- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
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Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Peripherals | Clock Frequency | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Number of ADC Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Number of Cores | Number of External Interrupts | Bus Compatibility | Number of I2C Channels | Security Features | Display & Interface Controllers | Number of SPI Channels | Number of DMA Channels | SATA | Number of Ethernet Channels | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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![]() MPC855TZQ66D4 NXP USA Inc. | 4 | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | - | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC855 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
![]() MPC8349CVVAJDB NXP USA Inc. | 30 | - | - | 12 Weeks | - | - | 672-LBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | - | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8349 | - | S-PBGA-B672 | - | - | 1.26V | 1.21.8/2.52.5/3.3V | - | 1.14V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | - | PowerPC e300 | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.69mm | 35mm | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8248CZQTIEA NXP USA Inc. | 19 | - | Datasheet | 12 Weeks | - | - | 516-BBGA | YES | - | - | - | 57 | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Last Time Buy | 3 (168 Hours) | 516 | - | 5A002.A.1 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8248 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | - | 1.425V | - | - | - | - | - | - | 400MHz | - | MICROCONTROLLER, RISC | - | PowerPC G2_LE | - | 66.7MHz | 32 | - | NO | YES | - | NO | - | 30 | - | - | - | - | 64 | - | - | - | - | 3.3V | - | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM, Security; SEC | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | - | 27mm | - | - | - | Non-RoHS Compliant | - | ||
![]() AT91SAM9261-CJ Microchip Technology | In Stock | - | Datasheet | - | - | Surface Mount | 217-LFBGA | - | 217 | 217-LFBGA (15x15) | FLASH, ROM | 96 | Yes | -40°C~85°C TA | Tray | 1997 | AT91SAM | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | 85°C | -40°C | - | - | - | - | - | - | - | 190MHz | - | AT91SAM9261 | - | - | - | 3.3V | - | - | - | - | - | EBI/EMI, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 3V | 32kB | Internal | 190MHz | 160kB | - | - | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | - | 190 μs | - | - | 32b | - | 4 | - | ARM | 240MHz | - | - | - | 96 | - | - | - | 3.0V 3.3V | - | - | - | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | - | - | LCD | - | - | - | - | - | - | 15mm | - | - | - | ROHS3 Compliant | Lead Free | ||
![]() MPC8378EVRANGA NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | - | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8378 | - | S-PBGA-B689 | - | - | 1.05V | 1.051.8/2.52.5/3.3V | - | 0.95V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR | - | PowerPC e300c4s | - | 66.66MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | Security; SEC 3.0 | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8306SCVMACDCA NXP USA Inc. | 10000 | - | - | 10 Weeks | - | - | 369-LFBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 369 | - | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MPC8306 | - | S-PBGA-B369 | - | - | 1.05V | 11.83.3V | - | 0.95V | - | - | - | - | - | - | 200MHz | - | MICROPROCESSOR, RISC | - | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | - | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | - | - | 1.61mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
![]() P1010NSN5HHA NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 425-FBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Obsolete | 3 (168 Hours) | 425 | - | - | Tin/Silver (Sn/Ag) | - | - | - | 8542.31.00.01 | - | - | - | 1V | - | - | - | P1010 | - | - | - | - | - | 1V | - | - | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | - | PowerPC e500v2 | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8275VRMIBA NXP USA Inc. | 2071 |
| Datasheet | 8 Weeks | - | - | 516-BBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | - | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8275 | - | S-PBGA-B516 | - | - | 1.6V | 1.53.3V | - | 1.45V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | - | PowerPC G2_LE | - | 266MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | NO | 64 | - | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6G3CVM05AA NXP USA Inc. | 19 | - | Datasheet | 12 Weeks | - | - | 289-LFBGA | YES | - | - | - | 10 | - | -40°C~105°C TJ | Tray | 2014 | i.MX6UL | - | - | Obsolete | 3 (168 Hours) | 289 | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | S-PBGA-B289 | - | - | 1.3V | - | - | 1.15V | - | - | - | - | - | - | 528MHz | - | MULTIFUNCTION PERIPHERAL | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | 16 | - | - | YES | - | 16 | - | - | - | 128000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | 9 | Multimedia; NEON™ SIMD | - | - | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | - | - | - | - | 1.32mm | 14mm | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8309CVMADDCA NXP USA Inc. | 31 | - | - | 10 Weeks | - | - | 489-LFBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 489 | - | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MPC8309 | - | S-PBGA-B489 | - | - | 1.05V | 1V | - | 0.95V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | - | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, SPI, TDM | - | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | - | - | 1.61mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
