- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
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Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8358EVVAGDGA NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 740-LBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 740 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8358 | - | S-PBGA-B740 | - | 1.26V | 1.8/2.53.3V | 1.14V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | 1.69mm | 37.5mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8321EVRAFDCA NXP USA Inc. | 999 |
| - | 12 Weeks | - | - | 516-BBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 1999 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | - | - | S-PBGA-B516 | - | 1.05V | - | 0.95V | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | - | - | Cryptography | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
 P4080NSE7MMC NXP USA Inc. | 2843 |
| Datasheet | 12 Weeks | - | - | 1295-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P4 | e1 | - | Active | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | 30 | P4080 | - | S-PBGA-B1295 | - | 1.05V | - | 0.95V | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | 133.3MHz | - | - | - | - | - | - | 32 | - | YES | YES | 16 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | - | 1Gbps (8), 10Gbps (2) | 8 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.0 | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | - | 3.53mm | 37.5mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX515CJM6CR2 NXP USA Inc. | 32 |
| - | 15 Weeks | - | - | 529-LFBGA | YES | - | - | - | - | - | -40°C~95°C TC | Tape & Reel (TR) | 2008 | i.MX51 | e1 | - | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MCIMX515 | - | S-PBGA-B529 | Not Qualified | 1.1V | 1.2V | 0.95V | - | - | - | - | - | 600MHz | - | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2V 1.875V 2.775V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | - | - | 1.6mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6G2CVK05AB NXP USA Inc. | 4611 | - | Datasheet | 12 Weeks | - | - | 272-LFBGA | YES | - | - | - | 10 | Industrial grade | -40°C~105°C TJ | Tray | 2002 | i.MX6UL | - | - | Active | 3 (168 Hours) | 272 | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | - | 40 | - | - | S-PBGA-B272 | - | 1.3V | - | 1.15V | - | - | - | - | - | 528MHz | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | 16 | - | YES | - | 16 | - | - | 128000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | I2C; USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | - | 1.23mm | 9mm | - | - | - | - | ROHS3 Compliant | - | ||
 T4240NSN7QTB NXP USA Inc. | 552 |
| Datasheet | 18 Weeks | - | - | 1932-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 1999 | QorIQ T4 | e1 | yes | Active | 3 (168 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 250 | 1.025V | 1mm | - | - | - | - | S-PBGA-B1932 | - | 1.055V | - | 0.995V | - | - | - | - | - | 1.8GHz | - | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | - | - | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | - | - | 1Gbps (16), 10Gbps (4) | 12 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | - | - | - | - | - | SATA 3Gbps (2) | - | 3.33mm | 45mm | - | - | - | - | ROHS3 Compliant | - | ||
 T1042NXE7MQB NXP USA Inc. | 2914 | - | Datasheet | 18 Weeks | - | - | 780-FBGA, FCBGA | YES | - | - | - | - | - | -40°C~105°C TA | Bulk | 2014 | QorIQ T1 | - | - | Active | 3 (168 Hours) | 780 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | - | - | S-PBGA-B780 | - | 1.03V | - | 0.97V | - | - | - | - | - | 1.4GHz | - | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | - | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | - | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | - | 2.07mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM1808EZCEA3 Texas Instruments | 36 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | 361-LFBGA | YES | 361 | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | 0.65mm | 375MHz | - | AM1808 | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR, RISC | ARM926EJ-S | - | 32 | - | - | - | - | - | - | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | - | - | LCD | SATA 3Gbps (1) | 1.3mm | - | 13mm | 13mm | 890μm | - | - | ROHS3 Compliant | Lead Free | ||
