- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
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- Core Processor
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- Number of Cores/Bus Width
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Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Address Bus Width | Core Architecture | On Chip Program ROM Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8260AVVPIBB NXP USA Inc. | 2674 |
| Datasheet | 12 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.5V | 1.27mm | - | 40 | PC8260 | - | S-PBGA-B480 | - | 2.7V | - | 2.4V | - | - | - | - | - | - | 300MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | - | - | - | - | - | - | - | - | 32 | - | - | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8321VRAFDCA NXP USA Inc. | 228 | - | - | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | - | - | S-PBGA-B516 | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC e300c2 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | ROHS3 Compliant | - | ||
MPC8271CVRTIEA NXP USA Inc. | 36 |
| Datasheet | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | 57 | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8271 | - | S-PBGA-B516 | - | 1.575V | 1.53.3V | 1.425V | - | - | - | - | - | - | 400MHz | - | MICROCONTROLLER, RISC | PowerPC G2_LE | - | 66.7MHz | 32 | NO | YES | - | NO | - | 30 | - | - | - | - | 64 | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | 27mm | - | - | - | ROHS3 Compliant | - | ||
 MC68EN360AI33L NXP USA Inc. | 243 | - | Datasheet | - | - | - | - | 240-BFQFP | YES | - | - | 46 | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | - | 40 | MC68EN360 | - | S-PQFP-G240 | - | 5.25V | - | 4.75V | - | - | - | - | - | - | 33MHz | - | MICROCONTROLLER, RISC | CPU32+ | - | 6MHz | 32 | NO | YES | - | NO | - | 32 | - | - | - | - | 32 | - | - | - | 5.0V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | - | 4.15mm | 31.305mm | - | - | - | ROHS3 Compliant | - | ||
 AM3715CBP100 Texas Instruments | 7 |
| Datasheet | - | NRND (Last Updated: 2 weeks ago) | Copper, Silver, Tin | - | 515-WFBGA, FCBGA | YES | 515 | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.1V | - | 1GHz | - | AM3715 | 515 | - | 1.1V | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | - | 32kB | - | 1000 MHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | - | - | 32b | - | - | - | ARM | - | YES | YES | - | FLOATING POINT | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | - | - | LCD | - | 700μm | - | 12mm | 12mm | 500μm | No | ROHS3 Compliant | Lead Free | ||
 MPC8555EPXAPF NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e0 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | - | 30 | MPC8555 | - | S-PBGA-B783 | - | 1.26V | - | 1.14V | - | - | - | - | - | - | 833MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 166MHz | 32 | - | - | - | - | - | 64 | - | - | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | 3.75mm | 29mm | - | - | - | Non-RoHS Compliant | - | ||
 ATSAMA5D42A-CUR Microchip Technology | 47 |
| Datasheet | 19 Weeks | - | Copper, Silver, Tin | - | 361-TFBGA | - | 361 | L2 Cache, ROM, SRAM | 152 | - | -40°C~85°C TA | Tape & Reel (TR) | 2014 | SAMA5D4 | - | yes | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | 528MHz | - | ATSAMA5D42 | - | - | 1.8V | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB | 1.98V | 1.62V | 128kB | Internal | - | 128kB | - | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | - | - | - | - | 32b | - | - | - | ARM | - | - | - | - | - | - | - | 1.2V 1.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | - | 1 | AES, SHA, TDES, TRNG | LCD, Touchscreen | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8377EVRALGA NXP USA Inc. | 466 |
| Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | 66.66MHz | 32 | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | - | - | Cryptography, Random Number Generator | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8360ECVVAJDGA NXP USA Inc. | 317 | - | Datasheet | 12 Weeks | - | - | - | 740-LBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 740 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | - | 40 | MPC8360 | - | S-PBGA-B740 | - | 1.35V | 1.8/2.53.3V | 1.15V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | - | 66.67MHz | 32 | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | 1.69mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 MC9328MX21SCVK NXP USA Inc. | 130 | - | - | 10 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | -40°C~85°C TA | Tray | 2004 | i.MX21 | e1 | - | Not For New Designs | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.65mm | - | 40 | MC9328MX21 | - | S-PBGA-B289 | - | 1.65V | - | 1.45V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR | ARM926EJ-S | - | 32MHz | 32 | - | - | - | - | - | 26 | - | - | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | Keypad, LCD | - | - | 1.49mm | 14mm | - | - | - | ROHS3 Compliant | - | ||
