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Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Weight | Frequency(Max) | Memory Types | Number of I/Os | Operating Temperature (Max.) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Address Bus Width | Core Architecture | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6S6AVM08AB NXP USA Inc. | 10000 | - | Datasheet | 15 Weeks | - | 624-LFBGA | YES | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.275V | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | - | 64 | - | - | - | - | - | - | 16 | - | - | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | - | - | ROHS3 Compliant | - | ||
 MIMX8MD6CVAHZAB NXP USA Inc. | 99 | - | Datasheet | 15 Weeks | - | 621-FBGA, FCBGA | YES | - | - | - | - | 16 | - | - | - | -40°C~105°C TJ | Tray | - | i.MX8MD | - | - | Active | 3 (168 Hours) | 621 | - | - | - | - | - | - | BOTTOM | BALL | - | 1V | 0.65mm | - | - | - | - | S-PBGA-B621 | - | - | 1.05V | - | - | 0.9V | - | - | - | - | 1.3GHz | - | - | ARM® Cortex®-A53 | 40MHz | - | - | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | 160K | - | - | GbE | 2 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | - | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | 2.18mm | 17mm | - | - | ROHS3 Compliant | - | ||
MIMX8MD6DVAJZAB NXP USA Inc. | 143 | - | Datasheet | 15 Weeks | - | 621-FBGA, FCBGA | - | - | - | - | - | - | - | - | - | 0°C~95°C TJ | Tray | - | i.MX8MD | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE | 2 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | - | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | - | - | - | - | ROHS3 Compliant | - | ||
 P3041NXN7MMC NXP USA Inc. | 208 |
| Datasheet | 12 Weeks | - | 1295-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | 30 | P3041 | - | S-PBGA-B1295 | - | - | 1.05V | - | - | 0.95V | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | 133MHz | - | - | - | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | SATA 3Gbps (2) | 3.53mm | 37.5mm | - | - | ROHS3 Compliant | - | ||
 MIMX8MM6CVTKZAA NXP USA Inc. | 14845 | - | Datasheet | 15 Weeks | - | 486-LFBGA, FCBGA | YES | - | - | - | - | 16 | - | - | - | -40°C~105°C TJ | Tray | - | i.MX8MM | - | - | Active | 3 (168 Hours) | 486 | - | - | - | - | - | - | BOTTOM | BALL | - | 0.95V | 0.5mm | - | - | - | - | S-PBGA-B486 | - | - | 1V | - | - | 0.9V | - | - | - | - | 1.6GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | 288K | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M4 | - | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | MIPI-DSI | - | 1.25mm | 14mm | - | - | - | - | ||
MIMX8MM5DVTLZAA NXP USA Inc. | 30 | - | Datasheet | 15 Weeks | - | 486-LFBGA, FCBGA | - | - | - | - | - | - | - | - | - | 0°C~95°C TJ | Tray | - | i.MX8MM | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M4 | - | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | MIPI-DSI | - | - | - | - | - | - | - | ||
 MCIMX6L3EVN10AB NXP USA Inc. | 154 | - | Datasheet | 15 Weeks | - | 432-TFBGA | YES | - | - | - | - | 162 | - | - | Industrial grade | -40°C~105°C TA | Tray | 2002 | i.MX6SL | e1 | - | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | - | 40 | MCIMX6 | - | S-PBGA-B | Not Qualified | - | 1.5V | - | - | 1.375V | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | - | - | - | - | 16 | - | - | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.1mm | 13mm | - | - | ROHS3 Compliant | - | ||
 LUPXA255A0C400 Intel | 6873 | - | - | - | Surface Mount | BGA | - | - | - | - | - | - | 85°C | - | - | - | Bulk | - | - | e1 | - | - | - | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 250 | 1.3V | 1mm | 400MHz | 40 | - | 256 | - | Not Qualified | - | - | - | OTHER | - | 3.3V | - | - | - | - | - | MICROPROCESSOR | - | - | - | 32 | - | - | - | - | - | - | 26 | - | - | YES | YES | 32 | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2mm | 17mm | 17mm | - | RoHS Compliant | Lead Free | ||
 NG80386SXLP20 Intel | 500 | - | Datasheet | - | Surface Mount | 100-QFP | - | - | - | - | - | - | - | - | - | 0°C~100°C TC | Tray | 1996 | i386 | e0 | - | Obsolete | Not Applicable | 100 | - | Tin/Lead (Sn/Pb) | - | - | - | - | QUAD | GULL WING | - | 5V | 0.635mm | 20MHz | - | - | - | S-PQFP-G100 | - | - | - | 5V | - | - | 5V | - | - | - | - | - | MICROPROCESSOR, RISC | Intel386 SX | - | - | 32 | 20 μs | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 32-Bit | No | - | - | - | Math Engine; Intel387 SX | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
MIMX8MM5CVTKZAA NXP USA Inc. | 104 | - | Datasheet | 15 Weeks | - | 486-LFBGA, FCBGA | YES | - | - | - | - | 16 | - | - | - | -40°C~105°C TJ | Tray | - | i.MX8MM | - | - | Active | 3 (168 Hours) | 486 | - | - | - | - | - | - | BOTTOM | BALL | - | 0.95V | 0.5mm | - | - | - | - | S-PBGA-B486 | - | - | 1V | - | - | 0.9V | - | - | - | - | 1.6GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | 288K | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M4 | - | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | MIPI-DSI | - | 1.25mm | 14mm | - | - | - | - | ||
