- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
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Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Operating Temperature (Max.) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8313EVRADDC NXP USA Inc. | 2000 | - | - | 8 Weeks | - | - | - | 516-BBGA Exposed Pad | YES | - | - | - | 105°C | - | - | - | Tray | 2002 | - | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8313 | - | S-PBGA-B516 | Not Qualified | - | 1.05V | 11.8/2.53.3V | OTHER | 0.95V | - | - | - | - | - | - | 266 MHz | - | MICROPROCESSOR, RISC | - | - | - | - | 32 | - | - | - | - | - | - | 15 | - | - | - | YES | YES | 32 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | - | - | - | ROHS3 Compliant | - | ||
 AM3703CBP100 Texas Instruments | 211 |
| Datasheet | - | NRND (Last Updated: 2 days ago) | Copper, Silver, Tin | - | 515-WFBGA, FCBGA | YES | 515 | - | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.1V | - | 1GHz | - | AM3703 | 515 | - | - | 1.1V | - | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | - | 32kB | - | - | 64kB | MICROPROCESSOR, RISC | - | ARM® Cortex®-A8 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | - | - | YES | YES | - | FLOATING POINT | YES | 65536 | - | 4 | - | 1 Core 32-Bit | No | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | LCD | - | 700μm | - | 12mm | 12mm | 500μm | - | - | ROHS3 Compliant | Lead Free | ||
 LS1048AXE7Q1A NXP USA Inc. | 2730 | - | Datasheet | 18 Weeks | - | - | - | 780-BFBGA, FCBGA | - | - | - | - | - | - | - | -40°C~105°C | - | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 250 | - | - | - | 30 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10GbE (2), 1GbE (8) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX31VKN5B NXP USA Inc. | 94 | - | Datasheet | - | - | - | - | 457-LFBGA | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2004 | i.MX31 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MCIMX31 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 532MHz | - | - | - | ARM1136JF-S | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.0V 2.5V 2.7V 3.0V | - | - | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | - | - | - | - | - | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9G25-CFU-999 Microchip Technology | 36 |
| Datasheet | 19 Weeks | - | - | - | 247-LFBGA | YES | 247 | ROM | 105 | - | - | - | -40°C~85°C TA | Cut Tape (CT) | 2004 | SAM9G | - | yes | Discontinued | 3 (168 Hours) | 247 | - | - | - | BOTTOM | BALL | - | 1V | 0.5mm | 400MHz | - | AT91SAM9G25 | - | - | - | - | - | - | - | - | - | EBI/EMI, Ethernet, I2C, IrDA, LIN, SPI, UART, USART, USB | 1.1V | 900mV | 64kB | Internal | - | 32kB | MICROCONTROLLER, RISC | - | ARM926EJ-S | DMA, POR, PWM, WDT | - | 32 | YES | YES | - | YES | NO | 6 | 26 | ARM | 8 | - | - | - | 32 | - | - | - | 1.8V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | No | DDR2, SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | FLASH | - | - | - | - | - | - | - | - | 1.37mm | 10mm | - | - | - | - | ROHS3 Compliant | - | ||
 SVF512R3K1CMK4 NXP USA Inc. | 10 | - | - | 15 Weeks | - | - | - | 364-LFBGA | YES | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2014 | Vybrid, VF5xxR | - | - | Active | 3 (168 Hours) | 364 | 5A002.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | - | NOT SPECIFIED | SVF512 | - | S-PBGA-B364 | - | - | 3.6V | - | - | 3V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A5 | - | - | - | - | - | - | - | - | - | 16 | - | - | - | YES | YES | 16 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | - | - | - | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | 1.5mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
 MC7448VU867ND NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 360-CBGA, FCCBGA | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | - | Active | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | - | 260 | 1V | 1.27mm | - | 40 | MC7448 | - | S-CBGA-N360 | - | - | 1.05V | 1.31.8/2.5V | - | 0.95V | - | - | - | - | - | - | 867MHz | - | MICROPROCESSOR, RISC | - | PowerPC G4 | - | 867MHz | 32 | - | - | - | - | - | - | - | - | - | - | NO | YES | - | FIXED POINT | NO | - | 1.5V 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | - | - | - | 2.8mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX515DJM8CR2 NXP USA Inc. | 750 |
| - | 15 Weeks | - | - | - | 529-LFBGA | YES | - | - | - | - | - | Commercial grade | -20°C~85°C TC | Tape & Reel (TR) | 2008 | i.MX51 | e1 | - | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | 40 | MCIMX515 | - | S-PBGA-B529 | Not Qualified | - | 1.15V | 1.2V | - | 1.05V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR CIRCUIT | - | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2V 1.875V 2.775V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | - | - | 1.6mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8378VRALGA NXP USA Inc. | 4050 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8378 | - | S-PBGA-B689 | - | - | 1.05V | 11.8/2.52.5/3.3V | - | 0.95V | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | - | PowerPC e300c4s | - | 66.66MHz | 32 | - | - | - | - | - | - | 32 | - | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC860TCVR50D4 NXP USA Inc. | 2139 |
