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Embedded - Microprocessors

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10000 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Contact Plating

Mount

Package / Case

Surface Mount

Number of Pins

Memory Types

Number of I/Os

Usage Level

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Time@Peak Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Oscillator Type

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Clock Frequency

Bit Size

Data Bus Width

Number of Timers/Counters

Address Bus Width

Core Architecture

Boundary Scan

Low Power Mode

External Data Bus Width

Format

Integrated Cache

Voltage - I/O

Ethernet

Number of Cores/Bus Width

Graphics Acceleration

RAM Controllers

USB

Additional Interfaces

Co-Processors/DSP

Security Features

Display & Interface Controllers

SATA

Height Seated (Max)

Length

RoHS Status

MCIMX6G0DVM05AB
MCIMX6G0DVM05AB

NXP USA Inc.

680

-

Datasheet

15 Weeks

-

-

289-LFBGA

YES

-

-

-

-

0°C~95°C TJ

Tray

2016

i.MX6UL

-

Active

3 (168 Hours)

289

5A992

-

8542.31.00.01

BOTTOM

BALL

-

-

0.8mm

-

-

-

S-PBGA-B289

-

1.3V

-

1.15V

-

-

-

-

-

528MHz

-

MICROPROCESSOR

ARM® Cortex®-A7

-

-

-

-

-

26

-

YES

YES

16

FIXED POINT

YES

1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V

10/100Mbps (1)

1 Core 32-Bit

No

LPDDR2, DDR3, DDR3L

USB 2.0 + PHY (1)

EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART

Multimedia; NEON™ SIMD

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

LVDS

-

1.32mm

14mm

ROHS3 Compliant

MPC8314ECVRADDA
MPC8314ECVRADDA

NXP USA Inc.

40
Datasheet

10 Weeks

-

-

620-BBGA Exposed Pad

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

Active

3 (168 Hours)

620

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

-

40

MPC8314

S-PBGA-B620

-

1.05V

13.3V

0.95V

-

-

-

-

-

266MHz

-

MICROPROCESSOR

PowerPC e300c3

-

66.67MHz

32

-

-

-

-

YES

YES

-

FLOATING POINT

YES

1.8V 2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

No

DDR, DDR2

USB 2.0 + PHY (1)

DUART, HSSI, I2C, PCI, SPI, TDM

Security; SEC 3.3

Cryptography, Random Number Generator

-

-

2.46mm

29mm

ROHS3 Compliant

MCIMX6DP6AVT1AA
MCIMX6DP6AVT1AA

NXP USA Inc.

16

-

Datasheet

15 Weeks

-

-

624-FBGA, FCBGA

YES

-

-

-

-

-40°C~125°C TJ

Tray

2002

i.MX6DP

-

Active

3 (168 Hours)

624

5A992

-

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

-

0.8mm

-

NOT SPECIFIED

-

S-PBGA-B624

-

1.5V

-

1.35V

-

-

-

-

-

1.0GHz

-

MICROPROCESSOR, RISC

ARM® Cortex®-A9

-

-

32

-

-

26

-

YES

YES

64

FLOATING POINT

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

Yes

LPDDR2, DDR3L, DDR3

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

Multimedia; NEON™ SIMD

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

SATA 3Gbps (1)

2.16mm

21mm

ROHS3 Compliant

MPC8343VRADDB
MPC8343VRADDB

NXP USA Inc.

7
-

12 Weeks

-

-

620-BBGA Exposed Pad

YES

-

-

-

-

0°C~105°C TA

Tray

2002

MPC83xx

e2

Active

3 (168 Hours)

620

3A991.A.2

Tin/Silver (Sn/Ag)

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

-

40

MPC8343

S-PBGA-B620

-

1.26V

1.22.53.3V

1.14V

-

-

-

-

-

266MHz

-

MICROPROCESSOR

PowerPC e300

-

66MHz

32

-

-

32

-

YES

YES

32

FLOATING POINT

YES

1.8V 2.5V 3.3V

10/100/1000Mbps (3)

1 Core 32-Bit

No

DDR, DDR2

USB 2.0 + PHY (2)

DUART, I2C, PCI, SPI

-

-

-

-

2.46mm

29mm

ROHS3 Compliant

MPC850DEZQ80BU
MPC850DEZQ80BU

NXP USA Inc.