 SVF311R3K2CKU2 NXP USA Inc. | 57 |
| Datasheet | 15 Weeks | - | - | - | 176-LQFP Exposed Pad | YES | - | - | - | - | -40°C~85°C TA | Tray | - | Vybrid, VF3xxR | - | yes | Active | 3 (168 Hours) | 176 | - | - | - | QUAD | GULL WING | 260 | 1.23V | 0.5mm | - | 40 | - | - | S-PQFP-G176 | - | 1.26V | - | 1.16V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | - | - | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | 1.6mm | 24mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8315VRADDA NXP USA Inc. | 40 |
| Datasheet | 10 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8315 | - | S-PBGA-B620 | - | 1.05V | 11.8/2.53.3V | 0.95V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | - | - | - | - | - | SATA 3Gbps (2) | - | 2.46mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9G25-BFU-999 Microchip Technology | 9 | - | Datasheet | 19 Weeks | - | Silver, Tin | Surface Mount | 247-VFBGA | - | 247 | L1 Cache, ROM, SRAM | 105 | 65536 | -40°C~85°C TA | Cut Tape (CT) | 2004 | SAM9G | - | yes | Discontinued | 3 (168 Hours) | 247 | - | - | - | BOTTOM | BALL | - | 1V | 0.5mm | 400MHz | - | AT91SAM9G25 | - | - | - | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, IrDA, LIN, SPI, UART, USART, USB | 1.1V | 900mV | 64kB | Internal | - | 32kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, POR, PWM, WDT | - | 32 | YES | YES | 32b | YES | NO | 26 | ARM | 8 | - | - | - | - | - | - | 1.8V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | No | DDR2, SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | FLASH | 1 | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 LS1024ASE7MLA NXP USA Inc. | 1000 | - | Datasheet | 12 Weeks | - | - | - | 625-BFBGA, FCBGA | YES | - | - | - | - | 0°C~70°C TA | Tray | 2014 | QorIQ® Layerscape | - | yes | Active | 3 (168 Hours) | 625 | - | - | - | BOTTOM | BALL | - | 1.13V | 0.8mm | - | - | LS1024 | - | S-PBGA-B625 | - | 1.164V | - | 1.096V | - | - | - | - | - | - | 1.2GHz | - | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9 | - | 1200MHz | - | - | - | - | - | - | 26 | - | - | YES | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3 | USB 2.0 + PHY (1), USB 3.0 + PHY | - | - | - | - | Secure Boot, TrustZone® | - | SATA 3Gbps (2) | - | 2.67mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
MPC8379VRAJFA NXP USA Inc. | 37 |
| Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8379 | - | S-PBGA-B689 | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | - | 32 | - | - | - | - | - | 15 | - | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | SATA 3Gbps (4) | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 MPC850DSLVR50BU NXP USA Inc. | 15 | - | Datasheet | - | - | - | - | 256-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | 40 | MPC850 | - | S-PBGA-B256 | - | 3.6V | 3.3V | 3V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | 26 | - | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | ROHS3 Compliant | - | ||
MPC8275ZQMIBA NXP USA Inc. | 2355 |
| Datasheet | 8 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8275 | - | S-PBGA-B516 | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | - | 266MHz | 32 | - | - | - | - | - | 32 | - | - | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | Non-RoHS Compliant | - | ||
 P2041NXE7MMC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 780-BBGA, FCBGA | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | - | Active | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | - | 245 | - | - | - | 30 | P2041 | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | SATA 3Gbps (2) | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8540CVT667JC NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 784-BBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2001 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8540 | - | S-PBGA-B783 | - | 1.26V | - | 1.14V | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e500 | - | 166MHz | 32 | - | - | - | - | - | 64 | - | - | YES | YES | 64 | FIXED POINT | YES | - | 2.5V 3.3V | - | 10/100Mbps (1), 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI, RapidIO | - | - | - | - | - | - | - | 3.85mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 ATSAMA5D26C-CN Microchip Technology | 36 |
| Datasheet | 10 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2017 | SAMA5D2 | - | - | Active | 3 (168 Hours) | 289 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.2V | 0.8mm | - | - | ATSAMA5D26 | - | S-PBGA-B289 | - | 1.32V | - | 1.1V | - | - | - | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | 24MHz | - | - | - | - | - | - | 26 | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | - | - | 1.4mm | 14mm | - | - | - | ROHS3 Compliant | - |