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Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Weight | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC875VR66 NXP USA Inc. | 4248 | - | Datasheet | 12 Weeks | - | - | - | 256-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC875 | - | S-PBGA-B256 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | - | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | - | - | - | Cryptography | - | - | - | 2.54mm | 23mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8347VVAJFB NXP USA Inc. | 2489 |
| Datasheet | 12 Weeks | - | - | - | 672-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B672 | - | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | PowerPC e300 | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | 1.69mm | 35mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8280VVQLDA NXP USA Inc. | 2057 |
| Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e1 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8280 | - | S-PBGA-B480 | - | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | - | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 64 | FLOATING POINT | YES | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8306SCVMADDCA NXP USA Inc. | In Stock | - | - | 10 Weeks | - | - | - | 369-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MPC8306 | - | S-PBGA-B369 | - | - | 1.05V | 11.83.3V | 0.95V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.61mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 AM1707DZKB3 Texas Instruments | 36 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | Surface Mount | 256-BGA | - | 256 | 2.784008g | L1 Cache, RAM, ROM | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | - | 375MHz | - | AM1707 | - | - | - | 1.2V | - | - | - | - | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | - | - | - | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FIXED POINT | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | 1 | - | - | - | LCD | - | 2.05mm | - | 17mm | 17mm | 1.36mm | - | ROHS3 Compliant | Lead Free | ||
 MPC8313EVRAFF NXP USA Inc. | 3 | - | Datasheet | - | - | - | - | 516-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | e2 | - | Obsolete | 1 (Unlimited) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8313 | - | S-PBGA-B516 | - | - | 1.05V | 11.8/2.53.3V | 0.95V | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | - | - | - | Cryptography | - | - | - | 2.55mm | 27mm | - | - | - | ROHS3 Compliant | - | ||
 LS1088AXE7Q1A NXP USA Inc. | 2200 |
| Datasheet | 18 Weeks | - | - | - | 780-BFBGA, FCBGA | - | - | - | - | - | -40°C~105°C | - | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 250 | - | - | - | 30 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10GbE (2), 1GbE (8) | 8 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC9328MXLVP20 NXP USA Inc. | 100 | - | Datasheet | 26 Weeks | - | - | - | 225-LFBGA | YES | - | - | - | - | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | - | Not For New Designs | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.9V | 0.8mm | - | 40 | MC9328MXL | - | S-PBGA-B225 | - | - | 2V | - | 1.8V | - | - | - | - | - | - | 200MHz | - | MICROPROCESSOR, RISC | ARM920T | - | 16MHz | 32 | - | - | - | - | - | - | 25 | - | YES | YES | 32 | FIXED POINT | YES | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | - | LCD | - | - | 1.6mm | 13mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8272CZQMIBA NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | 57 | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Last Time Buy | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8272 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | 1.425V | - | - | - | - | - | - | 266MHz | - | MICROCONTROLLER, RISC | PowerPC G2_LE | - | 66.7MHz | 32 | NO | YES | - | NO | - | - | 30 | - | - | - | 64 | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 27mm | - | - | - | Non-RoHS Compliant | - | ||
 AT91SAM9260B-CU-999 Microchip Technology | 468 |
| Datasheet | 12 Weeks | - | Copper, Silver, Tin | Surface Mount | 217-LFBGA | - | 217 | - | FLASH, ROM | 96 | -40°C~85°C TA | Tape & Reel (TR) | 2004 | AT91SAM | - | yes | Active | 3 (168 Hours) | 217 | - | - | - | BOTTOM | BALL | - | 1.8V | 0.8mm | 80MHz | - | AT91SAM9260 | - | - | - | 3.3V | - | - | - | - | 2-Wire, CAN, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 32kB | Internal | 210 MHz | 8kB | MICROCONTROLLER, RISC | ARM926EJ-S | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 32 | YES | YES | 32b | YES | NO | 6 | 26 | ARM | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (2) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | - | - | - | 1.4mm | 15mm | - | - | - | ROHS3 Compliant | - | ||
