- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
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- Number of Cores/Bus Width
- Operating Temperature
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Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8555PXAPF NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e0 | - | Obsolete | 3 (168 Hours) | 783 | 5A992 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | - | 30 | MPC8555 | - | S-PBGA-B783 | - | - | 1.26V | - | 1.14V | - | - | - | 833MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | - | - | 64 | - | - | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | - | 3.75mm | 29mm | - | - | - | Non-RoHS Compliant | - | ||
 MPC8347VRADDB NXP USA Inc. | 7 |
| Datasheet | 12 Weeks | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B620 | - | - | 1.26V | 1.2V | 1.14V | - | - | - | 266MHz | - | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | 2.46mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 MPC855TZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC855 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | - | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 LS2088AXE7V1B NXP USA Inc. | 2370 |
| - | 18 Weeks | - | - | 1292-BFBGA, FCBGA | - | - | - | - | - | -40°C~105°C | - | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.0GHz | - | - | ARM® Cortex®-A72 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 8 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | - | - | - | SATA 6Gbps (2) | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6U8DVM10AB NXP USA Inc. | 126 |
| Datasheet | 15 Weeks | - | - | 624-LFBGA | YES | - | - | - | - | 0°C~95°C TJ | Tray | 2002 | i.MX6DL | - | - | Not For New Designs | 3 (168 Hours) | 624 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | 26 | - | - | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.6mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8572ELVTAVNE NXP USA Inc. | In Stock | - | Datasheet | 26 Weeks | - | - | 1023-BFBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2008 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | - | 5A002 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.1V | 1mm | - | - | MPC8572 | - | S-PBGA-B1023 | - | - | 1.155V | - | 1.045V | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | - | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | 3.38mm | 33mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6X1EVO10AB NXP USA Inc. | 5 | - | Datasheet | 15 Weeks | - | - | 400-LFBGA | YES | - | - | 179 | Commercial grade | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | - | - | Active | 3 (168 Hours) | 400 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | S-PBGA-B400 | - | - | 1.5V | - | 1.35V | - | - | - | 227MHz, 1GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1000MHz | - | - | - | 15 | - | - | YES | - | 32 | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | 1.53mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6Y0DVM05AB NXP USA Inc. | 5313 | - | Datasheet | 12 Weeks | - | - | 289-LFBGA | - | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | 528MHz | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (1) | I2C, SPI, UART | - | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX6S6AVM10AD NXP USA Inc. | 3000 | - | - | 14 Weeks | - | - | 624-LFBGA | YES | - | - | - | - | -40°C~125°C TJ | Tray | - | i.MX6S | e1 | - | Active | 3 (168 Hours) | 624 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.4V | - | - | - | 1GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | 16 | - | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.6mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6Q5EYM10ACR NXP USA Inc. | 32 |
| Datasheet | 15 Weeks | - | - | 624-LFBGA, FCBGA | YES | - | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6Q | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | 1.0GHz | - | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | 16 | - | - | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | 1.6mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6X1CVK08AB NXP USA Inc. | 51 |
| Datasheet | 15 Weeks | - | - | 400-LFBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B400 | - | - | 1.5V | - | 1.275V | - | - | - | 200MHz, 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | 15 | - | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | - | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | 1.3mm | 14mm | - | - | - | ROHS3 Compliant | - | ||
 Z8S18020VSG Zilog | 27 |
| - | 13 Weeks | - | Surface Mount | 68-LCC (J-Lead) | - | 68 | ROMless | - | - | 0°C~70°C TA | Tube | 2000 | Z180 | e3 | yes | Active | 3 (168 Hours) | 68 | - | MATTE TIN | - | QUAD | J BEND | 260 | 5V | - | 20MHz | 40 | - | 68 | - | - | 5V | - | - | - | 5V | SCI | 1MB | - | - | MICROPROCESSOR | Z8S180 | - | 8 | 8b | 2 | 20 | Z8 | - | NO | YES | - | FIXED POINT | NO | 5.0V | - | - | 1 Core 8-Bit | No | DRAM | - | ASCI, CSIO, UART | - | - | - | - | - | - | - | 4.57mm | - | - | - | No SVHC | ROHS3 Compliant | Lead Free | ||
MPC860PCVR66D4 NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 357-BBGA | YES | - | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
 AM3892CCYG135 Texas Instruments | 7 | - | Datasheet | 12 Weeks | ACTIVE (Last Updated: 1 day ago) | - | 1031-BFBGA, FCBGA | YES | 1031 | - | 64 | - | 0°C~95°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 4 (72 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 245 | 1V | 0.65mm | - | NOT SPECIFIED | AM3892 | - | - | Not Qualified | 3.3V | 1.05V | 1V | - | - | SDIO, SPI, UART, USB | 32kB | 1.35GHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | 32b | 7 | - | ARM | 1.33GHz | YES | YES | - | FLOATING POINT | YES | 1.8V 3.3V | 3 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | DDR2, DDR3 | USB 2.0 + PHY (2) | I2C, McASP, McBSP, SPI, SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | HDMI, HDVPSS | SATA 3Gbps (1) | 3.31mm | - | 25mm | 25mm | 2.81mm | - | Non-RoHS Compliant | Lead Free | ||
MPC866TZP133A NXP USA Inc. | 8750 | - | Datasheet | 8 Weeks | - | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC866 | - | S-PBGA-B357 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | - | 133MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MPC850SRVR50BU NXP USA Inc. | 42 | - | Datasheet | - | - | - | 256-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | 40 | MPC850 | - | S-PBGA-B256 | - | - | 3.6V | 3.3V | 3V | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 32 | - | - | 26 | - | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | 2.54mm | 23mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8347VVALFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 672-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B672 | - | - | 1.26V | 1.3V | 1.14V | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | 1.69mm | 35mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX31LCVMN4C NXP USA Inc. | 80 | - | Datasheet | 15 Weeks | - | - | 473-LFBGA | YES | - | - | - | Industrial grade | -40°C~85°C TA | Tray | 2004 | i.MX31 | e1 | - | Active | 3 (168 Hours) | 473 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | - | 40 | MCIMX31 | - | S-PBGA-B473 | Not Qualified | - | 1.47V | 1.53.3V | 1.22V | - | - | - | 400MHz | - | MICROPROCESSOR | ARM1136JF-S | 75MHz | 32 | - | - | 26 | - | - | YES | YES | 16 | FLOATING POINT | YES | 1.8V 2.0V 2.5V 2.7V 3.0V | - | - | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | - | Multimedia; GPU, IPU, MPEG-4, VFP | - | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | - | - | 1.54mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6D6AVT08AE NXP USA Inc. | 8078 | - | Datasheet | 12 Weeks | - | - | 624-FBGA, FCBGA | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | 852MHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC8241TVR200D NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 1998 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC8241 | - | S-PBGA-B357 | - | - | 1.9V | - | 1.7V | - | - | - | 200MHz | - | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | - | - | 32 | - | - | YES | YES | 64 | FLOATING POINT | YES | 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | 2.56mm | 25mm | - | - | - | ROHS3 Compliant | - |