![]() AT91SAM9XE512-QU Microchip Technology | In Stock | - | Datasheet | - | - | Surface Mount | 208-BFQFP | - | 208 | 208-PQFP (28x28) | FLASH, ROM | 96 | Yes | -40°C~85°C TA | Tray | 1997 | SAM9XE | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | 85°C | -40°C | - | - | - | - | - | - | - | 180MHz | - | AT91SAM9XE512 | - | - | - | 3.3V | - | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 32kB | Internal | 180MHz | 32kB | - | - | ARM926EJ-S | Brown-out Detect/Reset, POR, PWM, WDT | - | - | - | - | - | 32b | - | 6 | - | ARM | 180MHz | - | - | - | 96 | - | - | - | 1.8V 2.5V 3.3V | 1 | 4 | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | 2 | - | LCD, Touchscreen | 2 | - | - | 1 | 3.6mm | - | 28mm | 28mm | No | No SVHC | ROHS3 Compliant | - | ||
![]() P2020NSE2MHC NXP USA Inc. | 100 | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | - | - | Active | 3 (168 Hours) | 689 | - | - | - | - | - | - | - | BOTTOM | BALL | - | 1.05V | 1mm | - | - | P2020 | - | S-PBGA-B689 | - | - | 1.1V | - | - | 1V | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | - | PowerPC e500v2 | - | 100MHz | - | - | - | - | - | - | - | 32 | - | - | YES | YES | 16 | - | FLOATING POINT | YES | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
![]() XPC8260VVIHBC NXP USA Inc. | 5000 | - | Datasheet | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 480 | - | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | PC8260 | - | S-PBGA-B480 | - | - | 1.9V | - | - | 1.7V | - | - | - | - | - | - | 200MHz | - | MICROPROCESSOR, RISC | - | PowerPC G2 | - | 66.66MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | NO | 64 | - | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6Y1CVM05AA NXP USA Inc. | 10 | - | - | 12 Weeks | - | - | 289-LFBGA | YES | - | - | - | - | - | -40°C~105°C TJ | Tray | 2015 | i.MX6 | e1 | - | Obsolete | 3 (168 Hours) | 289 | - | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | S-PBGA-B289 | - | - | 1.5V | - | - | 1.275V | - | - | - | - | - | - | 528MHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A7 | - | 528MHz | - | - | - | - | - | - | - | 16 | - | - | YES | - | 16 | - | - | - | - | 1.8V 2.8V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 1 | Multimedia; NEON™ MPE | - | - | ETHERNET, I2C, PCI, SPI, UART, USB | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | - | - | 1.32mm | 14mm | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8255AVVMHBB NXP USA Inc. | 2159 |
| Datasheet | 12 Weeks | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 480 | - | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 1.27mm | - | 40 | PC8255 | - | S-PBGA-B480 | - | - | 2.2V | - | - | 1.9V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | - | PowerPC G2 | - | 66.66MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | NO | 64 | - | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
![]() MPC860DECZQ50D4 NXP USA Inc. | 196 | - | Datasheet | - | - | - | 357-BBGA | YES | - | - | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | - | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FIXED POINT | YES | - | 3.3V | - | - | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
![]() AM1806BZCEA3 Texas Instruments | 144 | - | Datasheet | - | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | - | Obsolete | 3 (168 Hours) | 361 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | - | AM1806 | 361 | - | - | 1.2V | - | - | - | - | 1.32V | I2C, SPI, UART, USB | 1.32V | 1.14V | - | - | - | 8kB | MICROPROCESSOR, RISC | - | ARM926EJ-S | - | - | 32 | - | - | - | 32b | - | - | 23 | ARM | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | - | - | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | - | System Control; CP15 | - | - | - | - | - | LCD | - | - | - | - | - | 1.4mm | 16mm | - | - | - | ROHS3 Compliant | Contains Lead | ||
![]() MPC8347CVVAJFB NXP USA Inc. | 2225 |
| Datasheet | 12 Weeks | - | - | 672-LBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | - | Active | 3 (168 Hours) | 672 | - | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B672 | - | - | 1.26V | 1.2V | - | 1.14V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | - | PowerPC e300 | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FLOATING POINT | YES | - | 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.69mm | 35mm | - | - | - | ROHS3 Compliant | - | ||
![]() ATSAMA5D43A-CUR Microchip Technology | In Stock | - | Datasheet | 19 Weeks | Copper, Silver, Tin | Surface Mount | 289-LFBGA | - | 289 | - | L2 Cache, ROM, SRAM | 152 | - | -40°C~85°C TA | Tape & Reel (TR) | 2014 | SAMA5D4 | - | yes | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | 528MHz | - | ATSAMA5D43 | - | - | - | 1.8V | - | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB | 1.98V | 1.62V | 128kB | Internal | - | 128kB | - | - | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | - | - | - | - | - | 32b | - | 3 | - | ARM | - | - | - | - | - | - | - | - | 1.2V 1.8V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | - | Multimedia; NEON™ SIMD | 1 | - | - | - | AES, SHA, TDES, TRNG | LCD, Touchscreen | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() N80C188XL12 Intel | 3 | - | Datasheet | - | - | Surface Mount | PLCC | - | 68 | - | - | - | - | - | Bulk | 1996 | - | e0 | - | Discontinued | - | 68 | SMD/SMT | - | Tin/Lead (Sn/Pb) | 70°C | 0°C | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | - | QUAD | J BEND | - | 5V | 1.27mm | 12MHz | - | - | 68 | - | Not Qualified | 5V | - | 5V | COMMERCIAL | - | 5V | - | 5.5V | 4.5V | - | - | - | - | MICROPROCESSOR | 8 | - | - | - | 16 | 12 μs | - | - | - | - | - | 20 | - | - | NO | YES | 8 | - | FIXED POINT | NO | 0 | - | - | - | - | - | - | - | - | - | - | - | - | 5 | - | - | - | - | - | 2 | - | - | - | - | 24.2316mm | 24.2316mm | - | - | RoHS Compliant | - |