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Embedded - Microprocessors

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Datasheet

RoHS

Factory Lead Time

Lifecycle Status

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Package / Case

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Published

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Pbfree Code

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Supply Voltage

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Time@Peak Reflow Temperature-Max (s)

Base Part Number

Pin Count

JESD-30 Code

Qualification Status

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Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Oscillator Type

Nominal Supply Current

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Clock Frequency

Bit Size

Has ADC

DMA Channels

Data Bus Width

PWM Channels

Number of Timers/Counters

Address Bus Width

Core Architecture

On Chip Program ROM Width

Boundary Scan

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Integrated Cache

Voltage - I/O

Number of UART Channels

Ethernet

Number of Cores/Bus Width

Graphics Acceleration

RAM Controllers

USB

Additional Interfaces

Number of Serial I/Os

Co-Processors/DSP

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Number of Cores

Bus Compatibility

Barrel Shifter

Internal Bus Architecture

Security Features

Display & Interface Controllers

Number of DMA Channels

SATA

Height

Height Seated (Max)

Length

Width

Thickness

REACH SVHC

RoHS Status

Lead Free

AM5K2E02ABDA25
AM5K2E02ABDA25

Texas Instruments

2736
  • 1:$208.906364
  • 10:$197.081475
  • 100:$185.925920
  • 500:$175.401812
    • View all price
Datasheet

26 Weeks

ACTIVE (Last Updated: 2 days ago)

-

-

1089-BFBGA, FCBGA

YES

1089

-

-

-

-40°C~100°C TC

Tray

-

Sitara™

e1

yes

Active

4 (72 Hours)

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

BOTTOM

BALL

-

1V

0.8mm

1.25GHz

-

AM5K2E02

-

-

-

-

1.05V

-

0.95V

-

Ethernet, I2C, SPI, UART, USB

-

-

-

-

-

-

2MB

MICROPROCESSOR, RISC

ARM® Cortex®-A15

-

-

-

-

-

32b

-

-

-

ARM

-

YES

YES

-

FLOATING POINT

YES

1.35V 1.5V 1.8V 3.3V

-

1GBE (8)

2 Core 32-Bit

No

DDR3, SRAM

USB 3.0 (2)

EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM

-

Network

-

2

-

-

-

-

-

32

-

-

3.55mm

27mm

27mm

2.98mm

-

ROHS3 Compliant

Lead Free

MPC8309CVMAFDCA
MPC8309CVMAFDCA

NXP USA Inc.

32
-

10 Weeks

-

-

-

489-LFBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

-

Active

3 (168 Hours)

489

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

0.8mm

-

40

MPC8309

-

S-PBGA-B489

-

-

1.05V

1V

0.95V

-

-

-

-

-

-

-

333MHz

-

MICROPROCESSOR, RISC

PowerPC e300c3

-

66.67MHz

32

-

-

-

-

-

-

-

-

YES

YES

-

FLOATING POINT

YES

1.8V 3.3V

-

10/100Mbps (3)

1 Core 32-Bit

No

DDR2

USB 2.0 (1)

CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM

-

Communications; QUICC Engine

-

-

-

-

-

-

-

-

-

-

1.61mm

19mm

-

-

-

ROHS3 Compliant

-

MPC8248VRPIEA
MPC8248VRPIEA

NXP USA Inc.

60
Datasheet

12 Weeks

-

-

-

516-BBGA

YES

-

-

-

57

0°C~105°C TA

Tray

1994

MPC82xx

e2

-

Active

3 (168 Hours)

516

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

245

1.5V

1mm

-

30

MPC8248

-

S-PBGA-B516

-

-

1.575V

1.53.3V

1.425V

-

-

-

-

-

-

-

300MHz

-

MICROCONTROLLER, RISC

PowerPC G2_LE

-

66.7MHz

32

NO

YES

-

NO

-

30

-

-

-

-

64

-

-

3.3V

-

10/100Mbps (2)

1 Core 32-Bit

No

DRAM, SDRAM

USB 2.0 (1)

I2C, SCC, SMC, SPI, UART, USART

-

Communications; RISC CPM, Security; SEC

-

-

-

-

-

Cryptography, Random Number Generator

-

-

-

-

-

27mm

-

-

-

ROHS3 Compliant

-

MPC8306CVMABDCA
MPC8306CVMABDCA

NXP USA Inc.