300

-

Datasheet

12 Weeks

-

-

256-BBGA

YES

-

-

-

-

0°C~95°C TA

Tray

1997

MPC8xx

e0

Obsolete

3 (168 Hours)

256

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

260

3.3V

1.27mm

-

40

MPC850

S-PBGA-B256

-

3.6V

3.3V

3V

-

-

-

-

-

80MHz

-

MICROPROCESSOR, RISC

-

-

-

32

-

-

26

-

YES

YES

32

FIXED POINT

YES

3.3V

10Mbps (1)

1 Core 32-Bit

No

DRAM

USB 1.x (1)

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Communications; CPM

-

-

-

2.54mm

23mm

Non-RoHS Compliant

MPC8536BVJAULA
MPC8536BVJAULA

NXP USA Inc.

In Stock

-

Datasheet

18 Weeks

-

-

783-BBGA, FCBGA

YES

-

-

-

-

0°C~105°C TA

Tray

2002

MPC85xx

-

Active

3 (168 Hours)

783

3A991.A.2

-

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

-

-

MPC8536

S-PBGA-B783

-

1.05V

-

0.95V

-

-

-

-

-

1.333GHz

-

MICROPROCESSOR

PowerPC e500

-

-

32

-

-

16

-

YES

YES

64

FIXED POINT

YES

1.8V 2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

No

DDR2, DDR3

USB 2.0 (3)

DUART, I2C, MMC/SD, PCI, SPI

-

-

-

SATA 3Gbps (2)

2.76mm

29mm

ROHS3 Compliant

MPC8321ECVRAFDC
MPC8321ECVRAFDC

NXP USA Inc.

In Stock

-

-

-

-

-

516-BBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2004

MPC83xx

e2

Obsolete

3 (168 Hours)

516

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

-

40

MPC8321

S-PBGA-B516

-

1.05V

-

0.95V

-

-

-

-

-

333MHz

-

MICROPROCESSOR, RISC

PowerPC e300c2

-

66.67MHz

32

-

-

-

-

YES

YES

-

FLOATING POINT

YES

1.8V 2.5V 3.3V

10/100Mbps (3)

1 Core 32-Bit

No

DDR, DDR2

USB 2.0 (1)

DUART, I2C, PCI, SPI, TDM, UART

Communications; QUICC Engine, Security; SEC 2.2

Cryptography

-

-

2.55mm

27mm

ROHS3 Compliant

LS1021AXE7KQB
LS1021AXE7KQB

NXP USA Inc.

10000
Datasheet

18 Weeks

-

-

525-FBGA, FCBGA

YES

-

-

-

-

-40°C~105°C

Tray

2002

QorIQ® Layerscape

e1

Active

3 (168 Hours)

525

5A002.A.1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

250

1V

0.8mm

-

30

-

S-PBGA-B525

-

1.03V

-

0.97V

-

-

-

-

-

1.0GHz

-

MICROPROCESSOR CIRCUIT

ARM® Cortex®-A7

-

-

-

-

-

-

-

-

-

-

-

-

-

GbE (3)

2 Core 32-Bit

-

DDR3L, DDR4

USB 3.0 (1) + PHY

-

-

Secure Boot, TrustZone®

2D-ACE

SATA 6Gbps (1)

2.07mm

19mm

ROHS3 Compliant

AT91SAM9X25-CU-999
AT91SAM9X25-CU-999

Microchip Technology

7
-

19 Weeks

Silver, Tin

Surface Mount

217-LFBGA

-

217

ROM

105

-

-40°C~85°C TA

Cut Tape (CT)

2015

SAM9X

-

Discontinued

3 (168 Hours)

217

-

-

8542.31.00.01

BOTTOM

BALL

-

-

0.8mm

400MHz

-

AT91SAM9X25

-

-

-

11.8/3.33.3V

-

CAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SPI, UART, USART, USB

1.1V

900mV

64kB

Internal

-

32kB

MICROPROCESSOR, RISC

ARM926EJ-S

DMA, POR, PWM, WDT

-

32

32b

6

-

ARM

-

-

-

-

-

1.8V 2.5V 3.0V 3.3V

10/100Mbps (2)

1 Core 32-Bit

No

LPDDR, LPDDR2, DDR2, DDR, SDR, SRAM

USB 2.0 (3)

CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART

-

-

-

-

-

-

ROHS3 Compliant

MPC880CVR133
MPC880CVR133

NXP USA Inc.

