- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
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- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Data Encoding/Decoding Method | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
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 P1022NSN2LFB NXP USA Inc. | 2763 |
| Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | P1022 | - | S-PBGA-B689 | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 1.055GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 133MHz | 32 | - | - | - | - | - | - | 16 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | LCD | - | SATA 3Gbps (2) | - | - | 2.46mm | 31mm | - | - | ROHS3 Compliant | - | ||
 MPC8555CVTAJD NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A992 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8555 | - | S-PBGA-B783 | - | 1.26V | - | 1.14V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 166MHz | 32 | - | - | - | - | - | - | 64 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | 3.75mm | 29mm | - | - | ROHS3 Compliant | - | ||
 LS1020AXN7HNB NXP USA Inc. | 653 | - | Datasheet | 18 Weeks | - | - | - | 525-FBGA, FCBGA | YES | - | - | - | - | - | - | - | -40°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 525 | 3A991.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | - | - | S-PBGA-B525 | - | 1.03V | - | 0.97V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | - | 133.3MHz | 32 | - | - | - | - | - | - | 16 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | - | - | Multimedia; NEON™ SIMD | - | - | - | - | - | Secure Boot, TrustZone® | - | - | - | SATA 3Gbps (1) | - | - | 2.07mm | 19mm | - | - | ROHS3 Compliant | - | ||
 AT91SAM9CN12B-CFU Microchip Technology | 22 |
| Datasheet | 9 Weeks | - | Copper, Silver, Tin | Surface Mount | 247-LFBGA | - | 217 | - | 205.307246mg | L1 Cache, ROM, SRAM | 105 | - | Yes | -40°C~85°C TA | Tray | 2004 | SAM9CN | e1 | yes | Active | 3 (168 Hours) | 247 | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | - | 1V | 0.5mm | 400MHz | - | AT91SAM9CN | - | - | - | - | - | - | - | 2-Wire, EBI/EMI, I2C, SPI, Serial, UART, USART, USB | 1.1V | 900mV | 128kB | Internal | - | 32kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | 32 | - | - | 32b | - | - | 2 | 26 | ARM | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | - | - | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | 1 | - | - | - | - | - | LCD, Touchscreen | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC860PVR50D4 NXP USA Inc. | 43 | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | ROHS3 Compliant | - | ||
MPC8536EBVJAULA NXP USA Inc. | 2607 |
| Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Active | 3 (168 Hours) | 783 | 5A002.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | MPC8536 | - | S-PBGA-B783 | - | 1.05V | 11.5/1.81.8/3.3V | 0.95V | - | - | - | - | - | - | 1.333GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 133MHz | 32 | - | - | - | - | - | - | 16 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | - | Security; SEC | - | - | - | - | - | Cryptography | - | - | - | SATA 3Gbps (2) | - | - | 2.76mm | 29mm | - | - | ROHS3 Compliant | - | ||
 P4080NSN1PNB NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 1295-BBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2008 | QorIQ P4 | e1 | - | Obsolete | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | 30 | P4080 | - | S-PBGA-B1295 | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | 133.3MHz | - | - | - | - | - | - | - | 32 | - | YES | YES | - | 16 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | - | 1Gbps (8), 10Gbps (2) | 8 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.53mm | 37.5mm | - | - | ROHS3 Compliant | - | ||
MC68MH360VR25VL NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | - | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | - | 40 | MC68MH360 | - | S-PBGA-B357 | - | 5.25V | - | 4.75V | - | - | - | - | - | - | 25MHz | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | - | 25MHz | - | - | - | - | - | - | - | 32 | - | YES | YES | - | 32 | - | - | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | - | Communications; CPM | - | - | MC68040; MC68030 | - | - | - | 1.25 MBps | - | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | - | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | - | 1.86mm | 25mm | - | - | ROHS3 Compliant | - | ||
 MPC8560PX667LC NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 784-BBGA, FCBGA | - | - | 783-FCPBGA (29x29) | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | MPC8560 | - | - | - | - | - | - | - | - | - | - | - | - | 667MHz | - | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | I2C, PCI, RapidIO, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 OMAPL138BGWTMEP Texas Instruments | 1 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Lead, Tin | Surface Mount | 361-LFBGA | - | 361 | - | - | L2 Cache, ROM, SRAM | - | Military grade | - | -55°C~125°C TJ | Tube | - | OMAP-L1x | e0 | - | Active | 3 (168 Hours) | 361 | - | Tin/Lead (Sn/Pb) | - | - | BOTTOM | BALL | 220 | 1.2V | 0.8mm | 345MHz | - | OMAPL138 | 361 | - | 3.3V | - | - | - | 1.35V | SPI | - | - | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | - | - | - | 32b | - | - | - | - | ARM | YES | YES | - | - | FLOATING POINT | YES | 8192 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 8 | Signal Processing; C674x, System Control; CP15 | MROM | - | - | NO | SINGLE | Boot Security, Cryptography | - | LCD | - | SATA 3Gbps (1) | - | 1.4mm | - | 16mm | 16mm | 900μm | Non-RoHS Compliant | Contains Lead | ||