4
-

10 Weeks

-

-

-

369-LFBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

-

Active

3 (168 Hours)

369

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

0.8mm

-

40

MPC8306

-

S-PBGA-B369

-

-

-

-

-

-

-

-

-

-

-

-

133MHz

-

MICROPROCESSOR, RISC

PowerPC e300c3

-

66.67MHz

32

-

-

-

-

-

-

-

-

YES

YES

-

FLOATING POINT

YES

1.8V 3.3V

-

10/100Mbps (3)

1 Core 32-Bit

No

DDR2

USB 2.0 (1)

CAN, DUART, I2C, MMC/SD, SPI, TDM

-

Communications; QUICC Engine

-

-

-

-

-

-

-

-

-

-

1.61mm

19mm

-

-

-

ROHS3 Compliant

-

MPC8321CVRADDCA
MPC8321CVRADDCA

NXP USA Inc.

32
-

12 Weeks

-

-

-

516-BBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

-

Active

3 (168 Hours)

516

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

-

40

-

-

S-PBGA-B516

-

-

1.05V

-

0.95V

-

-

-

-

-

-

-

266MHz

-

MICROPROCESSOR, RISC

PowerPC e300c2

-

66.67MHz

32

-

-

-

-

-

-

-

-

YES

YES

-

FLOATING POINT

YES

1.8V 2.5V 3.3V

-

10/100Mbps (3)

1 Core 32-Bit

No

DDR, DDR2

USB 2.0 (1)

DUART, I2C, PCI, SPI, TDM, UART

-

Communications; QUICC Engine

-

-

-

-

-

-

-

-

-

-

2.55mm

27mm

-

-

-

ROHS3 Compliant

-

MCIMX6U6AVM08AD
MCIMX6U6AVM08AD

NXP USA Inc.

775

-

Datasheet

14 Weeks

-

-

-

624-LFBGA

YES

-

-

-

-

-40°C~125°C TJ

Tray

-

i.MX6DL

-

-

Active

3 (168 Hours)

624

-

-

8542.31.00.01

BOTTOM

BALL

260

-

0.8mm

-

40

-

-

S-PBGA-B624

-

-

1.5V

-

1.275V

-

-

-

-

-

-

-

800MHz

-

MICROPROCESSOR, RISC

ARM® Cortex®-A9

-

-

-

-

-

-

-

-

16

-

-

YES

YES

64

FLOATING POINT

YES

1.8V 2.5V 2.8V 3.3V

-

10/100/1000Mbps (1)

2 Core 32-Bit

Yes

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

-

Multimedia; NEON™ SIMD

-

-

-

-

-

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

-

-

-

1.6mm

21mm

-

-

-

ROHS3 Compliant

-

ATSAMA5D43A-CU
ATSAMA5D43A-CU

Microchip Technology

In Stock

-

Datasheet

19 Weeks

-

Copper, Silver, Tin

Surface Mount

289-LFBGA

-

289

-

L2 Cache, ROM, SRAM

152

-40°C~85°C TA

Tray

2014

SAMA5D4

-

yes

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

528MHz

-

ATSAMA5D43

-

-

-

1.8V

-

-

-

-

2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB

1.98V

1.62V

128kB

Internal

-

-

128kB

-

ARM® Cortex®-A5

DMA, LCD, POR, PWM, WDT

-

-

-

-

32b

-

-

-

ARM

-

-

-

-

-

-

1.2V 1.8V 3.3V

-

10/100Mbps (1)

1 Core 32-Bit

Yes

LPDDR, LPDDR2, DDR2

USB 2.0 (3)

EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART

-

Multimedia; NEON™ SIMD

-

1

-

-

-

AES, SHA, TDES, TRNG

LCD, Touchscreen

-

-

-

-

-

-

-

No SVHC

ROHS3 Compliant

-

MPC8321CVRAFDC
MPC8321CVRAFDC

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

-

516-BBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

-

-

Obsolete

3 (168 Hours)

516

3A991.A.2

-

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

-

-

MPC8321

-

S-PBGA-B516

-

-

1.05V

-

0.95V

-

-

-

-

-

-

-

333MHz

-

MICROPROCESSOR, RISC

PowerPC e300c2

-

66.67MHz

32

-

-

-

-

-

-

-

-

YES

YES

-

FLOATING POINT

YES

1.8V 2.5V 3.3V

-

10/100Mbps (3)

1 Core 32-Bit

No

DDR, DDR2

USB 2.0 (1)

DUART, I2C, PCI, SPI, TDM, UART

-

Communications; QUICC Engine

-

-

-

-

-

-

-

-

-

-

2.55mm

27mm

-

-

-

ROHS3 Compliant

-

MPC8306CVMACDCA
MPC8306CVMACDCA

NXP USA Inc.