600

-

Datasheet

12 Weeks

-

-

357-BBGA

YES

-

-

-

-

-40°C~100°C TA

Tray

1999

MPC8xx

e1

Last Time Buy

3 (168 Hours)

357

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

245

1.8V

1.27mm

-

30

MPC880

S-PBGA-B357

-

1.9V

1.83.3V

1.7V

-

-

-

-

-

133MHz

-

MICROPROCESSOR, RISC

-

-

-

32

-

-

32

-

YES

YES

32

FIXED POINT

YES

3.3V

10Mbps (2), 10/100Mbps (2)

1 Core 32-Bit

No

DRAM

USB 2.0 (1)

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

-

-

-

2.52mm

25mm

ROHS3 Compliant

MPC875ZT133
MPC875ZT133

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

-

-

256-BBGA

YES

-

-

-

-

0°C~95°C TA

Tray

1999

MPC8xx

e0

Obsolete

3 (168 Hours)

256

5A002.A.1

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

245

1.8V

1.27mm

-

30

MPC875

S-PBGA-B256

-

1.9V

1.83.3V

1.7V

-

-

-

-

-

133MHz

-

MICROPROCESSOR, RISC

-

-

-

32

-

-

32

-

YES

YES

32

FIXED POINT

YES

3.3V

10Mbps (1), 10/100Mbps (2)

1 Core 32-Bit

No

DRAM

USB 2.0 (1)

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM, Security; SEC

Cryptography

-

-

2.54mm

23mm

Non-RoHS Compliant

MPC8241LVR266D
MPC8241LVR266D

NXP USA Inc.

400

-

Datasheet

12 Weeks

-

-

357-BBGA

YES

-

-

-

-

0°C~105°C TA

Tray

1998

MPC82xx

e1

Obsolete

3 (168 Hours)

357

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

245

1.8V

1.27mm

-

30

MPC8241

S-PBGA-B357

-

1.9V

-

1.7V

-

-

-

-

-

266MHz

-

MICROPROCESSOR, RISC

PowerPC 603e

-

66MHz

32

-

-

32

-

YES

YES

64

FLOATING POINT

YES

3.3V

-

1 Core 32-Bit

No

SDRAM

-

I2C, I2O, PCI, UART

-

-

-

-

2.56mm

25mm

ROHS3 Compliant

MPC8360CVVAGDGA
MPC8360CVVAGDGA

NXP USA Inc.

2624

-

Datasheet

12 Weeks

-

-

740-LBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

Active

3 (168 Hours)

740

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

-

40

MPC8360

S-PBGA-B740

-

1.26V

1.8/2.53.3V

1.14V

-

-

-

-

-

400MHz

-

MICROPROCESSOR, RISC

PowerPC e300

-

66.67MHz

32

-

-

32

-

YES

YES

32

FLOATING POINT

YES

1.8V 2.5V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

No

DDR, DDR2

USB 1.x (1)

DUART, HDLC, I2C, PCI, SPI, UART

Communications; QUICC Engine

-

-

-

1.69mm

37.5mm

ROHS3 Compliant

MCIMX31LCVKN5D
MCIMX31LCVKN5D

NXP USA Inc.

78
-

15 Weeks

-

-

457-LFBGA

YES

-

-

-

Industrial grade

-40°C~85°C TA

Tray

2005

i.MX31

e1

Active

3 (168 Hours)

457

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

-

0.5mm

-

40

MCIMX31

S-PBGA-B457

Not Qualified

1.65V

1.2/1.51.8/3.3V

1.52V

-

-

-

-

-

532MHz

-

MICROPROCESSOR

ARM1136JF-S

-

75MHz

32

-

-

26

-

YES

YES

16

FIXED POINT

YES

1.8V 2.0V 2.5V 2.7V 3.0V

-

1 Core 32-Bit

Yes

DDR

USB 2.0 (3)

1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART

Multimedia; GPU, IPU, MPEG-4, VFP

Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory

Keyboard, Keypad, LCD

-

1.3mm

14mm

ROHS3 Compliant

MPC866PZP133A
MPC866PZP133A

NXP USA Inc.

8750

-

Datasheet

12 Weeks

-

-

357-BBGA

YES

-

-

-

-

0°C~95°C TA

Tray

1999

MPC8xx

e0

Obsolete

3 (168 Hours)

357

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

220

1.8V

1.27mm

-

30

MPC866

S-PBGA-B357

-

1.9V

1.83.3V

1.7V

-

-

-

-

-

133MHz

-

MICROPROCESSOR, RISC

-

-

133MHz

32

-

-

32

-

YES

YES

32

FIXED POINT

YES

3.3V

10Mbps (4), 10/100Mbps (1)

1 Core 32-Bit

No

DRAM

-

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

-

-

-

2.52mm

25mm

Non-RoHS Compliant

MC7457RX1267LC
MC7457RX1267LC

NXP USA Inc.

