0.5mm | 400MHz | - | AT91SAM9CN | - | - | - | - | - | - | - | - | - | 2-Wire, EBI/EMI, I2C, SPI, Serial, UART, USART, USB | 1.1V | 900mV | 128kB | Internal | - | 32kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | 32 | - | - | 32b | - | - | 2 | 26 | ARM | - | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | - | - | - | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | 1 | - | - | LCD, Touchscreen | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - |