- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
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Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 P2010NXE2KHC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2010 | - | S-PBGA-B689 | - | - | 1.1V | - | 1V | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | - | - | - | - | - | - | - | 16 | - | - | YES | YES | 64 | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | - | ||
 MPC8572LVJAVNE NXP USA Inc. | 2266 | - | Datasheet | 18 Weeks | - | 1023-BBGA, FCBGA | - | - | - | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC85xx | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | 245 | - | - | - | 30 | MPC8572 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6X3CVN08AC NXP USA Inc. | In Stock | - | Datasheet | 15 Weeks | - | 400-LFBGA | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2017 | i.MX6SX | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 200MHz, 800MHz | - | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | ROHS3 Compliant | - | ||
 MVF30NS151CKU26 NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | - | 176-LQFP Exposed Pad | YES | - | - | - | 111 | 0 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF3xx | e3 | - | Active | 3 (168 Hours) | 176 | 5A002.A.1 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.23V | 0.5mm | - | 40 | MVF30NS151 | - | S-PQFP-G176 | Not Qualified | - | 1.26V | 3.3V | 1.16V | - | - | - | - | - | - | 266MHz | - | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | - | - | 16 | YES | YES | - | NO | YES | - | - | - | CORTEX-A5 | - | - | - | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | - | ROHS3 Compliant | - | ||
 MPC852TCZT50A NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | 256-BBGA | YES | - | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC852 | - | S-PBGA-B256 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FIXED POINT | YES | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | - | - | - | - | 2.54mm | 23mm | Non-RoHS Compliant | - | ||
 MC68020RC16E NXP USA Inc. | 27 | - | Datasheet | - | - | 114-BPGA | - | - | 114-PGA (34.55x34.55) | - | - | - | 0°C~70°C TA | Tray | 1995 | M680x0 | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | MC68020 | - | - | - | - | - | - | - | - | - | - | - | - | - | 16MHz | - | - | 68020 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC885CVR66 NXP USA Inc. | 3000 | - | Datasheet | 12 Weeks | - | 357-BBGA | YES | - | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | - | 40 | MPC885 | - | S-PBGA-B357 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FIXED POINT | YES | 3.3V | - | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | - | Cryptography | - | - | 2.52mm | 25mm | ROHS3 Compliant | - | ||
 BSC9131NLE1HHHB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | 520-FBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Bulk | 2002 | QorIQ Qonverge BSC | e1 | - | Obsolete | 3 (168 Hours) | 520 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 0.8mm | - | 30 | - | - | S-PBGA-B520 | - | - | 1.05V | - | 0.97V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | - | 32 | - | - | - | - | - | - | 16 | - | - | YES | YES | 32 | - | FIXED POINT | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 (1) | AIC, DUART, I2C, MMC/SD, SPI, USIM | Signal Processing; SC3850, Security; SEC 4.4 | - | Boot Security, Cryptography, Random Number Generator | - | - | 1.97mm | 21mm | ROHS3 Compliant | - | ||
 MCIMX31VKN5C NXP USA Inc. | In Stock | - | Datasheet | - | - | 457-LFBGA | - | - | - | - | - | - | 0°C~70°C TA | Tray | 2004 | i.MX31 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MCIMX31 | - | - | - | - | - | - | - | - | - | - | - | - | - | 532MHz | - | - | ARM1136JF-S | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.0V 2.5V 2.7V 3.0V | - | - | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | - | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | - | - | - | ROHS3 Compliant | - | ||
 MC7410TVU400LE NXP USA Inc. | 1628 | - | Datasheet | 8 Weeks | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC74xx | e2 | - | Obsolete | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | - | 40 | MC7410 | - | S-CBGA-B360 | - | - | 1.9V | - | 1.7V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC G4 | - | 133MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 64 | - | FLOATING POINT | YES | 1.8V 2.5V 3.3V | - | - | 1 Core 32-Bit | No | - | - | - | - | - | - | - | - | 2.8mm | 25mm | ROHS3 Compliant | - | ||
