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Embedded - Microprocessors

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Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Lifecycle Status

Mount

Package / Case

Surface Mount

Number of Pins

Supplier Device Package

Brand

Cache Memory

Code Name

CPU Configuration - Max

Data Bus Width (bit)

ECCN (US)

Embedded Options

Factory Pack QuantityFactory Pack Quantity

Family Name

HTS

I2C

I2S

Instruction Set Architecture

Lead Shape

Manufacturer

Maximum Clock Frequency

Maximum Speed (MHz)

Memory Types

Moisture Sensitive

Mounting

Mounting Styles

Multiply Accumulate

Number of CPU Cores

Number of Displays Supported

Number of I/Os

Number of Memory Channels

Operating Temperature (Max.)

Operating Temperature (Min.)

Package Length

Package Width

Part # Aliases

PCB changed

PCIe Configurations

PCIe Revision

Processor Series

RoHS

Standard Package Name

Supplier Package

TDP - Max

Tradename

UART

Usage Level

USART

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Max Operating Temperature

Min Operating Temperature

HTS Code

Subcategory

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Time@Peak Reflow Temperature-Max (s)

Base Part Number

Pin Count

JESD-30 Code

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Clock Frequency

Bit Size

Has ADC

DMA Channels

Family

Data Bus Width

PWM Channels

DAC Channels

Number of Timers/Counters

Address Bus Width

Product Type

Core Architecture

Boundary Scan

Low Power Mode

Format

Integrated Cache

Voltage - I/O

Number of UART Channels

Ethernet

Number of Cores/Bus Width

Graphics Acceleration

RAM Controllers

USB

Additional Interfaces

Max Junction Temperature (Tj)

Co-Processors/DSP

ROM Programmability

Number of Cores

Number of I2C Channels

Barrel Shifter

Internal Bus Architecture

Security Features

Display & Interface Controllers

Number of SPI Channels

SATA

Product

SPI

CAN

Product Category

Device Core

Height

Height Seated (Max)

Length

Width

Thickness

Radiation Hardening

RoHS Status

Lead Free

MPC860DPCVR66D4
MPC860DPCVR66D4

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

357-BBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~95°C TA

Tray

2004

MPC8xx

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

MPC860

-

-

-

-

-

-

-

-

-

-

-

-

66MHz

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

3.3V

-

10Mbps (2), 10/100Mbps (1)

1 Core 32-Bit

No

DRAM

-

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

-

Communications; CPM

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

MC68360VR25VLR2
MC68360VR25VLR2

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

357-BBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~70°C TA

Tape & Reel (TR)

1995

M683xx

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

MC68360

-

-

-

-

-

-

-

-

-

-

-

-

25MHz

-

-

CPU32+

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

3.3V

-

10Mbps (1)

1 Core 32-Bit

No

DRAM

-

SCC, SMC, SPI

-

Communications; CPM

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

MC68360VR25LR2
MC68360VR25LR2

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

357-BBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~70°C TA

Tape & Reel (TR)

1995

M683xx

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

MC68360

-

-

-

-

-

-

-

-

-

-

-

-

25MHz

-

-

CPU32+

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

5.0V

-

10Mbps (1)

1 Core 32-Bit

No

DRAM

-

SCC, SMC, SPI

-

Communications; CPM

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

MC68EN360ZQ25LR2
MC68EN360ZQ25LR2

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

357-BBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~70°C TA

Tape & Reel (TR)

1995

M683xx

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

MC68EN360

-

-

-

-

-

-

-

-

-

-

-

-

25MHz

-

-

CPU32+

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

5.0V

-

10Mbps (1)

1 Core 32-Bit

No

DRAM

-

SCC, SMC, SPI

-

Communications; CPM

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Non-RoHS Compliant

-

XOMAPL137AZKB3
XOMAPL137AZKB3

Texas Instruments

In Stock

-

Datasheet

-

-

Surface Mount

256-BGA

-

256

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~90°C TJ

Tube

-

OMAP-L1x

-

no

Obsolete

3 (168 Hours)

256

-

-

-

-

-

BOTTOM

BALL

-

-

1mm

300MHz

-

OMAPL137

256

-

-

-

-

-

-

1.35V

-

-

-

-

-

-

-

ARM926EJ-S

-

-

-

-

-

32b

-

-

-

-

-

ARM

-

-

-

-

1.8V 3.3V

3

10/100Mbps (1)

1 Core 32-Bit

No

SDRAM

USB 1.1 + PHY (1), USB 2.0 + PHY (1)