 OMAP3530ECBB72 Texas Instruments | 36 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Surface Mount | 515-VFBGA, FCBGA | - | 515 | - | L2 Cache, ROM, SRAM | 188 | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | yes | Active | 3 (168 Hours) | 515 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | - | 0.4mm | 720MHz | - | OMAP3530 | 515 | - | - | - | - | - | 1.35V | I2C, Serial, UART, USB | 1.35V | 985mV | 112kB | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | - | - | - | 32b | - | - | ARM | - | - | - | - | - | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | 1 | - | - | LCD | - | 900μm | - | 12mm | 12mm | 610μm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 MCIMX7D7DVM10SD NXP USA Inc. | 1 | - | - | 16 Weeks | - | - | 541-LFBGA | YES | - | - | - | - | - | 0°C~95°C TJ | Tray | 2012 | i.MX7D | - | - | Active | 3 (168 Hours) | 541 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.75mm | - | 40 | - | - | S-PBGA-B541 | - | 1.25V | - | 1.045V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | 32 | - | - | - | - | - | 16 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | 1.42mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
 GCIXP1200GA Intel | 2734 |
| Datasheet | - | - | Surface Mount | 432-LBGA | - | 432 | - | - | - | - | 0°C~70°C TA | Tray | 2004 | - | e0 | - | Obsolete | 4 (72 Hours) | 432 | 3A001.A.3 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | - | 2V | 1.27mm | 166MHz | - | - | 432 | - | - | - | - | - | 3.3V | - | - | - | - | - | - | MICROPROCESSOR, RISC | StrongARM | - | 32 | 166 μs | - | - | - | - | 32 | - | YES | NO | 32 | FIXED POINT | YES | - | - | - | - | 1 Core 32-Bit | No | SDRAM | - | - | Data; Microengine | - | - | - | - | - | - | 1.67mm | 40mm | - | - | - | - | Non-RoHS Compliant | - | ||
 MC7448VU1000ND NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 360-CBGA, FCCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | - | Active | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | - | 260 | 1V | 1.27mm | - | 40 | MC7448 | - | S-CBGA-N360 | - | 1.05V | 1.31.8/2.5V | 0.95V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | PowerPC G4 | 1000MHz | 32 | - | - | - | - | - | - | - | NO | YES | - | FIXED POINT | NO | - | 1.5V 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | 2.8mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8347CVVAJDB NXP USA Inc. | 3408 |
| Datasheet | 12 Weeks | - | - | 672-LBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B672 | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | 1.69mm | 35mm | - | - | - | - | ROHS3 Compliant | - | ||
 MC68EN360VR25L NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | 357-BBGA | YES | - | - | - | 46 | - | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | - | 40 | MC68EN360 | - | S-PBGA-B357 | - | 5.25V | - | 4.75V | - | - | - | - | - | 25MHz | - | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | - | NO | YES | - | NO | 32 | - | - | - | 32 | - | - | - | 5.0V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | - | 1.86mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
MPC859DSLCZP66A NXP USA Inc. | 350 | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC859 | - | S-PBGA-B357 | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX257CVM4 NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 400-LFBGA | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2008 | i.MX25 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MCIMX257 | - | - | - | - | - | - | - | - | - | - | - | 400MHz | - | - | ARM926EJ-S | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | - | - | Keypad, LCD, Touchscreen | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8245ARVV400D NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 352-LBGA | - | - | 352-TBGA (35x35) | - | - | - | 0°C~85°C TA | Tray | 2002 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8245 | - | - | - | - | - | - | - | - | - | - | - | 400MHz | - | - | PowerPC 603e | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC9328MX21CVM NXP USA Inc. | In Stock | - | - | 15 Weeks | - | - | 289-LFBGA | YES | - | - | - | - | - | -40°C~85°C TA | Tray | 2004 | i.MX21 | e1 | - | Not For New Designs | 3 (168 Hours) | 289 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.8mm | - | 40 | MC9328MX21 | - | S-PBGA-B289 | - | 1.65V | - | 1.45V | - | - | - | - | - | 266MHz | - | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | - | - | - | - | - | 26 | - | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | Keypad, LCD | - | - | 1.6mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
MPC8347CVVAGDB NXP USA Inc. | 2408 | - | Datasheet | 12 Weeks | - | - | 672-LBGA | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | - | - | Active | 3 (168 Hours) | - | 3A991.A.2 | - | 8542.31.00.01 | - | - | - | - | - | - | - | MPC8347 | - | - | - | - | - | - | - | - | - | - | - | 400MHz | - | - | PowerPC e300 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6S5DVM10ACR NXP USA Inc. | 8000 | - | Datasheet | 15 Weeks | - | - | 624-LFBGA | - | - | - | - | - | - | 0°C~95°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | - | - | - | - | - | ROHS3 Compliant | - |