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- Packaging
- Moisture Sensitivity Level (MSL)
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- Number of Cores/Bus Width
- Operating Temperature
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Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Security Features | Display & Interface Controllers | Number of DMA Channels | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8347VVAGDB NXP USA Inc. | 2898 |
| Datasheet | 12 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B672 | - | 1.26V | 1.2V | 1.14V | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300 | 66MHz | - | 32 | - | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | 1.69mm | 35mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8306SCVMAFDCA NXP USA Inc. | In Stock | - | - | 10 Weeks | - | - | - | 369-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MPC8306 | - | S-PBGA-B369 | - | 1.05V | 11.83.3V | 0.95V | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | - | 32 | - | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | - | - | - | - | - | 1.61mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 SPEAR600-2 STMicroelectronics | 7 | - | Datasheet | - | - | - | Surface Mount | 420-FBGA | - | 420 | - | - | 24 | -40°C~85°C TC | Tray | - | SPEAr® | e2 | - | Active | 3 (168 Hours) | 420 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 333MHz | - | SPEAR600 | 420 | - | 3.3V | - | - | - | 3.6V | Ethernet, I2C, IrDA, SPI, UART, USB | 16kB | 30 MHz | 8kB | MICROCONTROLLER, RISC | ARM926EJ-S | - | - | 32 | - | YES | YES | 32b | NO | NO | 10 | - | ARM | - | - | - | - | - | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (3) | I2C, I2S, IrDA, Microwire, SPI, UART | - | FLASH | - | - | LCD, Touchscreen | - | 2.06mm | 23mm | - | - | - | ROHS3 Compliant | Lead Free | ||
 MPC8260AZUPIBB NXP USA Inc. | 2938 |
| Datasheet | 12 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | PC8260 | - | S-PBGA-B480 | - | 2.2V | - | 1.9V | - | - | - | 300MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | - | 32 | - | - | - | - | - | - | - | 32 | - | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | Non-RoHS Compliant | - | ||
 MC68EN360VR33L NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 357-BBGA | YES | - | - | - | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | - | 40 | MC68EN360 | - | S-PBGA-B357 | - | 5.25V | - | 4.75V | - | - | - | 33MHz | - | MICROCONTROLLER, RISC | CPU32+ | 6MHz | - | 32 | - | NO | YES | - | NO | - | - | 32 | - | - | - | 32 | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | 1.86mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
MPC860PVR80D4 NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | - | - | - | 80MHz | - | MICROPROCESSOR, RISC | - | 50MHz | - | 32 | - | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
MPC860SRCVR66D4 NXP USA Inc. | 16 | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | - | 3.135V | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | 50MHz | - | 32 | - | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8308VMAGD NXP USA Inc. | In Stock | - | - | - | - | - | - | 473-LFBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | - | - | - | 40 | MPC8308 | - | S-PBGA-B473 | - | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC9328MXLCVM15 NXP USA Inc. | 160 | - | Datasheet | - | - | - | - | 256-LFBGA | - | - | - | - | - | -40°C~85°C TA | Tray | 1994 | i.MXL | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC9328MXL | - | - | - | - | - | - | - | - | - | 150MHz | - | - | ARM920T | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | LCD | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC7448VU1250ND NXP USA Inc. | 10086 | - | Datasheet | 12 Weeks | - | - | - | 360-CBGA, FCCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | - | Active | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | - | 260 | 1.1V | 1.27mm | - | 40 | MC7448 | - | S-CBGA-N360 | - | 1.15V | 1.31.8/2.5V | 1.05V | - | - | - | 1.25GHz | - | MICROPROCESSOR, RISC | PowerPC G4 | 1250MHz | - | 32 | - | - | - | - | - | - | - | - | - | NO | YES | - | FIXED POINT | NO | 1.5V 1.8V 2.5V | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | - | 2.8mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 MC9328MXLDVP15 NXP USA Inc. | 1162 |