 MC8640DHX1067NE NXP USA Inc. | In Stock | - | - | 16 Weeks | - | - | - | 1023-BCBGA, FCCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC86xx | e0 | - | Obsolete | 3 (168 Hours) | - | 3A991.A.1 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 0.95V | 1mm | - | 30 | MC8640 | - | S-CBGA-B1023 | - | 1V | 11.8/2.52.5/3.3V | 0.9V | - | - | - | - | - | - | 1.067GHz | - | MICROPROCESSOR | PowerPC e600 | - | 166.66MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, RapidIO | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.97mm | 33mm | - | - | Non-RoHS Compliant | - | ||
 MC7447AHX1420LB NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | - | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | - | Not For New Designs | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | - | 40 | MC7447 | - | S-CBGA-B360 | - | 1.35V | - | 1.25V | - | - | - | - | - | - | 1.42GHz | - | MICROPROCESSOR, RISC | PowerPC G4 | - | 167MHz | 32 | - | - | - | - | - | - | 36 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | - | - | - | - | - | - | 3.24mm | 25mm | - | - | Non-RoHS Compliant | - | ||
 MCIMX6X2CVN08AC NXP USA Inc. | 450 | - | Datasheet | 15 Weeks | - | - | - | 400-LFBGA | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2017 | i.MX6SX | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | 200MHz, 800MHz | - | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | - | Keypad, LCD | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX6Q5EZK08AE NXP USA Inc. | 2834 |
| Datasheet | 15 Weeks | - | - | - | 569-LFBGA | - | - | - | - | - | - | - | - | -20°C~105°C TJ | Tray | - | i.MX6Q | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | SATA 3Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 ATSAMA5D43B-CUR Microchip Technology | 378 |
| - | 12 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | Automotive grade | - | -40°C~85°C TA | Tape & Reel (TR) | 2017 | SAMA5D4 | - | - | Active | 3 (168 Hours) | 289 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.26V | 0.8mm | - | - | ATSAMA5D43 | - | S-PBGA-B289 | - | 1.32V | - | 1.16V | - | - | - | - | - | - | 600MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | - | 32 | - | - | - | - | - | - | 26 | - | YES | YES | TS 16949 | 16 | FLOATING POINT | YES | - | 1.2V 1.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | AES, SHA, TDES, TRNG | - | LCD, Touchscreen | - | - | - | - | 1.4mm | 14mm | - | - | ROHS3 Compliant | - | ||
 T4240NSE7TTB NXP USA Inc. | 926 |
| Datasheet | 18 Weeks | - | - | - | 1932-BBGA, FCBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ T4 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | BOTTOM | BALL | 250 | 1.025V | 1mm | - | - | - | - | S-PBGA-B1932 | - | 1.055V | - | 0.995V | - | - | - | - | - | - | 1.8GHz | - | MICROPROCESSOR, RISC | PowerPC e6500 | - | 133.3MHz | - | - | - | - | - | - | - | 16 | - | YES | YES | - | 64 | FIXED POINT | YES | - | - | - | 1Gbps (16), 10Gbps (4) | 12 Core 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | - | - | - | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | - | SATA 3Gbps (2) | - | - | 3.33mm | 45mm | - | - | ROHS3 Compliant | - | ||
 MPC8245TVV350D NXP USA Inc. | 12 | - | Datasheet | 12 Weeks | - | - | - | 352-LBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 1998 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | - | 30 | MPC8245 | - | S-PBGA-B352 | - | 2.1V | 23.3V | 1.9V | - | - | - | - | - | - | 350MHz | - | MICROPROCESSOR, RISC | PowerPC 603e | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.65mm | 35mm | - | - | ROHS3 Compliant | - | ||
P1022NSN2HFB NXP USA Inc. | 2430 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | P1022 | - | S-PBGA-B689 | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 1.055GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | - | 32 | - | - | - | - | - | - | 16 | - | YES | YES | - | 64 | FIXED POINT | YES | - | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | LCD | - | SATA 3Gbps (2) | - | - | 2.46mm | 31mm | - | - | ROHS3 Compliant | - | ||
 MPC8347EVVAGDB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 672-LBGA | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B672 | - | 1.26V | 1.22.53.3V | 1.14V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300 | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | Security; SEC | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 1.69mm | 35mm | - | - | ROHS3 Compliant | - | ||
MC68EN360ZQ25VL NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | 46 | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | e0 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | - | 40 | MC68EN360 | - | S-PBGA-B357 | - | 5.25V | - | 4.75V | - | - | - | - | - | - | 25MHz | - | MICROCONTROLLER, RISC | CPU32+ | - | 6MHz | 32 | NO | YES | - | NO | NO | - | 32 | - | - | - | - | 32 | - | - | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | 1.86mm | 25mm | - | - | Non-RoHS Compliant | - |