 SPEAR310-2 STMicroelectronics | In Stock | - | Datasheet | - | - | - | Surface Mount | 289-LFBGA | - | 289 | - | - | 102 | -40°C~85°C TC | Tray | - | SPEAr® | e1 | - | Active | 3 (168 Hours) | 289 | 5A002.A.4 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 333MHz | 30 | SPEAR310 | 289 | - | - | 1.2V | - | 1.21.83.3V | - | 3.6V | I2C, Serial, UART, USB | 2.5V | 1.14V | 32kB | - | - | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | - | - | 16b | - | - | 6 | - | ARM | YES | YES | - | FIXED POINT | YES | 3.3V | - | 10/100Mbps (5) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (3) | HDLC, I2C, I2S, IrDA, Microwire, MMC/SDIO, SPI, TDM/E1, UART | Security; C3 | - | - | - | Cryptography | - | - | - | 1.7mm | 15mm | - | - | - | ROHS3 Compliant | Lead Free | ||
 MPC8560CVT667JC NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8560 | - | S-PBGA-B783 | - | - | 1.26V | - | 1.14V | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 166MHz | 32 | - | - | - | - | - | - | 64 | - | YES | YES | 64 | FIXED POINT | YES | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | - | - | - | - | - | - | - | 3.85mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 OMAP3515DCUS Texas Instruments | 20000 | - | Datasheet | - | - | - | Surface Mount | 423-LFBGA, FCBGA | - | 423 | - | L2 Cache, ROM, SRAM | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | - | no | Obsolete | 4 (72 Hours) | 423 | - | - | - | BOTTOM | BALL | - | 1.8V | 0.65mm | 600MHz | - | OMAP3515 | 423 | - | - | - | - | - | - | 1.35V | I2C, MMC, SDIO, UART, USB | 1.89V | 1.71V | - | - | - | 64kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | - | - | - | - | - | 32b | - | - | 12 | - | ARM | YES | YES | - | FLOATING POINT | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | NO | MULTIPLE | - | LCD | - | - | 1.4mm | 16mm | - | - | No | ROHS3 Compliant | Contains Lead | ||
 MCIMX6G2CVK05AA NXP USA Inc. | 360 | - | Datasheet | 10 Weeks | - | - | - | 272-LFBGA | YES | - | - | - | - | -40°C~105°C TJ | Tray | 2012 | i.MX6UL | - | - | Obsolete | 3 (168 Hours) | 272 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.5mm | - | - | - | - | S-PBGA-B272 | - | - | 1.3V | - | 1.15V | - | - | - | - | - | - | 528MHz | - | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | 16 | - | YES | YES | 16 | FIXED POINT | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | - | 1.23mm | 9mm | - | - | - | ROHS3 Compliant | - | ||
 MPC860ENCVR50D4 NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 357-BBGA | YES | - | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | - | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 AM3356BZCZA30 Texas Instruments | 246 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 2 weeks ago) | Copper, Silver, Tin | - | 324-LFBGA | YES | 324 | 1.713814g | L2 Cache, RAM, ROM | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 300MHz | NOT SPECIFIED | AM3356 | - | - | Not Qualified | 1.1V | - | - | - | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FIXED POINT | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | 1.4mm | - | 15mm | 15mm | 900μm | - | ROHS3 Compliant | Lead Free | ||
MC9328MXLVP15 NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 225-LFBGA | YES | - | - | - | - | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | - | Not For New Designs | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | - | 40 | MC9328MXL | - | S-PBGA-B225 | - | - | 1.9V | - | 1.7V | - | - | - | - | - | - | 150MHz | - | MICROPROCESSOR, RISC | ARM920T | - | 16MHz | 32 | - | - | - | - | - | - | 25 | - | YES | YES | 32 | FIXED POINT | YES | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | - | LCD | - | - | 1.6mm | 13mm | - | - | - | ROHS3 Compliant | - | ||
 P2010NXN2KFC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2010 | - | S-PBGA-B689 | - | - | 1.1V | - | 1V | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | - | - | - | - | - | - | - | 16 | - | YES | YES | 64 | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
MPC8260ACZUMIBB NXP USA Inc. | 2739 | - | Datasheet | 12 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | PC8260 | - | S-PBGA-B480 | - | - | 2.2V | - | 1.9V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | - | 66.66MHz | 32 | - | - | - | - | - | - | 32 | - | YES | NO | 64 | FLOATING POINT | YES | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | Non-RoHS Compliant | - | ||
 MC7448HX1000ND NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | - | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1.27mm | - | 40 | MC7448 | - | S-CBGA-B360 | - | - | 1.05V | 1.31.8/2.5V | 0.95V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | PowerPC G4 | - | 1000MHz | 32 | - | - | - | - | - | - | - | - | NO | YES | - | FIXED POINT | NO | 1.5V 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | - | 2.8mm | 25mm | - | - | - | Non-RoHS Compliant | - |