| Datasheet | 26 Weeks | - | - | - | 225-LFBGA | - | - | 225-MAPBGA (13x13) | - | - | -30°C~70°C TA | Tray | 1994 | i.MXL | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC9328MXL | - | - | - | - | - | - | - | - | - | 150MHz | - | - | ARM920T | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.0V | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | LCD | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8358ECVRAGDGA NXP USA Inc. | 215 |
| Datasheet | 12 Weeks | - | - | - | 668-BBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 668 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8358 | - | S-PBGA-B668 | - | 1.26V | - | 1.14V | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | - | 32 | - | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | 2.46mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6S7CVM08AB NXP USA Inc. | 10000 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6S | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | 1.5V | - | 1.275V | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | - | - | - | - | - | 26 | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 MPC7410THX500LE NXP USA Inc. | 2 | - | Datasheet | - | - | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC74xx | - | - | Obsolete | 1 (Unlimited) | - | 3A991.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.8V | - | - | - | MPC7410 | - | R-PBGA-B | - | 1.9V | - | 1.7V | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | PowerPC G4 | - | - | - | - | - | - | - | - | - | - | - | - | NO | NO | - | FIXED POINT | NO | 1.8V 2.5V 3.3V | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
MPC8250AZUMHBC NXP USA Inc. | 125 | - | Datasheet | - | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | MPC8250 | - | S-PBGA-B480 | - | 2.2V | - | 1.9V | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | - | - | 32 | - | - | - | - | - | - | - | 32 | - | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | Non-RoHS Compliant | - | ||
 AM5K2E02ABDA4 Texas Instruments | In Stock | - | Datasheet | 26 Weeks | ACTIVE (Last Updated: 3 days ago) | - | - | 1089-BFBGA, FCBGA | YES | 1089 | - | - | - | -40°C~100°C TC | Tray | - | Sitara™ | e1 | yes | Active | 4 (72 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1V | 0.8mm | 1.4GHz | - | AM5K2E02 | - | - | - | 1.05V | - | 0.95V | - | - | - | 1400 MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | - | - | - | - | - | - | - | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | 1.35V 1.5V 1.8V 3.3V | 1GBE (8) | 2 Core 32-Bit | No | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | - | 2 | - | - | 32 | 3.55mm | 27mm | 27mm | 2.98mm | - | ROHS3 Compliant | Lead Free | ||
 SB80L188EC13 Intel | 282 | - | Datasheet | - | - | - | Surface Mount | 100-BFQFP | - | 100 | - | - | - | 0°C~70°C TA | Tray | 1996 | i186 | e0 | - | Obsolete | 3 (168 Hours) | 100 | - | Tin/Lead (Sn/Pb) | - | QUAD | GULL WING | - | 3V | 0.5mm | 13MHz | - | - | 100 | - | - | - | 3/5V | - | 3V | - | - | - | - | MICROPROCESSOR | 80C186 | - | 36mA | 16 | 13 μs | - | - | - | - | - | - | 20 | - | NO | YES | 8 | FIXED POINT | NO | 3.0V | - | 1 Core 16-Bit | No | DRAM | - | Serial Communications Unit (SCU) | - | - | - | - | - | - | 1.66mm | 14mm | - | - | - | Non-RoHS Compliant | - | ||
 MC68340AG25E NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | - | 144-LQFP | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | - | - | - | - | - | 25MHz | - | - | CPU32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC852TCZT100A NXP USA Inc. | 29 | - | Datasheet | 12 Weeks | - | - | - | 256-BBGA | YES | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC852 | - | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | - | - | - | 100MHz | - | MICROPROCESSOR, RISC | - | 66MHz | - | 32 | - | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | - | - | - | - | - | 2.54mm | 23mm | - | - | - | Non-RoHS Compliant | - | ||
 AM3352ZCE27 Texas Instruments | 600 | - | Datasheet | - | - | Copper, Silver, Tin | - | 298-LFBGA | YES | 298 | - | Cache, RAM, ROM | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 298 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 275MHz | - | AM3352 | 298 | - | 1.1V | - | - | - | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | - | - | - | 32b | - | - | - | 28 | ARM | YES | YES | - | FIXED POINT | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | - | - | - | - | - | No | ROHS3 Compliant | Lead Free |