- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Operating Temperature (Max.) | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Memory Size | Oscillator Type | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Halogen Free | DAC Channels | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of External Interrupts | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6D6AVT10AER NXP USA Inc. | 2089 | - | Datasheet | 12 Weeks | - | 624-FBGA, FCBGA | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6D | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | 260 | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | - | ROHS3 Compliant | - | ||
 MPC8313ZQAFFC NXP USA Inc. | 200 | - | - | 8 Weeks | - | 516-BBGA Exposed Pad | YES | - | - | - | 105°C | - | - | - | - | Tray | 2002 | - | e0 | - | Last Time Buy | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | 40 | MPC8313 | - | S-PBGA-B516 | Not Qualified | - | 1.05V | 11.8/2.53.3V | OTHER | 0.95V | - | - | - | - | 333 MHz | MICROPROCESSOR, RISC | - | - | - | - | 32 | - | - | - | - | - | - | 15 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | - | ||
 MPC880VR80 NXP USA Inc. | 1 | - | Datasheet | 12 Weeks | - | 357-BBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TA | Tray | 2002 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | - | 30 | MPC880 | - | S-PBGA-B357 | - | - | 1.9V | 1.83.3V | - | 1.7V | - | - | - | - | 80MHz | MICROPROCESSOR, RISC | - | - | - | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | - | ROHS3 Compliant | - | ||
 MCIMX6S7CVM08AD NXP USA Inc. | 75 | - | - | 15 Weeks | - | 624-LFBGA | YES | - | - | 7 | - | - | - | - | -40°C~105°C TA | Tray | - | i.MX6S | - | - | Obsolete | 3 (168 Hours) | 624 | - | - | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.275V | - | - | - | - | 800MHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | 16 | - | YES | - | - | 64 | - | - | 144K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | - | ROHS3 Compliant | - | ||
 MPC8544VTAQG NXP USA Inc. | In Stock | - | Datasheet | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2007 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | - | Tin/Silver (Sn/Ag) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 1mm | - | - | - | MPC8544 | - | S-PBGA-B783 | - | - | - | 11.8/2.53.3V | - | - | - | - | - | - | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | - | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 Z84C0006VEG Zilog | 25 |
| - | 13 Weeks | Surface Mount | 44-LCC (J-Lead) | - | 44 | ROMless | - | - | - | - | - | -40°C~100°C TA | Tube | 2002 | Z80 | e3 | yes | Active | 3 (168 Hours) | 44 | - | Matte Tin (Sn) | - | - | DRAM MEMORY REFRESH COUNTER | 8542.31.00.01 | QUAD | J BEND | 260 | 5V | 1.27mm | - | 6MHz | 40 | Z84C00 | 44 | - | - | 5V | - | 5V | - | - | 5V | - | 64kB | - | 6.17 MHz | MICROPROCESSOR | - | - | - | - | 8 | - | - | 8b | - | - | - | 16 | - | NO | YES | - | - | FIXED POINT | NO | 0 | 5.0V | - | 1 Core 8-Bit | No | - | - | - | - | 2 | - | - | - | - | 4.57mm | 16.5862mm | - | ROHS3 Compliant | Lead Free | ||
 MCIMX6Y2CVM05AAR NXP USA Inc. | 7 |
| Datasheet | 52 Weeks | - | 289-LFBGA | YES | - | - | 5 | - | - | - | - | -40°C~105°C TJ | Tape & Reel (TR) | 2015 | i.MX6 | e1 | - | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | compliant | - | 40 | - | - | S-PBGA-B289 | - | - | 1.5V | - | - | 1.275V | - | - | - | - | 528MHz | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | 16 | - | YES | - | - | 16 | - | - | 128000 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | - | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | 1.32mm | 14mm | - | RoHS Compliant | - | ||
 P2020NSN2HFC NXP USA Inc. | 540 | - | Datasheet | 12 Weeks | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | - | 40 | P2020 | - | S-PBGA-B689 | - | - | 1.1V | 1.05V | - | 1V | - | - | - | - | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | - | 32 | - | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | 2.46mm | 31mm | - | ROHS3 Compliant | - | ||
 MPC8248VRTMFA NXP USA Inc. | 18 |
| Datasheet | 12 Weeks | - | 516-BBGA | YES | - | - | 57 | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | - | 30 | MPC8248 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | - | 1.425V | - | - | - | - | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | - | 66.7MHz | - | 32 | NO | YES | - | NO | - | - | 30 | - | - | - | - | 64 | - | - | - | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | 27mm | - | ROHS3 Compliant | - | ||
 MC7457TRX1000NC NXP USA Inc. | 861 |
| Datasheet | 12 Weeks | - | 483-BCBGA, FCCBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC74xx | e0 | - | Obsolete | 1 (Unlimited) | 483 | 3A991.A.1 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.3V | 1.27mm | - | - | 30 | MC7457 | - | S-CBGA-B483 | - | - | 1.35V | - | - | 1.25V | - | - | - | - | 1.0GHz | MICROPROCESSOR, RISC | PowerPC G4 | - | 167MHz | - | 32 | - | - | - | - | - | - | 36 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.5V 1.8V 2.5V | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | - | 3.2mm | 29mm | - | Non-RoHS Compliant | - | ||
 MPC8360VVALFHA NXP USA Inc. | 24728 | - | Datasheet | 12 Weeks | - | 740-LBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | - | - | 40 | MPC8360 | - | S-PBGA-B740 | - | - | 1.35V | 1.8/2.53.3V | - | 1.25V | - | - | - | - | 667MHz | MICROPROCESSOR, RISC | PowerPC e300 | - | 66.67MHz | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | - | 1.69mm | 37.5mm | - | ROHS3 Compliant | - | ||
MPC8544VJAQGA NXP USA Inc. | 2539 | - | Datasheet | 18 Weeks | - | 783-BBGA, FCBGA | - | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | 260 | - | - | - | - | 40 | MPC8544 | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6D6AVT10ACR NXP USA Inc. | 80 |
| Datasheet | 15 Weeks | - | 624-FBGA, FCBGA | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6D | e1 | - | Not For New Designs | 3 (168 Hours) | - | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | - | - | 260 | - | - | - | - | 40 | MCIMX6 | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | - | ROHS3 Compliant | - | ||
 ATSAMA5D42B-CUR Microchip Technology | 9 | - | - | 9 Weeks | - | 361-TFBGA | YES | - | - | - | - | - | - | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2017 | SAMA5D4 | - | - | Active | 3 (168 Hours) | 361 | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.26V | 0.8mm | - | - | - | ATSAMA5D42 | - | S-PBGA-B361 | - | - | 1.32V | - | - | 1.16V | - | - | - | - | 600MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | - | - | 32 | - | - | - | - | - | - | 26 | - | YES | YES | TS 16949 | 32 | FLOATING POINT | YES | - | 1.2V 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | - | - | AES, SHA, TDES, TRNG | LCD, Touchscreen | - | 1.2mm | 16mm | - | ROHS3 Compliant | - | ||
 T1024NSE7KNA NXP USA Inc. | 110 |
| Datasheet | 14 Weeks | - | 780-FBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | - | 2014 | QorIQ T1 | e1 | - | Active | 3 (168 Hours) | 780 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | 30 | - | - | S-PBGA-B780 | - | - | 1.03V | - | - | 0.97V | - | - | - | - | 1GHz | MICROPROCESSOR, RISC | PowerPC e5500 | - | 133.33MHz | - | 64 | - | - | - | - | - | - | 16 | - | YES | YES | - | 64 | - | YES | - | - | GbE (8) | 2 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | 2.07mm | 23mm | - | ROHS3 Compliant | - | ||
 MPC565MZP56R2 Freescale Semiconductor, Inc. (NXP Semiconductors) | In Stock | - | - | - | - | - | YES | 388 | FLASH | 56 | - | 36864 | 1048576 | - | - | Tape & Reel (TR) | - | - | e0 | - | - | 3 (168 Hours) | 388 | 3A991 | Tin/Lead/Silver (Sn/Pb/Ag) | 125°C | -40°C | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 240 | 2.6V | 1mm | not_compliant | 56MHz | 30 | - | 388 | - | Not Qualified | - | 2.7V | 2.65V | AUTOMOTIVE | 2.5V | - | CAN, EBI/EMI, SCI, SPI, UART, USART | 1MB | External | - | MICROCONTROLLER, RISC | - | POR, PWM, WDT | - | 230mA | 32 | NO | NO | - | YES | Not Halogen Free | NO | 24 | PowerPC | - | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | Contains Lead | ||
 LS1046ASN8MQA NXP USA Inc. | 2172 |
| Datasheet | 18 Weeks | - | 780-FBGA, FCBGA | YES | - | - | 76 | - | - | - | - | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 780 | - | - | - | - | - | - | BOTTOM | BALL | 250 | 0.9V | 0.8mm | - | - | 30 | - | - | S-PBGA-B780 | - | - | 0.93V | - | - | 0.87V | - | - | - | - | 1.2GHz | - | ARM® Cortex®-A72 | - | - | - | - | - | - | - | - | - | - | 14 | - | YES | - | - | 64 | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.61mm | 23mm | - | ROHS3 Compliant | - | ||
MCIMX6DP7CVT8AA NXP USA Inc. | 1000 |
| Datasheet | 15 Weeks | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6DP | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.275V | - | - | - | - | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | 26 | - | YES | YES | - | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | - | ROHS3 Compliant | - | ||
 MC68340AB25E NXP USA Inc. | 10000 | - | Datasheet | 10 Weeks | - | 144-BQFP | - | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | - | - | - | - | - | - | - | - | 25MHz | - | CPU32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX6Q7CZK08AE NXP USA Inc. | 2558 |
| Datasheet | 15 Weeks | - | 569-LFBGA | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6Q | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | - | ROHS3 Compliant | - |