MIMX8MQ6CVAHZAB NXP USA Inc. | 2 | - | Datasheet | 15 Weeks | - | 621-FBGA, FCBGA | YES | - | - | - | - | 16 | - | - | Industrial grade | -40°C~105°C TJ | Tray | - | i.MX8MQ | - | - | Active | 3 (168 Hours) | 621 | - | - | - | - | - | - | BOTTOM | BALL | - | 1V | 0.65mm | - | - | - | - | S-PBGA-B621 | - | - | 1.05V | - | - | 0.9V | - | - | - | - | 1.3GHz | - | - | ARM® Cortex®-A53 | 40MHz | - | - | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | 160K | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | - | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | 2.18mm | 17mm | - | - | ROHS3 Compliant | - | ||
MIMX8MQ6DVAJZAB NXP USA Inc. | 130 | - | Datasheet | 15 Weeks | - | 621-FBGA, FCBGA | - | - | - | - | - | - | - | - | Commercial grade | 0°C~95°C TJ | Tray | - | i.MX8MQ | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | - | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | - | - | - | - | ROHS3 Compliant | - | ||
MIMX8MM6DVTLZAA NXP USA Inc. | 3010 | - | Datasheet | 15 Weeks | - | 486-LFBGA, FCBGA | - | - | - | - | - | - | - | - | - | 0°C~95°C TJ | Tray | - | i.MX8MM | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M4 | - | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | MIPI-DSI | - | - | - | - | - | - | - | ||
 MPC5200CBV400 NXP USA Inc. | 100 | - | Datasheet | 10 Weeks | - | 272-BBGA | YES | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2003 | MPC52xx | e0 | - | Not For New Designs | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 240 | 1.5V | 1.27mm | - | 30 | PC5200 | - | S-PBGA-B272 | - | - | 1.58V | - | - | 1.42V | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC G2_LE | 35MHz | - | - | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | - | - | - | - | - | - | 2.65mm | 27mm | - | - | Non-RoHS Compliant | - | ||
MC68030RC16C Freescale Semiconductor, Inc. (NXP Semiconductors) | In Stock | - | Datasheet | - | - | - | NO | 128 | 14.084298g | 16MHz | - | - | - | - | - | - | - | - | - | - | - | - | - | 128 | EAR99 | - | 70°C | 0°C | DYNAMIC BUS SIZING;UPTO 9.2 MIPS | - | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 5V | 2.54mm | 166MHz | NOT SPECIFIED | - | 128 | - | Not Qualified | 5V | - | - | COMMERCIAL | - | - | - | - | - | - | - | MICROPROCESSOR | - | - | - | 32 | - | - | - | 32b | - | - | 32 | RISC | - | NO | NO | - | FIXED POINT | YES | - | - | - | - | - | - | - | - | - | - | 1 | - | - | - | - | 4.7mm | 34.545mm | - | - | RoHS Compliant | Contains Lead | ||
CS5536AC-B1 AMD | In Stock | - | - | - | Surface Mount | BGA | - | 208 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | Non-RoHS Compliant | - | ||
 RK80532PC041512SL6PK Intel | 8 | - | Datasheet | - | Through Hole | - | - | 478 | - | 2GHz | - | - | - | - | - | - | - | - | - | - | yes | - | - | 478 | - | - | 69°C | - | - | - | PERPENDICULAR | PIN/PEG | - | 1.5V | - | 2GHz | - | - | 478 | - | - | 1.435V | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | 32b | - | - | - | - | - | - | - | - | - | - | - | - | 0 | - | - | - | - | - | - | - | 1 | - | - | - | - | - | - | - | No | RoHS Compliant | - | ||
 MC68EC040FE40A NXP USA Inc. | In Stock | - | Datasheet | - | - | 184-BCQFP | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M680x0 | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MC68EC040 | - | - | - | - | - | - | - | - | - | - | - | - | 40MHz | - | - | 68040 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 32-Bit | No | - | - | SCI, SPI | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
AW80577SH0513MSLGFC Intel | 1 | - | - | - | Through Hole | - | - | 478 | - | 2.26GHz | - | - | - | - | - | - | - | - | - | - | yes | - | - | 478 | - | - | 105°C | - | - | - | PERPENDICULAR | PIN/PEG | - | 1.2V | - | 2.26GHz | - | - | 478 | - | - | - | - | - | - | - | - | - | 1.3V | 750mV | - | - | MICROPROCESSOR | - | - | 38000mA | 64 | - | - | - | 64b | - | - | 32 | - | - | YES | YES | - | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | 2 | - | - | - | - | - | 35mm | - | No | RoHS Compliant | - | ||
 EZ80190AZ050SC Zilog | In Stock | - | - | - | Surface Mount | 100-LQFP | - | 100 | - | - | ROMless | 32 | - | 0 | - | 0°C~70°C TA | Tray | 2006 | eZ80® Acclaim!® | e0 | no | Obsolete | 3 (168 Hours) | 100 | 3A001.A.3 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 50MHz | 30 | EZ80190 | 100 | - | - | - | - | - | - | - | 3.3V | I2C, IrDA, SPI, UART | 3.6V | 3V | - | 8kB | MICROCONTROLLER | eZ80 | - | - | 8 | 50 μs | NO | YES | 8b | NO | NO | 24 | - | Z80 | - | - | - | - | - | - | - | - | - | 1 Core 8-Bit | No | - | - | I2C, SPI, UART | - | - | - | - | - | - | 1.6mm | 14mm | - | - | Non-RoHS Compliant | Contains Lead |