| Datasheet | - | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | - | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP3503DCUS Texas Instruments | 680 | - | Datasheet | - | - | - | Surface Mount | 423-LFBGA, FCBGA | - | 423 | L2 Cache, ROM, SRAM | - | - | - | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | no | Obsolete | 4 (72 Hours) | 423 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 600MHz | - | OMAP3503 | 423 | - | - | - | - | - | - | - | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | 288kB | - | - | 64kB | DIGITAL SIGNAL PROCESSOR, OTHER | 32 | ARM® Cortex®-A8 | - | - | - | - | - | 32b | - | - | 12 | 26 | ARM | - | - | YES | YES | - | FLOATING POINT | - | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | - | - | NO | SINGLE | - | LCD | - | - | 1.4mm | 16mm | - | - | - | No SVHC | ROHS3 Compliant | Contains Lead | ||
 P4040NSE7MMC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 1295-BBGA, FCBGA | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P4 | e1 | - | Active | 3 (168 Hours) | - | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | 30 | P4040 | - | S-PBGA-B1295 | - | - | 1.05V | 1V | - | 0.95V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | - | PowerPC e500mc | - | 133.3MHz | 32 | - | - | - | - | - | - | 16 | - | - | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | - | 1Gbps (8), 10Gbps (2) | 4 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.0 | - | - | - | - | - | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | - | - | - | 3.53mm | 37.5mm | - | - | - | - | ROHS3 Compliant | - | ||
 SVF331R3K1CKU2R NXP USA Inc. | 40 |
| Datasheet | 15 Weeks | - | - | - | 176-LQFP Exposed Pad | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2012 | Vybrid, VF3xxR | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 266MHz, 133MHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A5 + Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | 10/100Mbps (2) | 2 Core 32-Bit | No | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | - | - | - | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8544VJALFA NXP USA Inc. | 2529 |
| Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | - | 40 | MPC8544 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR, RISC | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC8544EVJAQGA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Active | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8544 | - | S-PBGA-B783 | - | - | 1.05V | - | - | 0.95V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | - | PowerPC e500 | - | 133MHz | 32 | - | - | - | - | - | - | 32 | - | - | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE, Security; SEC | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | 2.8mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
MPC8548VJATGD NXP USA Inc. | 2368 | - | Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Active | 3 (168 Hours) | 783 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 1mm | - | - | MPC8548 | - | S-PBGA-B783 | - | - | - | 1.11.8/2.52.5/3.3V | - | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | - | PowerPC e500 | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 Z8S18020FSG Zilog | 300 |
| Datasheet | 13 Weeks | - | - | Surface Mount | 80-BQFP | - | 80 | ROMless | - | - | - | - | 0°C~70°C TA | Tray | 2000 | Z180 | e3 | yes | Active | 3 (168 Hours) | 80 | - | MATTE TIN | - | QUAD | GULL WING | 260 | 5V | 0.8mm | 20MHz | 40 | - | 80 | - | - | 5V | - | - | - | - | 5V | SCI | - | - | - | - | - | - | MICROPROCESSOR | - | Z8S180 | - | - | 8 | - | - | 8b | - | - | 2 | 20 | Z8 | - | - | NO | YES | - | FIXED POINT | NO | - | 5.0V | - | - | 1 Core 8-Bit | No | DRAM | - | ASCI, CSIO, UART | - | - | - | - | - | - | - | - | - | - | 3.1mm | - | - | - | - | - | ROHS3 Compliant | Lead Free | ||
AM3715CBPA Texas Instruments | 36 |
| Datasheet | - | NRND (Last Updated: 3 days ago) | - | - | 515-WFBGA, FCBGA | YES | 515 | - | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.1V | - | 800MHz | - | AM3715 | 515 | - | - | 1.1V | - | - | - | - | 1.8V | - | 1.5V | - | - | - | - | 64kB | MICROPROCESSOR, RISC | - | ARM® Cortex®-A8 | - | - | 32 | - | - | - | - | - | - | - | ARM | - | - | YES | YES | - | FLOATING POINT | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | LCD | - | 700μm | - | 12mm | 12mm | 500μm | No | - | ROHS3 Compliant | Lead Free | ||
LS1046AXE8MQA NXP USA Inc. | 3030 |
| Datasheet | 18 Weeks | - | - | - | 780-FBGA, FCBGA | YES | - | - | 76 | - | - | - | -40°C~105°C | Tray | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 780 | - | - | - | BOTTOM | BALL | 250 | 0.9V | 0.8mm | - | 30 | - | - | S-PBGA-B780 | - | - | 0.93V | - | - | 0.87V | - | - | - | - | - | - | 1.2GHz | - | - | - | ARM® Cortex®-A72 | - | - | - | - | - | - | - | - | - | 14 | - | - | - | YES | - | 64 | - | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | - | I2C, PCI, SPI, UART, USB | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | 2.61mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
MVF50NS151CMK50 NXP USA Inc. | 40 | - | Datasheet | 15 Weeks | - | - | - | 364-LFBGA | YES | - | - | 131 | - | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | - | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | - | 40 | MVF50NS151 | - | S-PBGA-B364 | Not Qualified | - | 1.26V | 3.3V | - | 1.16V | - | - | - | - | - | - | 500MHz | - | MICROCONTROLLER, RISC | - | ARM® Cortex®-A5 | - | - | 16 | YES | YES | - | NO | YES | - | 16 | - | - | CORTEX-A5 | - | - | 16 | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | - | - | - | - | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | - | 17mm | - | - | - | - | ROHS3 Compliant | - |