- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
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Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Security Features | Display & Interface Controllers | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 FH8066501715938 Intel Corporation | In Stock | - | - | - | - | YES | - | 1170 | - | 2018-07-13 | INTEL CORP | - | - | - | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Active | - | - | - | - | - | - | - | - | - | - | 5A992.C | - | 8542.31.00.01 | BOTTOM | BALL | - | - | compliant | - | - | R-PBGA-B1170 | - | - | - | 2240 MHz | MICROPROCESSOR | - | 64 | - | - | NO | NO | - | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | ||
PPC8323EVRADDC Freescale Semiconductor | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
SAB8086-1-C Intel Corporation | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
SAB8086-1-C Siemens | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
NSC800D-35/883 Texas Instruments | In Stock | - | Datasheet | - | - | NO | - | 40 | 7.0422 MHz | - | NATIONAL SEMICONDUCTOR CORP | - | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | 3A001.A.2.C | - | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | - | R-CDIP-T40 | Not Qualified | - | MILITARY | 3.5 MHz | MICROPROCESSOR | - | 8 | 5.08 mm | 16 | NO | YES | 8 | FIXED POINT | NO | - | - | - | - | - | - | - | - | - | - | - | 15.24 mm | ||
 SPEAR1340-2 STMicroelectronics | 1 | - | Datasheet | - | - | - | - | - | - | - | STMICROELECTRONICS | 3 | - | - | - | - | - | - | - | - | Obsolete | - | Yes | - | - | - | - | - | - | e2 | - | - | TIN SILVER | 8542.31.00.01 | - | - | 260 | - | compliant | 30 | - | - | - | - | - | - | MICROPROCESSOR, RISC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| Tiny WHSL | In Stock | - | Datasheet | - | - | YES | - | 256 | 133 MHz | - | IBM MICROELECTRONICS | - | - | - | PLASTIC/EPOXY | LBGA | LBGA, BGA256,20X20,50 | BGA256,20X20,50 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | Yes | 1.95 V | 1.85 V | 1.9 V | - | - | - | - | - | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.27 mm | unknown | - | 256 | S-PBGA-B256 | Not Qualified | - | - | 500 MHz | MICROPROCESSOR, RISC | - | 32 | 1.666 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | 27 mm | 27 mm | ||
TSC695F-25SASV Atmel Corporation | In Stock | - | Datasheet | - | - | YES | - | 256 | - | - | ATMEL CORP | - | 125 °C | -55 °C | PLASTIC/EPOXY | QFF | QFF, | - | SQUARE | FLATPACK | Transferred | - | - | 5.5 V | 4.5 V | 5 V | - | - | - | e4 | - | 3A001.A.2.C | GOLD | 8542.31.00.01 | QUAD | FLAT | - | 0.508 mm | unknown | - | - | S-PQFP-F256 | - | - | MILITARY | 25 MHz | MICROPROCESSOR, RISC | - | 32 | 3.18 mm | 32 | YES | YES | 32 | FLOATING POINT | NO | - | - | - | - | - | - | - | - | - | - | 37.085 mm | 37.085 mm | ||
TMS8080ANL Texas Instruments | In Stock | - | Datasheet | - | - | NO | - | 40 | - | - | TEXAS INSTRUMENTS INC | - | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | - | R-PDIP-T40 | Not Qualified | - | COMMERCIAL | - | MICROPROCESSOR, RISC | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XPC823VF66B2 Motorola Semiconductor Products | In Stock | - | Datasheet | - | - | YES | - | 256 | - | - | MOTOROLA INC | - | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | unknown | - | - | S-PBGA-B256 | Not Qualified | - | COMMERCIAL | 66 MHz | MICROPROCESSOR, RISC | - | 32 | 1.75 mm | 32 | YES | YES | 32 | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | 17 mm | 17 mm | ||
XPC823VF66B2 Freescale Semiconductor | In Stock | - | - | - | - | YES | - | 256 | - | - | MOTOROLA SEMICONDUCTOR PRODUCTS | - | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | - | - | - | 3.3 V | - | - | - | - | - | - | - | - | BOTTOM | BALL | - | 1 mm | unknown | - | - | S-PBGA-B256 | Not Qualified | 3.3 V | COMMERCIAL | 66 MHz | MICROPROCESSOR, RISC | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
TR80C188XL10 Intel Corporation | In Stock | - | Datasheet | - | - | - | - | - | - | - | INTEL CORP | - | - | - | - | - | , | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
UPD70108C-8 NEC Electronics Group | 23 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 PPC440GR-3JB533C Applied Micro Circuits Corporation | In Stock | - | Datasheet | - | - | YES | - | 456 | 66.66 MHz | - | APPLIED MICRO CIRCUITS CORP | - | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | BGA | Yes | 1.6 V | 1.4 V | 1.5 V | - | - | - | - | - | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | compliant | NOT SPECIFIED | 456 | S-PBGA-B456 | Not Qualified | - | - | 533 MHz | MICROPROCESSOR, RISC | - | 32 | 2.65 mm | 32 | YES | YES | 32 | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | 35 mm | 35 mm | ||
UPD8085AHC NEC Electronics Group | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XC7455CRX933LF Freescale Semiconductor | In Stock | - | Datasheet | - | - | YES | - | 483 | 133 MHz | - | FREESCALE SEMICONDUCTOR INC | - | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | BGA | - | 1.35 V | 1.25 V | 1.3 V | - | - | - | - | - | 3A991 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.27 mm | unknown | - | 483 | S-CBGA-B483 | Not Qualified | - | - | 933 MHz | MICROPROCESSOR, RISC | - | 32 | 3.2 mm | 36 | YES | YES | 64 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | 29 mm | 29 mm | ||
SAA2500 Philips Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 44 | - | - | PHILIPS SEMICONDUCTORS | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP44(UNSPEC) | QFP44(UNSPEC) | - | FLATPACK | Obsolete | - | No | - | - | 5 V | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | - | - | unknown | - | - | - | Not Qualified | - | INDUSTRIAL | - | CONSUMER CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 AM6234ATGGHIALWR Texas Instruments | 15 |
| - | Surface Mount | 425-VFBGA, FCCSPBGA | - | 425-FCCSP (13x13) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | Tape & Reel (TR) | Sitara™ | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | 1.1V, 1.2V, 1.8V, 3.3V | 10/100/1000Mbps (2) | 4 Core, 64-Bit | No | DDR4, LPDDR4 | USB 2.0 (2) | DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART | ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™ | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | LVDS, MIPI/CSI, MIPI-DPI, OLDI | - | - | ||
 MT8395AV/ZA MediaTek | 229 |
| - | Surface Mount | 1046-VFBGA | - | 1046-VFBGA (15x15) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -20°C ~ 65°C (TA) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2GHz, 2.2GHz | - | ARM® Cortex®-A55, ARM® Cortex®-A78 | - | - | - | - | - | - | - | - | 1.2V, 1.8V | MII, RGMII, RMII | 4, 4 Core, 64-Bit | Yes | LPDDR4x | USB 2.0 (2), USB 3.1 (2) | I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART | ARM® Mali-G57MC5 | AES, ARM TZ, Boot Security | MIPI-CSI | - | - | ||
EM78P418ND20J ELAN Microelectronics Corp | In Stock | - | Datasheet | - | - | - | - | - | - | - | ELAN MICROELECTRONICS CORP | - | - | - | - | - | , | - | - | - | Contact Manufacturer | - | Yes | - | - | - | - | - | - | e3 | - | - | TIN | 8542.31.00.01 | - | - | - | - | unknown | - | - | - | - | - | - | - | MICROPROCESSOR | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
