- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
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Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Manufacturer Package Identifier | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Data Bus Width | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC852TZT50A NXP USA Inc. | 578 | - | Datasheet | 12 Weeks | - | - | - | 256-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC852 | - | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 66MHz | - | 32 | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | - | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | 2.54mm | 23mm | - | - | Non-RoHS Compliant | - | ||
 P2041NSN7NNC NXP USA Inc. | 2061 | - | Datasheet | 12 Weeks | - | - | - | 780-BBGA, FCBGA | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | - | 245 | - | - | - | 30 | P2041 | - | - | - | - | - | - | - | - | - | - | - | 1.3GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8378CVRAGDA NXP USA Inc. | 23 |
| Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8378 | - | S-PBGA-B689 | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | - | 32 | - | - | 15 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | ROHS3 Compliant | - | ||
 MCIMX6Q4AVT10AD NXP USA Inc. | 48 | - | Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | 7 | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | 1.5V | - | 1.35V | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | 16 | - | YES | - | 64 | - | - | 272K | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | - | Multimedia; NEON™ SIMD | - | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | ROHS3 Compliant | - | ||
 MPC8358ECZQAGDGA NXP USA Inc. | 317 | - | Datasheet | - | - | - | - | 668-BBGA Exposed Pad | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2006 | MPC83xx | e0 | - | Obsolete | 3 (168 Hours) | 668 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8358 | - | S-PBGA-B668 | - | 1.26V | - | 1.14V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | - | 32 | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | - | Communications; QUICC Engine, Security; SEC | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 29mm | - | - | Non-RoHS Compliant | - | ||
 MC68LC302AF16CT NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 100-LQFP | - | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | - | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | - | - | 260 | - | - | - | 40 | MC68LC302 | - | - | - | - | - | - | - | - | - | - | - | 16MHz | - | MICROCONTROLLER, RISC | M68000 | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | - | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 P1024NSE5DFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 561-FBGA | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | 5A002.A.1 | - | 8542.31.00.01 | - | - | 260 | - | - | - | - | P1024 | - | - | - | - | - | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | Security; SEC 3.3 | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC860DTVR50D4 NXP USA Inc. | 2561 |
| Datasheet | - | - | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 50MHz | - | 32 | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | ROHS3 Compliant | - | ||
 MCIMX6DP5EYM1AB NXP USA Inc. | 2727 |
| Datasheet | 15 Weeks | - | - | - | 624-LFBGA, FCBGA | - | - | - | - | - | - | -20°C~105°C TJ | Tray | 2002 | i.MX6DP | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | - | - | - | - | ROHS3 Compliant | - | ||
 TG80960JS25 Intel | 300 |
| Datasheet | - | - | - | Surface Mount | 132-QFP | - | - | - | - | - | - | 0°C~100°C TC | Tray | 2002 | i960 | e1 | - | Obsolete | 4 (72 Hours) | 132 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.635mm | 25MHz | - | - | 132 | S-PQFP-G132 | - | - | 3.33.3/5V | - | 3V | - | - | - | - | - | 1kB | MICROPROCESSOR, RISC | - | - | 185mA | 32 | 25 μs | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 ATSAMA5D27C-D5M-CUR Microchip Technology | 27 |
| Datasheet | 10 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | -40°C~85°C TA | Tray | - | SAMA5D2 | - | - | Active | 3 (168 Hours) | 289 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.8V | 0.8mm | - | - | ATSAMA5D27 | - | S-PBGA-B289 | - | 1.9V | - | 1.7V | - | - | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | - | 16 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 65536 | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | 9 | - | Multimedia; NEON™ MPE | - | - | - | - | - | 16 | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 51 | - | - | 1.2mm | 14mm | - | - | Non-RoHS Compliant | - | ||
 MPC8541EVTALF NXP USA Inc. | 27 | - | Datasheet | - | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8541 | - | R-PBGA-B783 | - | 1.26V | - | 1.14V | - | - | - | - | - | 667MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | - | 32 | - | - | 64 | - | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI | - | - | Security; SEC | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 3.75mm | 29mm | - | - | ROHS3 Compliant | - | ||
 MPC8270ZUQLDA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8270 | - | S-PBGA-B480 | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | 83.33MHz | - | 32 | - | - | 32 | - | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | Non-RoHS Compliant | - | ||
MPC8541EVTAJD NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8541 | - | R-PBGA-B783 | - | 1.26V | - | 1.14V | - | - | - | - | - | 533MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | - | 32 | - | - | 64 | - | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI | - | - | Security; SEC | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 3.75mm | 29mm | - | - | ROHS3 Compliant | - | ||
 MCIMX6S6AVM08ACR NXP USA Inc. | 10000 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA | YES | - | - | - | 14 | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | - | yes | Active | 3 (168 Hours) | 624 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | 1.5V | - | 1.275V | - | - | - | - | - | 800MHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | 16 | - | YES | - | 32 | - | - | 144K | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | - | Multimedia; NEON™ SIMD | - | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | 1.6mm | 21mm | - | - | ROHS3 Compliant | - | ||
P2020NSE2KFC NXP USA Inc. | 50 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2020 | - | S-PBGA-B689 | - | 1.1V | 1.05V | 1V | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | - | 32 | - | - | 32 | - | YES | YES | 16 | FLOATING POINT | YES | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | Security; SEC 3.3 | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 31mm | - | - | ROHS3 Compliant | - | ||
 OMAP3503ECBB Texas Instruments | 500 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | - | Surface Mount | 515-VFBGA, FCBGA | - | 515 | - | L2 Cache, ROM, SRAM | - | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | yes | Active | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | - | OMAP3503 | 515 | - | 1.8V | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | - | - | - | - | 32b | - | ARM | YES | YES | - | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | 15 | Multimedia; NEON™ SIMD | MROM | - | - | NO | SINGLE | - | - | LCD | - | - | 900μm | - | 12mm | 12mm | 610μm | ROHS3 Compliant | Lead Free | ||
 AM1808EZCED4 Texas Instruments | 30 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | AM1808EZCED4 | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | - | AM1808 | - | - | - | - | - | - | - | I2C, SPI, UART, USB | - | - | 64kB | - | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | - | 32b | - | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | - | - | System Control; CP15 | - | 1 | - | - | - | - | - | LCD | - | SATA 3Gbps (1) | 1.3mm | - | 13mm | 13mm | 890μm | ROHS3 Compliant | Lead Free | ||
 MCIMX6QP5EVT2AA NXP USA Inc. | 7 |
| - | 15 Weeks | - | - | - | 624-FBGA, FCBGA | - | - | - | - | - | - | -20°C~105°C TJ | Tray | - | i.MX6QP | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | - | - | - | - | - | - | ||
 MPC8306SCVMABDCA NXP USA Inc. | In Stock | - | - | 10 Weeks | - | - | - | 369-LFBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MPC8306 | - | S-PBGA-B369 | - | 1.05V | 11.83.3V | 0.95V | - | - | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | - | 32 | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | - | - | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | - | - | 1.61mm | 19mm | - | - | ROHS3 Compliant | - |