2749
  • 1:$432.352117
  • 10:$407.879356
  • 100:$384.791845
  • 500:$363.011174
  • View all price
Datasheet

12 Weeks

-

-

483-BCBGA, FCCBGA

YES

-

-

-

-

0°C~105°C TA

Tray

1994

MPC74xx

e0

Obsolete

1 (Unlimited)

483

3A991.A.1

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

245

1.3V

1.27mm

-

30

MC7457

S-CBGA-B483

-

1.35V

-

1.25V

-

-

-

-

-

1.267GHz

-

MICROPROCESSOR, RISC

PowerPC G4

-

167MHz

32

-

-

36

-

YES

YES

64

FLOATING POINT

YES

1.5V 1.8V 2.5V

-

1 Core 32-Bit

No

-

-

-

Multimedia; SIMD

-

-

-

3.2mm

29mm

Non-RoHS Compliant

MC7448HX1700LD
MC7448HX1700LD

NXP USA Inc.

599

-

Datasheet

12 Weeks

-

-

360-BCBGA, FCCBGA

YES

-

-

-

-

0°C~105°C TA

Tray

1994

MPC74xx

e0

Active

1 (Unlimited)

360

3A991.A.1

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

260

1.3V

1.27mm

-

40

MC7448

S-CBGA-B360

-

1.32V

1.31.8/2.5V

1.25V

-

-

-

-

-

1.7GHz

-

MICROPROCESSOR, RISC

PowerPC G4

-

200MHz

32

-

-

36

-

YES

YES

64

FLOATING POINT

YES

1.5V 1.8V 2.5V

-

1 Core 32-Bit

No

-

-

-

Multimedia; SIMD

-

-

-

2.8mm

25mm

Non-RoHS Compliant

MPC8248CZQMIBA
MPC8248CZQMIBA

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

-

-

516-BBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

1994

MPC82xx

e0

Last Time Buy

3 (168 Hours)

516

5A002.A.1

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

245

1.5V

1mm

-

30

MPC8248

S-PBGA-B516

-

1.575V

1.53.3V

1.425V

-

-

-

-

-

266MHz

-

MICROPROCESSOR, RISC

PowerPC G2_LE

-

66.67MHz

32

-

-

32

-

YES

YES

64

FLOATING POINT

YES

3.3V

10/100Mbps (2)

1 Core 32-Bit

No

DRAM, SDRAM

USB 2.0 (1)

I2C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM, Security; SEC

Cryptography, Random Number Generator

-

-

2.55mm

27mm

Non-RoHS Compliant

MPC8541EPXAQF
MPC8541EPXAQF

NXP USA Inc.

20

-

Datasheet

8 Weeks

-

-

783-BBGA, FCBGA

YES

-

-

-

-

0°C~105°C TA

Tray

2002

MPC85xx

e0

Obsolete

3 (168 Hours)

783

5A002.A.1

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

245

1.3V

1mm

-

30

MPC8541

R-PBGA-B783

-

1.35V

-

1.25V

-

-

-

-

-

1.0GHz

-

MICROPROCESSOR, RISC

PowerPC e500

-

166MHz

32

-

-

64

-

YES

YES

64

FLOATING POINT

YES

2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

No

DDR, SDRAM

-

DUART, I2C, PCI

Security; SEC

Cryptography, Random Number Generator

-

-

3.75mm

29mm

Non-RoHS Compliant

MPC8306CVMAFDCA
MPC8306CVMAFDCA

NXP USA Inc.

420
-

10 Weeks

-

-

369-LFBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

Active

3 (168 Hours)

369

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

0.8mm

-

40

MPC8306

S-PBGA-B369

-

-

-

-

-

-

-

-

-

333MHz

-

MICROPROCESSOR, RISC

PowerPC e300c3

-

66.67MHz

32

-

-

-

-

YES

YES

-

FLOATING POINT

YES

1.8V 3.3V

10/100Mbps (3)

1 Core 32-Bit

No

DDR2

USB 2.0 (1)

CAN, DUART, I2C, MMC/SD, SPI, TDM

Communications; QUICC Engine

-

-

-

1.61mm

19mm

ROHS3 Compliant