32
-

10 Weeks

-

-

-

369-LFBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

-

Active

3 (168 Hours)

369

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

0.8mm

-

40

MPC8306

-

S-PBGA-B369

-

-

-

-

-

-

-

-

-

-

-

-

200MHz

-

MICROPROCESSOR, RISC

PowerPC e300c3

-

66.67MHz

32

-

-

-

-

-

-

-

-

YES

YES

-

FLOATING POINT

YES

1.8V 3.3V

-

10/100Mbps (3)

1 Core 32-Bit

No

DDR2

USB 2.0 (1)

CAN, DUART, I2C, MMC/SD, SPI, TDM

-

Communications; QUICC Engine

-

-

-

-

-

-

-

-

-

-

1.61mm

19mm

-

-

-

ROHS3 Compliant

-

OMAP5910JZZG2
OMAP5910JZZG2

Texas Instruments

In Stock

-

Datasheet

12 Weeks

-

Copper, Silver, Tin

Surface Mount

289-TFBGA

-

289

274.791928mg

FLASH

-

-40°C~85°C TC

Tray

-

OMAP-59xx

e1

-

Active

4 (72 Hours)

289

-

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.6V

0.5mm

150MHz

-

OMAP5910

289

-

-

1.6V

-

-

-

1.675V

I2C, MMC, SDIO, UART, USB

-

-

32kB

-

170mA

-

160kB

DIGITAL SIGNAL PROCESSOR, MIXED

ARM9TDMI

-

-

16

-

-

32b

-

6

25

ARM

16

YES

YES

-

FIXED POINT

YES

1.8V 2.75V 3.3V

-

-

1 Core 32-Bit

No

SDRAM

USB 2.0 (2)

1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART

-

Signal Processing; C55x, System Control; CP15

MROM

-

-

NO

MULTIPLE

-

Keypad, LCD

6

-

-

1.2mm

12mm

-

-

-

ROHS3 Compliant

Lead Free

MPC870CZT133
MPC870CZT133

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

-

-

-

256-BBGA

YES

-

-

-

-

-40°C~100°C TA

Tray

1999

MPC8xx

e0

-

Obsolete

3 (168 Hours)

256

5A992

TIN LEAD

8542.31.00.01

BOTTOM

BALL

245

1.8V

1.27mm

-

30

MPC870

-

S-PBGA-B256

-

-

1.9V

1.83.3V

1.7V

-

-

-

-

-

-

-

133MHz

-

MICROPROCESSOR, RISC

-

-

-

32

-

-

-

-

-

32

-

-

YES

YES

32

FIXED POINT

YES

3.3V

-

10/100Mbps (2)

1 Core 32-Bit

No

DRAM

USB 2.0 (1)

I2C, PCMCIA, SPI, TDM, UART

-

Communications; CPM

-

-

-

-

-

-

-

-

-

-

2.54mm

23mm

-

-

-

Non-RoHS Compliant

-

MCIMX6X3EVO10AB
MCIMX6X3EVO10AB

NXP USA Inc.

143

-

Datasheet

15 Weeks

-

-

-

400-LFBGA

YES

-

-

-

179

-20°C~105°C TJ

Tray

2002

i.MX6SX

e1

-

Active

3 (168 Hours)

400

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

-

-

0.8mm

-

-

-

-

S-PBGA-B400

-

-

1.5V

-

1.35V

-

-

-

-

-

-

-

227MHz, 1GHz

-

MICROPROCESSOR, RISC

ARM® Cortex®-A9, ARM® Cortex®-M4

-

1000MHz

-

-

-

-

-

-

15

-

-

YES

-

32

-

-

1.8V 2.5V 2.8V 3.15V

-

10/100/1000Mbps (2)

2 Core 32-Bit

Yes

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART

6

Multimedia; NEON™ MPE

-

-

CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB

-

-

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Keypad, LCD

-

-

-

1.53mm

17mm

-

-

-

ROHS3 Compliant

-

AM3352BZCEA30R
AM3352BZCEA30R

Texas Instruments

1000

-

Datasheet

8 Weeks

ACTIVE (Last Updated: 1 day ago)

Copper, Silver, Tin

-

298-LFBGA

YES

298

-

ROM

-

-40°C~105°C TJ

Tape & Reel (TR)

-

Sitara™

e1

yes

Active

3 (168 Hours)

298

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

BOTTOM

BALL

260

1.1V

-

300MHz

NOT SPECIFIED

AM3352

-

-

Not Qualified

1.1V

-

-

-

1.144V

CAN, Ethernet, I2C, SPI, UART, USB

-

-

64kB

-

-

-

64kB

MICROPROCESSOR, RISC

ARM® Cortex®-A8

-

-

32

-

-

32b

-

10

-

ARM

-

YES

YES

-

FIXED POINT

YES

1.8V 3.3V

6

10/100/1000Mbps (2)

1 Core 32-Bit

Yes

LPDDR, DDR2, DDR3, DDR3L

USB 2.0 + PHY (2)

CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART

-

Multimedia; NEON™ SIMD

-

1

-

-

-

Cryptography, Random Number Generator

LCD, Touchscreen

-

-

1.3mm

-

13mm

13mm

890μm

-

ROHS3 Compliant

Lead Free

MPC8360ECVVAGDGA
MPC8360ECVVAGDGA

NXP USA Inc.

In Stock

-

Datasheet

12 Weeks

-

-

-

740-LBGA

YES

-

-

-

-

-40°C~105°C TA

Tray

2002

MPC83xx

e2

-

Active

3 (168 Hours)

740

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

-

40

MPC8360

-

S-PBGA-B740

-

-

1.26V

1.8/2.53.3V

1.14V

-

-

-

-

-

-

-

400MHz

-

MICROPROCESSOR, RISC

PowerPC e300

-

66.67MHz

32

-

-

-

-

-

32

-

-

YES

YES

32

FLOATING POINT

YES

1.8V 2.5V 3.3V

-

10/100/1000Mbps (1)

1 Core 32-Bit

No

DDR, DDR2

USB 1.x (1)

DUART, HDLC, I2C, PCI, SPI, UART

-

Communications; QUICC Engine, Security; SEC

-

-

-

-

-

Cryptography, Random Number Generator

-

-

-

-

1.69mm

37.5mm

-

-

-

ROHS3 Compliant

-

AM1808BZWT4
AM1808BZWT4

Texas Instruments

120

-

Datasheet

-

-

Copper, Silver, Tin

Surface Mount

361-LFBGA

-

361

-

-

-

0°C~90°C TJ

Tray

-

Sitara™

e1

-

Obsolete

3 (168 Hours)

361

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

BOTTOM

BALL

260

1.3V

0.8mm

456MHz

-

AM1808

361

-

-

-

-

-

-

1.35V

I2C, SPI, UART, USB

1.35V

950mV

64kB

-

-

-

8kB

MICROPROCESSOR, RISC

ARM926EJ-S

-

-

32

-

-

32b

-

4

-

ARM

-

YES

YES

-

FIXED POINT

YES

1.8V 3.3V

3

10/100Mbps (1)

1 Core 32-Bit

No

LPDDR, DDR2

USB 1.1 + PHY (1), USB 2.0 + PHY (1)

I2C, McASP, McBSP, SPI, MMC/SD, UART

-

System Control; CP15

-

-

-

-

-

-

LCD

-

SATA 3Gbps (1)

1.4mm

-

16mm

16mm

900μm

No SVHC

ROHS3 Compliant

Contains Lead

MC9328MX21SCVM
MC9328MX21SCVM

NXP USA Inc.

10000

-

-

10 Weeks

-

-

-

289-LFBGA

YES

-

-

-

-

-40°C~85°C TA

Tray

2004

i.MX21

e1

-

Not For New Designs

3 (168 Hours)

289

5A002.A.1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.5V

0.8mm

-

40

MC9328MX21

-

S-PBGA-B289

-

-

1.65V

-

1.45V

-

-

-

-

-

-

-

266MHz

-

MICROPROCESSOR

ARM926EJ-S

-

32MHz

32

-

-

-

-

-

26

-

-

YES

YES

32

FIXED POINT

YES

1.8V 3.0V

-

-

1 Core 32-Bit

No

SDRAM

USB 1.x (2)

1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART

-

-

-

-

-

-

-

-

Keypad, LCD

-

-

-

1.5mm

17mm

-

-

-

ROHS3 Compliant

-

P2010NSN2HHC
P2010NSN2HHC

NXP USA Inc.

2550
  • 1:$137.717807
  • 10:$129.922459
  • 100:$122.568358
  • 500:$115.630526
    • View all price
Datasheet

12 Weeks

-

-

-

689-BBGA Exposed Pad

YES

-

-

-

-

0°C~125°C TA

Tray

2002

QorIQ P2

e2

-

Active

3 (168 Hours)

689

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.05V

1mm

-

40

P2010

-

S-PBGA-B689

-

-

1.1V

-

1V

-

-

-

-

-

-

-

1.2GHz

-

MICROPROCESSOR, RISC

PowerPC e500v2

-

100MHz

-

-

-

-

-

-

16

-

-

YES

YES

64

FLOATING POINT

YES

-

-

10/100/1000Mbps (3)

1 Core 32-Bit

No

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I2C, MMC/SD, SPI

-

-

-

-

-

-

-

-

-

-

-

-

2.46mm

31mm

-

-

-

ROHS3 Compliant

-

MPC860SRZQ80D4
MPC860SRZQ80D4

NXP USA Inc.

In Stock

-

Datasheet

26 Weeks

-

-

-

357-BBGA

YES

-

-

-

-

0°C~95°C TA

Tray

2004

MPC8xx

e0

-

Obsolete

3 (168 Hours)

357

3A991

TIN LEAD

8542.31.00.01

BOTTOM

BALL

245

3.3V

1.27mm

-

30

MPC860

-

S-PBGA-B357

-

-

3.465V

3.3V

3.135V

-

-

-

-

-

-

-

80MHz

-

MICROPROCESSOR, RISC

-

-

50MHz

32

-

-

-

-

-

32

-

-

YES

YES

32

FIXED POINT

YES

3.3V

-

10Mbps (4)

1 Core 32-Bit

No

DRAM

-

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

-

Communications; CPM

-

-

-

-

-

-

-

-

-

-

2.52mm

25mm

-

-

-

Non-RoHS Compliant

-

MPC855TCVR50D4
MPC855TCVR50D4

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

-

357-BBGA

YES

-

-

-

-

-40°C~95°C TA

Tray

1997

MPC8xx

e1

-

Not For New Designs

3 (168 Hours)

357

3A991.A.2

TIN SILVER COPPER

8542.31.00.01

BOTTOM

BALL

245

3.3V

1.27mm

-

30

MPC855

-

S-PBGA-B357

-

-

3.465V

3.3V

3.135V

-

-

-

-

-

-

-

50MHz

-

MICROPROCESSOR, RISC

-

-

50MHz

32

-

-

-

-

-

32

-

-

YES

YES

32

FIXED POINT

YES

3.3V

-

10Mbps (1), 10/100Mbps (1)

1 Core 32-Bit

No

DRAM

-

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

-

Communications; CPM

-

-

-

-

-

-

-

-

-

-

2.52mm

25mm

-

-

-

ROHS3 Compliant

-

MPC8343CVRAGDB
MPC8343CVRAGDB

NXP USA Inc.

47
-

12 Weeks

-

-

-

620-BBGA Exposed Pad

YES

-

-

-

-

-40°C~105°C TA

Tray

2010

MPC83xx

e2

-

Active

3 (168 Hours)

620

3A991.A.2

TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

-

40

MPC8343

-

S-PBGA-B620

-

-

1.26V

1.22.53.3V

1.14V

-

-

-

-

-

-

-

400MHz

-

MICROPROCESSOR

PowerPC e300

-

66MHz

32

-

-

-

-

-

32

-

-

YES

YES

32

FLOATING POINT

YES

1.8V 2.5V 3.3V

-

10/100/1000Mbps (3)

1 Core 32-Bit

No

DDR, DDR2

USB 2.0 + PHY (2)

DUART, I2C, PCI, SPI

-

-

-

-

-

-

-

-

-

-

-

-

2.46mm

29mm

-

-

-

ROHS3 Compliant

-

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