- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
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- Number of Cores/Bus Width
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Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Nominal Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8555ECVTALF NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8555 | - | S-PBGA-B783 | - | - | 1.26V | - | 1.14V | - | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 166MHz | 32 | - | - | - | - | - | - | 64 | - | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; CPM, Security; SEC | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 3.75mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX27MJP4A NXP USA Inc. | 40 |
| Datasheet | 15 Weeks | - | - | 473-LFBGA | YES | - | - | - | - | - | -40°C~85°C TA | Tray | 2004 | i.MX27 | e1 | - | Not For New Designs | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | - | 40 | MCIMX27 | - | S-PBGA-B473 | Not Qualified | - | 1.52V | - | 1.38V | - | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM926EJ-S | - | 26MHz | 32 | - | - | - | - | - | - | 26 | - | YES | YES | 16 | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | - | Security; SAHARAH2 | - | - | - | - | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | - | - | - | 1.54mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 MPC885ZP133 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC885 | - | S-PBGA-B357 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM, Security; SEC | - | - | - | - | Cryptography | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MC7448HX1267ND NXP USA Inc. | 2469 | - | Datasheet | 12 Weeks | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | - | Active | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1.27mm | - | 40 | MC7448 | - | S-CBGA-B360 | - | - | 1.1V | 1.31.8/2.5V | 1V | - | - | - | - | - | - | - | 1.267GHz | - | MICROPROCESSOR, RISC | PowerPC G4 | - | 1267MHz | 32 | - | - | - | - | - | - | - | - | NO | YES | - | FIXED POINT | NO | - | 1.5V 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | - | - | - | 2.8mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 OMAP5912ZZG Texas Instruments | 5 | - | Datasheet | 20 Weeks | - | Surface Mount | 289-TFBGA | - | 289 | - | 274.791928mg | FLASH | - | -40°C~85°C TC | Tray | - | OMAP-59xx | e1 | - | Active | 4 (72 Hours) | 289 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.6V | 0.5mm | 192MHz | - | OMAP5912 | 289 | - | - | 3.3V | - | - | - | 1.65V | I2C, MMC, SDIO, UART, USB | - | - | 24kB | - | 326mA | - | 250kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM926EJ-S | - | - | 16 | - | - | 32b | - | - | 6 | 26 | - | YES | YES | - | FIXED POINT | YES | - | 1.8V 2.75V 3.3V | - | - | 1 Core 32-Bit | No | LPDDR | USB 1.1 (1), USB 1.x (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, UART | - | Signal Processing; C55x, System Control; CP15 | - | - | NO | MULTIPLE | Cryptography, Random Number Generator | Keyboard, LCD | 6 | - | - | 1.2mm | 12mm | - | - | - | ROHS3 Compliant | Lead Free | ||
 MCIMX6X3CVN08AB NXP USA Inc. | 9 |
| Datasheet | 15 Weeks | - | - | 400-LFBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B400 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | - | - | 200MHz, 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | 15 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | 1.53mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
MPC860TZQ80D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | - | 80MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MPC8313CVRAFFB NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 516-BBGA Exposed Pad | - | - | 516-TEPBGA (27x27) | - | - | - | -40°C~105°C TA | Tray | 2006 | MPC83xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8313 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 333MHz | - | - | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 P3041NSE7PNC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 1295-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | - | Active | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | 30 | P3041 | - | S-PBGA-B1295 | - | - | 1.04V | - | 0.96V | - | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | 133MHz | - | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | Security; SEC 4.2 | - | - | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | SATA 3Gbps (2) | - | 3.53mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9XE256B-CU Microchip Technology | 7 | - | Datasheet | 10 Weeks | - | - | 217-LFBGA | YES | 217 | - | - | FLASH | 96 | -40°C~85°C TA | Tray | 1997 | SAM9XE | - | yes | Active | 3 (168 Hours) | 217 | - | - | - | BOTTOM | BALL | - | 1.8V | 0.8mm | 180MHz | - | AT91SAM9XE256 | - | - | - | - | 1.95V | - | 1.65V | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB | - | - | 256kB | Internal | - | - | - | MICROCONTROLLER, RISC | ARM926EJ-S | Brown-out Detect/Reset, POR, PWM, WDT | - | 32 | YES | YES | - | YES | NO | - | - | ARM | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | - | - | LCD, Touchscreen | - | - | - | 1.4mm | 15mm | - | - | - | ROHS3 Compliant | - | ||
MPC8544VJANGA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | - | - | 783-BBGA, FCBGA | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | - | 40 | MPC8544 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | - | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP3530ECBB Texas Instruments | In Stock | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Surface Mount | 515-VFBGA, FCBGA | - | 515 | - | - | L2 Cache, ROM, SRAM | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | yes | Active | 3 (168 Hours) | 515 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | - | 0.4mm | 600MHz | - | OMAP3530 | 515 | - | - | - | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | - | - | - | 32b | - | - | - | - | ARM | - | - | - | - | - | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | 1 | - | - | - | LCD | - | - | 900μm | - | 12mm | 12mm | 610μm | No | ROHS3 Compliant | Lead Free | ||
 P1012NSN2HFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | P1012 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP3515ECUSA Texas Instruments | 886 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Surface Mount | 423-LFBGA, FCBGA | - | 423 | - | - | L2 Cache, ROM, SRAM | - | -40°C~105°C TJ | Tray | - | OMAP-35xx | e1 | - | Active | 4 (72 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | - | OMAP3515 | 423 | - | - | - | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | - | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | - | - | - | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | - | LCD | - | - | 1.4mm | - | 16mm | 16mm | 960μm | No | ROHS3 Compliant | Lead Free | ||
MPC855TVR80D4 NXP USA Inc. | 44 | - | Datasheet | 13 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC855 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | - | 80MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 AM3874CCYE80 Texas Instruments | 36 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | - | 684-BFBGA, FCBGA | YES | 684 | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 4 (72 Hours) | 684 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 1.35V | 0.8mm | 800MHz | NOT SPECIFIED | AM3874 | 684 | - | Not Qualified | - | - | 0.95/1.35V | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | DDR2, DDR3 | USB 2.0 (2) | CAN, I2C, McASP, McBSP, SPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | HDMI, HDVPSS | - | SATA 3Gbps (1) | 3.06mm | - | 23mm | 23mm | 2.5mm | - | ROHS3 Compliant | Lead Free | ||
 MPC870CVR133 NXP USA Inc. | 1500 | - | Datasheet | 12 Weeks | - | - | 256-BBGA | YES | - | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC870 | - | S-PBGA-B256 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | I2C, PCMCIA, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | ROHS3 Compliant | - | ||
P2010NXN2HFC NXP USA Inc. | 2990 |
| Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2010 | - | S-PBGA-B689 | - | - | 1.1V | - | 1V | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | - | - | - | - | - | - | - | 32 | - | YES | YES | 16 | FLOATING POINT | YES | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8321EVRAFDC NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 516-BBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8321 | - | S-PBGA-B516 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC e300c2 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; QUICC Engine, Security; SEC 2.2 | - | - | - | - | Cryptography | - | - | - | - | 2.55mm | 27mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8347VVAGDB NXP USA Inc. | 2898 |
| Datasheet | 12 Weeks | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B672 | - | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300 | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | 1.69mm | 35mm | - | - | - | ROHS3 Compliant | - |