- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
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Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Frequency(Max) | Memory Types | Number of I/Os | Operating Temperature (Max.) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Data Bus Width | Halogen Free | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Number of Cores | Number of External Interrupts | Bus Compatibility | Security Features | Display & Interface Controllers | Communication Protocol | SATA | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MIMX8MQ5CVAHZAB NXP USA Inc. | 10 |
| Datasheet | 15 Weeks | - | 621-FBGA, FCBGA | YES | - | - | - | 16 | - | -40°C~105°C TJ | Tray | - | i.MX8MQ | - | - | Active | 3 (168 Hours) | 621 | - | - | - | - | - | - | BOTTOM | BALL | - | 1V | 0.65mm | - | - | - | - | S-PBGA-B621 | - | - | 1.05V | - | - | 0.9V | - | - | - | - | - | 1.3GHz | - | - | ARM® Cortex®-A53 | 40MHz | - | - | - | - | - | - | - | - | YES | - | - | - | - | 160K | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | - | ARM® Cortex®-M4 | - | - | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | - | 2.18mm | 17mm | - | - | ROHS3 Compliant | - | ||
 88AP310-B1-BGK2C806-TN02 Marvell Semiconductor, Inc. | 2520 | - | - | - | - | - | - | 400 | 806MHz | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 85°C | -25°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | I2C, SPI, UART | - | - | - | - | - | - | - | - | - | - | - | 32b | - | - | - | ARM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
 MCIMX6QP7CVT8AB NXP USA Inc. | 15 | - | Datasheet | 15 Weeks | - | 624-FBGA, FCBGA | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6QP | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | - | - | - | ROHS3 Compliant | - | ||
R8A77420HA02BG#UA Renesas Electronics America | 2677 | - | - | 20 Weeks | - | - | - | - | - | - | - | - | - | - | - | - | - | yes | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 831 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | DISPLAY CONTROLLER, CRT CHARACTER OR GRAPHICS DISPLAY | Quad ARM® Cortex®-A7, Quad ARM® Cortex®-A15 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | USB 2.0 (2), USB 3.0 (1) | - | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | - | ROHS3 Compliant | - | ||
 RJ80535LC0051MSL6NC Intel | In Stock | - | Datasheet | - | Through Hole | - | - | 478 | 1.1GHz | - | - | - | - | Bulk | 2004 | - | - | - | Discontinued | - | 479 | - | - | 100°C | 0°C | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 1.27mm | 1.1GHz | - | - | - | S-PBGA-B479 | - | - | - | - | - | - | 1.18V | - | 1.8V | 695mV | - | 1100 MHz | - | MICROPROCESSOR, RISC | - | - | - | 64 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | RoHS Compliant | Contains Lead | ||
MC68360CEM25L Freescale Semiconductor, Inc. (NXP Semiconductors) | In Stock | - | Datasheet | - | - | PQFP | YES | 240 | - | - | - | - | - | Bulk | - | - | e0 | - | - | 3 (168 Hours) | 240 | - | Tin/Lead (Sn/Pb) | 85°C | -40°C | - | - | QUAD | GULL WING | 220 | 5V | 0.5mm | 25MHz | 30 | - | 240 | - | Not Qualified | - | 5.25V | - | INDUSTRIAL | 4.75V | - | - | - | - | - | - | - | SERIAL IO/COMMUNICATION CONTROLLER, LAN | - | - | - | - | - | - | Not Halogen Free | - | 32 | - | YES | YES | 32 | - | - | - | - | - | - | - | - | - | - | - | 4 | - | 1 | - | 68000 | - | - | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | - | - | - | - | - | RoHS Compliant | Contains Lead | ||
| Tiny WHSL | In Stock | - | - | - | Surface Mount, Through Hole | - | - | 638 | 2.1GHz | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.1GHz | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | RoHS Compliant | - | ||
 CM8062101042805SR0LZ Intel | In Stock | - | - | - | Surface Mount | - | - | 2011 | 2.1GHz | DDR3 | - | - | - | - | - | - | e4 | - | - | - | - | 3A001.A.3 | Gold (Au) | 88°C | - | - | - | BOTTOM | NO LEAD | - | - | - | 2.1GHz | - | - | - | - | Not Qualified | - | - | 0.65/1.4V | - | - | - | - | 1.35V | - | 750GB | 2100 MHz | - | MICROPROCESSOR | - | - | 135000mA | 64 | - | 64b | - | - | 16 | - | YES | YES | - | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | 4.923mm | 52.5mm | - | - | RoHS Compliant | - | ||
 N80960SA10 Intel | In Stock | - | Datasheet | - | Surface Mount | LCC | - | - | - | - | - | 85°C | - | Bulk | - | - | e0 | - | - | - | 84 | - | Tin/Lead (Sn/Pb) | - | - | REGISTER SCOREBOARDING; BURST BUS | - | QUAD | J BEND | NOT SPECIFIED | 5V | 1.27mm | 10MHz | NOT SPECIFIED | - | 84 | S-PQCC-J84 | Not Qualified | - | - | 5V | OTHER | - | 5V | - | - | - | - | - | - | MICROPROCESSOR, RISC | - | - | - | 32 | 10 μs | - | - | - | 32 | - | NO | NO | 16 | FIXED POINT | NO | 0 | - | - | - | - | - | - | - | - | - | - | - | 4 | - | - | - | - | - | 4.83mm | 29.3116mm | 29.3116mm | - | Non-RoHS Compliant | - | ||