 MCIMX6U4AVM08AC NXP USA Inc. | 41 |
| Datasheet | 15 Weeks | - | 624-LFBGA | YES | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6DL | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 24MHz | 64 | - | - | - | - | - | - | 16 | - | - | YES | YES | 64 | - | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | 1.6mm | 21mm | ROHS3 Compliant | - | ||
 LS1021AXN7KQB NXP USA Inc. | 44 | - | Datasheet | 18 Weeks | - | 525-FBGA, FCBGA | YES | - | - | - | - | - | -40°C~105°C | Tray | 2013 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 525 | 3A991.A.1 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | - | - | S-PBGA-B525 | - | - | 1.03V | - | 0.97V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 3.0 (1) + PHY | - | - | - | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | - | ||
 XPC8240LVV200E NXP USA Inc. | In Stock | - | Datasheet | - | - | 352-LBGA | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2003 | MPC82xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | 8542.31.00.01 | - | - | - | - | - | - | - | PC8240 | - | - | - | - | - | - | - | - | - | - | - | - | - | 200MHz | - | MICROPROCESSOR, RISC | PowerPC 603e | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.3V | - | - | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 R7S721001VCBG#AC1 Renesas Electronics America | 6 | - | - | 20 Weeks | - | 324-BGA | YES | - | - | - | 169 | - | -40°C~85°C TA | Tray | - | RZ/A1H | - | yes | Active | 3 (168 Hours) | 324 | - | - | - | BOTTOM | BALL | - | 1.18V | 0.8mm | - | - | - | 324 | - | - | - | 1.26V | - | 1.1V | - | - | - | - | - | - | 400MHz | - | MICROCONTROLLER, RISC | ARM® Cortex®-A9 | - | 48MHz | - | YES | YES | - | YES | - | - | 26 | - | - | - | - | 32 | - | - | - | 1.2V 3.3V | - | 10/100Mbps (1), 100Mbps (1) | 1 Core 32-Bit | Yes | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | - | - | DVD, VDC | - | - | 19mm | ROHS3 Compliant | - | ||
 MC68302AG25C NXP USA Inc. | 47 |
| Datasheet | 8 Weeks | - | 144-LQFP | - | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68302 | - | - | - | - | - | - | - | - | - | - | - | - | - | 25MHz | - | - | M68000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8560PX667LB NXP USA Inc. | 423 | - | Datasheet | - | - | 784-BBGA, FCBGA | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8560 | - | - | - | - | - | - | - | - | - | - | - | - | - | 667MHz | - | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
R7S721001VCBG#AC0 Renesas Electronics America | 1846 | - | - | 20 Weeks | - | 324-BGA | YES | 324 | - | ROMless | 147 | - | -40°C~85°C TA | Tray | - | RZ/A1H | - | yes | Active | 3 (168 Hours) | 324 | - | - | - | BOTTOM | BALL | - | 1.18V | - | 400MHz | - | - | 324 | - | - | - | 1.26V | - | 1.1V | - | CAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB | - | - | - | External | - | 10MB | MICROCONTROLLER, RISC | ARM® Cortex®-A9 | DMA, POR, PWM, WDT | - | 32 | YES | YES | 32b | YES | - | 8 | 26 | ARM | - | - | - | - | 171 | - | - | 1.2V 3.3V | - | 10/100Mbps (1), 100Mbps (1) | 1 Core 32-Bit | Yes | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | - | - | DVD, VDC | - | - | 19mm | ROHS3 Compliant | Lead Free | ||
 MPC8544VJARJA NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | - | 783-BBGA, FCBGA | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | - | 40 | MPC8544 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.067GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | Signal Processing; SPE | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC860ENVR50D4R2 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tape & Reel (TR) | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | - | YES | YES | 32 | - | FIXED POINT | YES | 3.3V | - | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | - | ||
 AM1705BPTP3 Texas Instruments | 76 |
| Datasheet | - | Surface Mount | 176-LQFP Exposed Pad | - | 176 | - | - | - | - | 0°C~90°C TJ | Tube | - | Sitara™ | e4 | no | Obsolete | 4 (72 Hours) | 176 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 375MHz | - | AM1705 | 176 | - | - | 1.2V | - | - | - | 1.32V | - | 1.32V | 1.14V | 16kB | - | - | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | - | - | 16b | - | - | 1 | 13 | ARM | - | YES | YES | - | - | FIXED POINT | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | - | - | - | - | - | 24mm | ROHS3 Compliant | Contains Lead |