HPI, I2C, McASP, MMC/SD, SPI, UART

-

Signal Processing; C674x, System Control; CP15

-

-

-

-

-

-

LCD

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

Contains Lead

ES80C186EC20
ES80C186EC20

Intel

In Stock

-

Datasheet

-

-

Surface Mount

QFP

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Bulk

1996

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

20MHz

-

-

-

-

-

-

-

-

-

5V

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

RoHS Compliant

Lead Free

AV8063801276200S R0VR
AV8063801276200S R0VR

Intel

In Stock

-

-

-

-

-

FCBGA-1023

-

-

-

Intel

2 MB

Ivy Bridge

1 Configuration

64

3A991

Embedded

1

Celeron® Processor 1020E

8542.31.00.01

0

0

RISC

Ball

Intel

2.2 GHz

2200

DDR3-1333/1600, DDR3L-1333/1600

Yes

Surface Mount

SMD/SMT

No

2

3 Display

-

2 Channel

-

-

31

24

922855

1023

1x16/2x8/1x8 + 2x4

Revision 2.0

1020E

Details

BGA

FCBGA

35 W

3rd Gen i7 Core

0

-

0

-

Tray

-

1020E

-

-

Active

-

-

-

-

-

-

Embedded Processors & Controllers

-

-

-

-

-

-

-

-

1023

-

-

-

-

-

-

-

PCIe

-

-

16 GB

-

-

-

-

-

-

-

-

Intel Celeron Dual-Core

64 Bit

-

-

-

-

CPU - Central Processing Units

-

-

-

-

-

-

-

0

-

-

-

0

-

-

-

-

2 Core

-

-

-

-

-

-

-

Mobile Processors

0

0

CPU - Central Processing Units

Celeron

-

-

-

-

-

-

RoHS Compliant

-

R8A77450HA02BG#UA
R8A77450HA02BG#UA

Renesas Electronics America

376

-

-

20 Weeks

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

yes

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

501

-

-

-

-

-

-

-

-

-

-

-

1GHz

-

DISPLAY CONTROLLER, CRT CHARACTER OR GRAPHICS DISPLAY

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

IDT79RV4640-180DU
IDT79RV4640-180DU

Renesas Electronics America Inc.

In Stock

-

Datasheet

-

-

-

128-BQFP

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~85°C TC

Tray

-

-

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

IDT79RV4640

-

-

-

-

-

-

-

-

-

-

-

-

180MHz

-

-

MIPS-I

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

3.3V

-

-

1 Core 64-Bit

No

DRAM

-

-

-

System Control; CP0

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Non-RoHS Compliant

-

OMAP3515DCUS72
OMAP3515DCUS72

Texas Instruments

In Stock

-

Datasheet

-

-

Surface Mount

423-LFBGA, FCBGA

-

423

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

L2 Cache, ROM, SRAM

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~90°C TJ

Tray

-

OMAP-35xx

-

no

Obsolete

4 (72 Hours)

423

-

-

-

-

-

BOTTOM

BALL

-

1.8V

0.65mm

720MHz

-

OMAP3515

423

-

-

1.35V

-

-

-

1.35V

-

-

-

-

-

64kB

DIGITAL SIGNAL PROCESSOR, OTHER

ARM® Cortex®-A8

-

-

-

-

-

32b

-

-

-

-

-

ARM

YES

YES

FLOATING POINT

-

1.8V 3.0V

3

-

1 Core 32-Bit

Yes

LPDDR

USB 1.x (3), USB 2.0 (1)

HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

-

Multimedia; NEON™ SIMD

-

-

-

NO

MULTIPLE

-

LCD

-

-

-

-

-

-

-

-

1.4mm

16mm

-

-

No

ROHS3 Compliant

Contains Lead

IDT79RC32V332-133DH
IDT79RC32V332-133DH

Renesas Electronics America Inc.

In Stock

-

Datasheet

-

-

-

208-BFQFP

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~70°C TA

Tray

-

Interprise™

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

79RC32

-

-

-

-

-

-

-

-

-

-

-

-

133MHz

-

-

MIPS-II

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

3.3V

-

-

1 Core 32-Bit

No

SDRAM

-

PCI, SPI, UART

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Non-RoHS Compliant

-

KMPC8541VTAPF
KMPC8541VTAPF

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

783-BBGA, FCBGA

-

-

783-FCPBGA (29x29)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~105°C TA

Tray

2004

MPC85xx

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

MPC8541

-

-

-

-

-

-

-

-

-

-

-

-

833MHz

-

-

PowerPC e500

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2.5V 3.3V

-

10/100/1000Mbps (2)