MC68040FE33 Freescale Semiconductor, Inc. (NXP Semiconductors) | In Stock | - | - | - | - | - | YES | 184 | 33MHz | - | - | - | - | - | - | - | e3 | no | - | 1 (Unlimited) | 184 | 3A991.A.2 | Matte Tin (Sn) | 70°C | 0°C | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.635mm | - | 40 | - | 184 | - | Not Qualified | - | 5.25V | 5V | - | 4.75V | - | - | - | - | - | - | - | MICROPROCESSOR | - | - | - | 32 | - | 32b | - | - | 32 | Coldfire | YES | YES | - | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
 Z8018010FEC Zilog | 7 | - | Datasheet | 24 Weeks | Surface Mount | 80-BQFP | - | 80 | - | - | - | - | -40°C~100°C TA | Tray | 2006 | Z180 | e0 | no | Active | 3 (168 Hours) | 80 | - | Tin/Lead (Sn/Pb) | - | - | - | - | QUAD | GULL WING | 225 | 5V | 0.8mm | 10MHz | 30 | - | 80 | - | - | 5V | - | 5V | - | - | 5V | SCI, UART | - | - | - | - | 64kB | MICROPROCESSOR | Z80180 | - | - | 8 | 10 μs | 8b | - | 2 | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 8-Bit | No | DRAM | - | ASCI, CSIO, UART | - | - | - | - | - | - | - | - | - | 3.1mm | - | - | - | Non-RoHS Compliant | Contains Lead | ||
LF80539JF0282MSL9HS Intel | In Stock | - | Datasheet | - | Through Hole | - | - | 478 | 1.66GHz | - | - | - | - | - | - | - | - | yes | - | - | 478 | - | - | 100°C | 0°C | - | - | PERPENDICULAR | PIN/PEG | - | - | - | 1.66GHz | - | - | 478 | - | - | - | - | 1.11.5V | - | - | - | - | 1.2125V | 825mV | - | - | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | 32b | - | - | - | - | - | - | - | - | - | - | - | 0 | - | - | - | - | - | - | - | - | 2 | - | - | - | - | - | - | - | - | - | No | RoHS Compliant | - | ||
 MC8641DVU1000GE NXP USA Inc. | In Stock | - | Datasheet | - | - | 1023-BCBGA, FCCBGA | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC86xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MC8641 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | PowerPC e600 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, RapidIO | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
| Tiny WHSL | In Stock | - | - | - | Through Hole | - | - | 722 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | - | 3.2GHz | - | - | - | - | - | - | - | - | - | - | - | HDMI, PCI, USB | - | - | - | - | - | - | - | - | - | - | - | 64b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | RoHS Compliant | - | ||
HH80556KJ0414MSLAGC Intel | 4 | - | - | - | Surface Mount | - | - | 771 | - | - | - | - | - | - | - | - | - | - | - | - | 771 | - | - | - | - | - | 8542.31.00.01 | BOTTOM | NO LEAD | - | - | 1.1mm | - | - | - | - | - | Not Qualified | - | - | 1.11.5V | - | - | - | - | 1.35V | - | - | 2000 MHz | - | MICROPROCESSOR, RISC | - | - | 75000mA | 64 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | - | ||
 MPC8264AZUMHBB NXP USA Inc. | In Stock | - | Datasheet | - | - | 480-LBGA Exposed Pad | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8264 | - | - | - | - | - | - | - | - | - | - | - | - | - | 266MHz | - | - | PowerPC G2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
MPC8265AVVPJDC NXP USA Inc. | In Stock | - | Datasheet | - | - | 480-LBGA Exposed Pad | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8265 | - | - | - | - | - | - | - | - | - | - | - | - | - | 300MHz | - | - | PowerPC G2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC8264ACZUMIBB NXP USA Inc. | In Stock | - | Datasheet | - | - | 480-LBGA Exposed Pad | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2004 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8264 | - | - | - | - | - | - | - | - | - | - | - | - | - | 266MHz | - | - | PowerPC G2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 MPC850VR66BU NXP USA Inc. | In Stock | - | Datasheet | - | - | 256-BBGA | - | - | - | - | - | - | 0°C~95°C TA | Tray | 2004 | MPC8xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC850 | - | - | - | - | - | - | - | - | - | - | - | - | - | 66MHz | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC850DEVR50BUR2 NXP USA Inc. | In Stock | - | Datasheet | - | - | 256-BBGA | - | - | - | - | - | - | 0°C~95°C TA | Tape & Reel (TR) | 2004 | MPC8xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC850 | - | - | - | - | - | - | - | - | - | - | - | - | - | 50MHz | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - |