- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
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Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Manufacturer Package Identifier | Memory Types | Number of I/Os | Operating Temperature (Max.) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Data Bus Width | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8313EVRAGDC NXP USA Inc. | 7 | - | - | 8 Weeks | - | 516-BBGA Exposed Pad | YES | - | - | - | - | - | 105°C | - | Tray | 2002 | - | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8313 | - | S-PBGA-B516 | Not Qualified | - | 1.05V | 11.8/2.53.3V | OTHER | 0.95V | - | - | - | - | 400 MHz | - | MICROPROCESSOR, RISC | - | - | 32 | - | 15 | - | YES | YES | 32 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | - | - | ROHS3 Compliant | - | ||
 MPC8321VRAFDC NXP USA Inc. | In Stock | - | Datasheet | - | - | 516-BBGA | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8321 | - | S-PBGA-B516 | - | - | 1.05V | - | - | 0.95V | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | ROHS3 Compliant | - | ||
 LS1024ASN7MLA NXP USA Inc. | 1000 | - | Datasheet | 12 Weeks | - | 625-BFBGA, FCBGA | YES | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2015 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 625 | - | - | - | - | BOTTOM | BALL | - | 1.13V | 0.8mm | - | - | - | - | S-PBGA-B625 | - | - | 1.164V | - | - | 1.096V | - | - | - | - | 1.2GHz | - | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A9 | 1200MHz | - | - | 26 | - | YES | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3 | USB 2.0 + PHY (1), USB 3.0 + PHY | - | - | - | - | Secure Boot, TrustZone® | - | SATA 3Gbps (2) | - | 2.67mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 MPC855TCZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | 357-BBGA | YES | - | - | - | - | - | - | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC855 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MPC850DSLZQ50BU NXP USA Inc. | 2 | - | Datasheet | - | - | 256-BBGA | YES | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | 40 | MPC850 | - | S-PBGA-B256 | - | - | 3.6V | 3.3V | - | 3V | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 32 | - | 26 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | Non-RoHS Compliant | - | ||
 MPC8536AVJATHA NXP USA Inc. | 2478 |
| - | 18 Weeks | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | 0°C~90°C TA | Tray | 2002 | MPC85xx | - | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | - | - | S-PBGA-B783 | - | - | 1.05V | - | - | 0.95V | - | - | - | - | 1.25GHz | - | MICROPROCESSOR | PowerPC e500 | - | 32 | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | SATA 3Gbps (2) | - | 2.76mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8572CLVJAULE NXP USA Inc. | 2749 | - | Datasheet | 18 Weeks | - | 1023-BBGA, FCBGA | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 1998 | MPC85xx | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 245 | - | - | - | 30 | MPC8572 | - | - | - | - | - | - | - | - | - | - | - | - | 1.333GHz | - | MICROPROCESSOR | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 P1024NXE5DFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | 561-FBGA | - | - | 561-TEPBGA I (23x23) | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | P1024 | - | - | - | - | - | - | - | - | - | - | - | - | 667MHz | - | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 AM3715CBC Texas Instruments | 30 |
| Datasheet | - | NRND (Last Updated: 3 days ago) | 515-VFBGA, FCBGA | YES | 515 | - | - | ROM | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 800MHz | - | AM3715 | 515 | - | - | 1.1V | - | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | 32kB | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | 32b | - | ARM | YES | YES | - | FLOATING POINT | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | - | - | LCD | - | 950μm | - | 14mm | 14mm | 630μm | No | ROHS3 Compliant | Lead Free | ||
 MPC8349VVAJDB NXP USA Inc. | 74 |
| - | 12 Weeks | - | 672-LBGA | YES | - | - | - | - | - | 105°C | - | Tray | 2002 | - | e2 | - | Active | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | ALSO REQUIRES 2.5V AND 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8349 | - | S-PBGA-B672 | Not Qualified | - | 1.26V | 1.21.8/2.52.5/3.3V | OTHER | 1.14V | - | - | - | - | 533 MHz | - | MICROPROCESSOR | - | 66MHz | 32 | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.69mm | 35mm | 35mm | - | - | ROHS3 Compliant | - | ||
 ATSAMA5D22C-CUR Microchip Technology | 27 |
| Datasheet | 10 Weeks | - | 196-TFBGA, CSBGA | YES | - | - | - | - | - | - | -40°C~85°C TA | Cut Tape (CT) | 2017 | SAMA5D2 | e2 | - | Active | 3 (168 Hours) | 196 | - | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.2V | 0.75mm | - | - | ATSAMA5D22 | - | S-PBGA-B196 | - | - | 1.32V | - | - | 1.1V | - | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | - | - | 26 | - | YES | YES | 16 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | - | - | 1.2mm | 11mm | - | - | - | ROHS3 Compliant | - | ||
 MC9328MX21CJMR2 NXP USA Inc. | In Stock | - | - | 10 Weeks | - | 289-LFBGA | YES | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2006 | i.MX21 | e1 | - | Not For New Designs | 3 (168 Hours) | 289 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.8mm | - | 40 | MC9328MX21 | - | S-PBGA-B289 | - | - | 1.65V | - | - | 1.45V | - | - | - | - | 266MHz | - | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | - | 26 | - | YES | YES | 32 | FIXED POINT | YES | - | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | - | Keypad, LCD | - | - | 1.6mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6Q6AVT08AE NXP USA Inc. | 2667 |
| Datasheet | 14 Weeks | - | 624-FBGA, FCBGA | YES | - | - | - | - | 32 | - | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | - | - | Active | 3 (168 Hours) | 624 | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.225V | - | - | - | - | 852MHz | - | - | ARM® Cortex®-A9 | - | - | - | 16 | - | YES | - | 64 | - | - | 272K | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8255AZUPIBB NXP USA Inc. | 2368 |
| Datasheet | 12 Weeks | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | PC8255 | - | S-PBGA-B480 | - | - | 2.2V | - | - | 1.9V | - | - | - | - | 300MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | - | 32 | - | YES | NO | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | Non-RoHS Compliant | - | ||
 XPC8240LZU200E NXP USA Inc. | 266 | - | Datasheet | - | - | 352-LBGA | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2001 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | - | - | - | - | PC8240 | - | - | - | - | - | - | - | - | - | - | - | - | 200MHz | - | MICROPROCESSOR, RISC | PowerPC 603e | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | - | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX516AJM6C NXP USA Inc. | 7600 |
| - | 15 Weeks | - | 529-LFBGA | YES | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2008 | i.MX51 | e1 | - | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | MCIMX516 | - | S-PBGA-B529 | Not Qualified | - | 1.1V | 1.2V | - | 0.95V | - | - | - | - | 600MHz | - | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | 1.2V 1.875V 2.775V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | - | - | 1.6mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 AM3352BZCZT60R Texas Instruments | 5000 | - | Datasheet | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 324-LFBGA | YES | 324 | - | - | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 324 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.2V | 0.8mm | - | NOT SPECIFIED | AM3352 | 324 | - | - | - | 1.248V | - | - | 1.152V | - | - | - | - | 600MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | - | - | - | YES | YES | - | FIXED POINT | YES | 131072 | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | - | Multimedia; NEON™ SIMD | - | - | - | LCD, Touchscreen | - | 1.4mm | - | 15mm | 15mm | 900μm | - | ROHS3 Compliant | Lead Free | ||
 AM1806EZCE3 Texas Instruments | 36 |
| Datasheet | 16 Weeks | ACTIVE (Last Updated: 1 week ago) | 361-LFBGA | YES | 361 | - | LFBGA-361 | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.2V | 0.65mm | 375MHz | - | AM1806 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR, RISC | ARM926EJ-S | - | 32 | - | - | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | - | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | - | - | LCD | - | 1.3mm | - | 13mm | 13mm | 890μm | - | ROHS3 Compliant | Lead Free | ||
 LS1020AXN7MQB NXP USA Inc. | 159 |
| Datasheet | 18 Weeks | - | 525-FBGA, FCBGA | - | - | - | - | - | - | - | -40°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | - | Multimedia; NEON™ SIMD | - | - | Secure Boot, TrustZone® | - | SATA 3Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8343EVRADDB NXP USA Inc. | 45 |
| - | 12 Weeks | - | 620-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8343 | - | S-PBGA-B620 | - | - | 1.26V | 1.22.53.3V | - | 1.14V | - | - | - | - | 266MHz | - | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | 2.46mm | 29mm | - | - | - | ROHS3 Compliant | - |