1 Core 32-Bit

No

DDR, SDRAM

-

DUART, I2C, PCI

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

MPC8358ECVVADDEA
MPC8358ECVVADDEA

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

740-LBGA

-

-

740-TBGA (37.5x37.5)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~105°C TA

Tray

2006

MPC83xx

-

-

Obsolete

1 (Unlimited)

-

-

-

-

-

-

-

-

-

-

-

-

-

MPC8358

-

-

-

-

-

-

-

-

-

-

-

-

266MHz

-

-

PowerPC e300

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.8V 2.5V 3.3V

-

10/100/1000Mbps (1)

1 Core 32-Bit

No

DDR, DDR2

USB 1.x (1)

DUART, HDLC, I2C, PCI, SPI, UART

-

Communications; QUICC Engine, Security; SEC

-

-

-

-

-

Cryptography, Random Number Generator

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

MC68EC000CAA10
MC68EC000CAA10

NXP USA Inc.

In Stock

-

Datasheet

-

-

-

64-QFP

-

-

64-QFP (14x14)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~85°C TA

Tray

1998

M680x0

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

MC68EC000

-

-

-

-

-

-

-

-

-

-

-

-

10MHz

-

-

EC000

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

5.0V

-

-

1 Core 32-Bit

No

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

HPIXP2350AET883946
HPIXP2350AET883946

Intel

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Non-RoHS Compliant

-

C8051F363
C8051F363

Silicon Labs

24

-

-

-

-

-

-

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

39

-

85°C

-40°C

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

e3

-

-

3 (168 Hours)

48

Matte Tin (Sn)

-

-

8542.31.00.01

-

QUAD

GULL WING

260

3.3V

0.5mm

-

NOT SPECIFIED

-

48

S-PQFP-G48

Not Qualified

-

3.6V

INDUSTRIAL

3V

-

-

-

-

-

100 MHz

-

MICROCONTROLLER

-

25MHz

8

NO

NO

-

-

YES

NO

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

FLASH

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.2mm

7mm

7mm

-

-

Non-RoHS Compliant

-

Z8S18010VEG
Z8S18010VEG

Zilog

7

-

Datasheet

13 Weeks

-

Surface Mount

68-LCC (J-Lead)

-

68

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROMless

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TA

Tube

2000

Z180

e3

yes

Active

3 (168 Hours)

68

MATTE TIN

-

-

-

-

QUAD

J BEND

260

5V

-

10MHz

40

-

68

-

-

5V

-

-

-

5V

SCI

-

-

-

-

-

MICROPROCESSOR

Z8S180

-

8

-

-

-

8b

-

-

2

20

-

Z8

NO

YES

FIXED POINT

NO

5.0V

-

-

1 Core 8-Bit

No

DRAM

-

ASCI, CSIO, UART

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

4.57mm

-

-

-

-

ROHS3 Compliant

Lead Free

DRA726APGABCQ1
DRA726APGABCQ1

Texas Instruments

In Stock

-

Datasheet

-

ACTIVE (Last Updated: 1 week ago)

-

FCBGA

YES

760

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

125

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Automotive grade

-

-

-

-

-

e1

yes

-

3 (168 Hours)

760

Tin/Silver/Copper (Sn/Ag/Cu)

125°C

-40°C

-

-

BOTTOM

BALL

-

1.15V

0.8mm

1.5GHz

-

-

-

-

-

-

-

AUTOMOTIVE

-

-

CAN, Ethernet, I2C, IrDA, PCIe, SPI, UART, USB

3.465V

1.11V

-

1500 MHz

512kB

MICROPROCESSOR, RISC

-

-

-

-

-

-

-

-

-

-

-

-

-

YES

YES

FIXED POINT

NO

-

10

-

-

-

-

-

-

125°C

-

-

-

6

-

-

-

-

4

-

-

-

-

-

-

2.96mm

-

23mm

23mm

2.39mm

-

RoHS Compliant

-

SM712GX04LF04-BA
SM712GX04LF04-BA

Silicon Motion, Inc.

269

-

Datasheet

12 Weeks

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

LS1023ASE7MNLB
LS1023ASE7MNLB

NXP USA Inc.

191
Datasheet

18 Weeks

-

-

621-FBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~105°C

Tray

2014

QorIQ® Layerscape

-

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.2GHz

-

-

ARM® Cortex®-A53

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1GbE (7) or 10GbE (1) & 1GbE (5)

2 Core 64-Bit

-

DDR3L, DDR4

USB 3.0 (2) + PHY

-

-

-

-

-

-

-

-

Secure Boot, TrustZone®

-

-

SATA 6Gbps (1)

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

-

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