- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
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Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 T2080NXE8TTB NXP USA Inc. | 2728 | - | Datasheet | 18 Weeks | - | 896-BFBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ T2 | - | - | Active | 3 (168 Hours) | 896 | 5A002.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 250 | - | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B896 | - | - | - | - | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | - | 64 | - | - | - | - | - | - | NO | NO | - | FIXED POINT | YES | - | - | - | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | 4 Core 64-Bit | - | DDR3, DDR3L | USB 2.0 + PHY (2) | - | - | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | 2.61mm | 25mm | - | - | ROHS3 Compliant | - | ||
 MPC8280CZUQLDA NXP USA Inc. | 2537 |
| Datasheet | 18 Weeks | - | 480-LBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8280 | S-PBGA-B480 | - | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | - | 32 | - | - | - | - | 32 | - | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | Non-RoHS Compliant | - | ||
 MC7447AVU867NB NXP USA Inc. | 205 | - | Datasheet | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | - | Not For New Designs | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | - | 40 | MC7447 | S-CBGA-B360 | - | 1.35V | - | 1.25V | 867MHz | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | - | - | - | - | 36 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | 2.8mm | 25mm | - | - | ROHS3 Compliant | - | ||
 MVF60NS151CMK40 NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | - | 364-LFBGA | YES | - | 131 | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | - | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | - | 40 | MVF60NS151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 400MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | 16 | YES | YES | NO | YES | 16 | - | - | - | 16 | - | - | - | 3.3V | - | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | FLASH | - | - | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | 17mm | - | - | ROHS3 Compliant | - | ||
 MC8641DVJ1333JE NXP USA Inc. | 31 | - | Datasheet | 12 Weeks | - | 1023-BCBGA, FCCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2001 | MPC86xx | e2 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.05V | 1mm | - | 30 | - | S-CBGA-B1023 | - | 1.1V | - | 1V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e600 | - | 32 | - | - | - | - | 16 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, RapidIO | - | - | - | - | - | - | - | - | 2.77mm | 33mm | - | - | ROHS3 Compliant | - | ||
 MPC8315VRAFDA NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | - | 620-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8315 | S-PBGA-B620 | - | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | - | - | - | - | - | - | - | SATA 3Gbps (2) | 2.46mm | 29mm | - | - | ROHS3 Compliant | - | ||
 MPC8245LZU333D NXP USA Inc. | 170 |
| Datasheet | 12 Weeks | - | 352-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | MPC8245 | S-PBGA-B352 | - | 2.2V | 23.3V | 1.9V | 333MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | 1.65mm | 35mm | - | - | Non-RoHS Compliant | - | ||
 MCIMX503CVM8B NXP USA Inc. | 10000 |
| Datasheet | 15 Weeks | - | 400-LFBGA | YES | - | - | - | Commercial grade | 0°C~70°C TA | Tray | 2008 | i.MX50 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.225V | 0.8mm | - | 40 | MCIMX503 | S-PBGA-B400 | Not Qualified | 1.275V | - | 1.175V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 800MHz | - | - | - | - | - | - | - | YES | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | Boot Security, Cryptography, Secure JTAG | LCD | - | 1.6mm | 17mm | - | - | ROHS3 Compliant | - | ||
 MCIMX6Y1DVM05AB NXP USA Inc. | 266 | - | Datasheet | 18 Weeks | - | 289-LFBGA | - | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | 528MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | - | Multimedia; NEON™ MPE | - | - | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC9328MXSVP10R2 NXP USA Inc. | 10000 | - | Datasheet | 26 Weeks | - | 225-LFBGA | YES | - | - | - | - | 0°C~70°C TA | Tape & Reel (TR) | 1994 | i.MXS | e1 | - | Not For New Designs | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | - | 40 | MC9328MXS | S-PBGA-B225 | - | 1.9V | - | 1.7V | 100MHz | MICROPROCESSOR | ARM920T | 16MHz | 32 | - | - | - | - | 25 | - | YES | YES | 32 | FIXED POINT | NO | - | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, UART | - | - | - | - | - | - | LCD | - | 1.6mm | 13mm | - | - | ROHS3 Compliant | - | ||
 MC68LC302AF25CT NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | 100-LQFP | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | - | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | - | - | 260 | - | - | - | 40 | MC68LC302 | - | - | - | - | - | 25MHz | MICROCONTROLLER, RISC | M68000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC8347EVRAGDB NXP USA Inc. | 1248 |
| Datasheet | 12 Weeks | - | 620-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | S-PBGA-B620 | - | 1.26V | 1.22.53.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | 2.46mm | 29mm | - | - | ROHS3 Compliant | - | ||
 MPC8360VVAJDGA NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | 740-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | - | 40 | MPC8360 | S-PBGA-B740 | - | 1.35V | 1.8/2.53.3V | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine | - | - | - | - | - | - | 1.69mm | 37.5mm | - | - | ROHS3 Compliant | - | ||
MPC8360EVVALFHA NXP USA Inc. | 2684 |
| Datasheet | 12 Weeks | - | 740-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e1 | - | Active | 3 (168 Hours) | 740 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | - | 40 | MPC8360 | S-PBGA-B740 | - | 1.35V | 1.8/2.53.3V | 1.25V | 667MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine, Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | 1.69mm | 37.5mm | - | - | ROHS3 Compliant | - | ||
 AM5K2E04XABDA4 Texas Instruments | 2994 | - | Datasheet | 20 Weeks | ACTIVE (Last Updated: 3 days ago) | 1089-BFBGA, FCBGA | YES | 1089 | - | - | - | -40°C~100°C TC | Tray | - | Sitara™ | e1 | yes | Active | 4 (72 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | - | 1V | 0.8mm | 1.4GHz | - | AM5K2E04 | - | - | 1.05V | - | 0.95V | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | - | - | - | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.35V 1.5V 1.8V 3.3V | 2 | 1GBE (8), 10GBE (2) | 4 Core 32-Bit | No | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | - | Network | - | 4 | - | - | - | - | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | Lead Free | ||
 MCIMX6X3CVO08AB NXP USA Inc. | 205 |
| Datasheet | 15 Weeks | - | 400-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2013 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | S-PBGA-B400 | - | 1.5V | - | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | 15 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | - | Multimedia; NEON™ MPE | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | 1.53mm | 17mm | - | - | ROHS3 Compliant | - | ||
 MPC8272VRPIEA NXP USA Inc. | 11 |
| Datasheet | 8 Weeks | - | 516-BBGA | YES | - | 57 | - | - | 0°C~105°C TA | Tray | 2004 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8272 | S-PBGA-B516 | - | 1.575V | 1.53.3V | 1.425V | 300MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | - | 30 | - | - | - | 64 | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM, Security; SEC | - | - | - | Cryptography, Random Number Generator | - | - | - | 27mm | - | - | ROHS3 Compliant | - | ||
MCIMX353DVM5B NXP USA Inc. | In Stock | - | - | 15 Weeks | - | 400-LFBGA | YES | - | 4 | - | - | -20°C~70°C TA | Tray | 2005 | i.MX35 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX353 | S-PBGA-B400 | Not Qualified | 1.47V | - | 1.33V | 532MHz | MULTIFUNCTION PERIPHERAL | ARM1136JF-S | 24MHz | - | - | - | - | - | - | - | YES | - | - | - | - | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | - | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | - | 1.6mm | 17mm | - | - | ROHS3 Compliant | - | ||
MPC8323EVRAFDCA NXP USA Inc. | 1000 |
| - | 12 Weeks | - | 516-BBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | - | S-PBGA-B516 | - | 1.05V | - | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; QUICC Engine, Security; SEC 2.2 | - | - | - | Cryptography | - | - | 2.55mm | 27mm | - | - | ROHS3 Compliant | - | ||
 MPC8560VT833LC NXP USA Inc. | 535 | - | Datasheet | 12 Weeks | - | 784-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.2V | 1mm | - | - | MPC8560 | S-PBGA-B783 | - | 1.26V | - | 1.14V | 833MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | - | - | - | - | 64 | - | YES | YES | 64 | FIXED POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | I2C, PCI, RapidIO, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | - | - | 3.85mm | 29mm | - | - | ROHS3 Compliant | - |