- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
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- Core Processor
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- Number of Cores/Bus Width
- Operating Temperature
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Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Frequency(Max) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Clock Frequency | Bit Size | Data Bus Width | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Speed Grade | Integrated Cache | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6D6AVT08ACR NXP USA Inc. | 9875 |
| Datasheet | 15 Weeks | - | 624-FBGA, FCBGA | - | - | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6D | e1 | - | Not For New Designs | 3 (168 Hours) | - | - | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | - | - | - | 260 | - | - | - | 40 | MCIMX6 | - | - | - | - | - | - | - | - | - | - | - | 852MHz | - | MICROPROCESSOR | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX6D6AVT08ADR NXP USA Inc. | 2257 | - | Datasheet | 15 Weeks | - | 624-FBGA, FCBGA | - | - | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6D | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 852MHz | - | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8358CVRAGDDA NXP USA Inc. | 2736 |
| Datasheet | 12 Weeks | - | 668-BBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 2004 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 668 | - | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8358 | - | S-PBGA-B668 | - | 1.26V | - | - | 1.14V | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | - | PowerPC e300 | 66.67MHz | 32 | - | 32 | - | YES | YES | 32 | FLOATING POINT | - | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | - | - | 2.46mm | 29mm | - | - | ROHS3 Compliant | - | ||
 LS1021AXE7MQB NXP USA Inc. | 40 |
| Datasheet | 18 Weeks | - | 525-FBGA, FCBGA | - | - | - | - | - | -40°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 3.0 (1) + PHY | - | - | - | - | - | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | - | - | - | - | ROHS3 Compliant | - | ||
 MC7447AVU1167NB NXP USA Inc. | In Stock | - | Datasheet | - | - | 360-BCBGA, FCCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC74xx | e2 | - | Obsolete | 1 (Unlimited) | 360 | - | 3A991.A.1 | TIN COPPER/TIN SILVER | - | - | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.3V | 1.27mm | - | 40 | MC7447 | - | S-CBGA-B360 | - | 1.35V | - | - | 1.25V | - | - | - | - | 1.167GHZ | - | MICROPROCESSOR, RISC | - | PowerPC G4 | 167MHz | 32 | - | 36 | - | YES | YES | 64 | FLOATING POINT | - | YES | 1.8V 2.5V | - | - | 1 Core 32-Bit | No | - | - | - | Multimedia; SIMD | - | - | - | - | - | - | 2.8mm | 25mm | - | - | ROHS3 Compliant | - | ||
 MPC8378EVRAJFA NXP USA Inc. | 55 |
| Datasheet | 12 Weeks | - | 689-BBGA Exposed Pad | YES | - | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | - | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8378 | - | S-PBGA-B689 | - | 1.05V | 11.8/2.52.5/3.3V | - | 0.95V | - | - | - | - | 533MHz | - | MICROPROCESSOR | - | PowerPC e300c4s | 66.66MHz | 32 | - | 32 | - | YES | YES | 32 | FLOATING POINT | - | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | - | - | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | - | - | ROHS3 Compliant | - | ||
 ADSP-2185KSTZ-133 Analog Devices, Inc. | 21 | - | Datasheet | - | Surface Mount | LQFP | - | 100 | - | 33.3MHz | - | - | Bulk | - | - | e3 | yes | - | 3 (168 Hours) | 100 | SMD/SMT | 3A991.A.2 | Matte Tin (Sn) | 70°C | 0°C | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 33.3MHz | 40 | - | 100 | - | 5V | - | - | COMMERCIAL | - | - | Serial | 5.5V | 4.5V | - | 80kB | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | - | - | - | 16b | 14 | - | YES | YES | - | FIXED POINT | - | - | - | - | - | - | - | - | - | - | - | - | YES | MULTIPLE | - | - | - | 1.6mm | 14mm | No | No SVHC | RoHS Compliant | Lead Free | ||
 MPC8540VT667LB NXP USA Inc. | In Stock | - | Datasheet | - | - | 784-BBGA, FCBGA | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8540 | - | - | - | - | - | - | - | - | - | - | - | 667MHz | - | - | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100Mbps (1), 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI, RapidIO | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 T1040NXE7MQB NXP USA Inc. | 2198 | - | Datasheet | 18 Weeks | - | 780-FBGA, FCBGA | - | - | - | - | - | -40°C~105°C TA | Bulk | 2002 | QorIQ T1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4GHz | - | - | - | PowerPC e5500 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1Gbps (12) | 4 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX31LVKN5B NXP USA Inc. | 439 | - | Datasheet | - | - | 457-LFBGA | - | - | 457-MAPBGA (14x14) | - | - | 0°C~70°C TA | Tray | 2004 | i.MX31 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCIMX31 | - | - | - | - | - | - | - | - | - | - | - | 532MHz | - | - | - | ARM1136JF-S | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.0V 2.5V 2.7V 3.0V | - | - | 1 Core 32-Bit | Yes | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | - | - | - | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | - | - | - | - | - | ROHS3 Compliant | - | ||
T1040NSN7MQB NXP USA Inc. | 2987 | - | Datasheet | 18 Weeks | - | 780-FBGA, FCBGA | - | - | - | - | - | 0°C~105°C TA | Bulk | 2002 | QorIQ T1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4GHz | - | - | - | PowerPC e5500 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1Gbps (12) | 4 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX7S5EVM08SD NXP USA Inc. | 48888 | - | - | 16 Weeks | - | 541-LFBGA | - | - | - | - | Commercial grade | -20°C~105°C TJ | Tray | 2012 | i.MX7S | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | - | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC866TZP100A NXP USA Inc. | 25000 | - | Datasheet | 12 Weeks | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | - | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC866 | - | S-PBGA-B357 | - | 1.9V | 1.83.3V | - | 1.7V | - | - | - | - | 100MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | 32 | - | YES | YES | 32 | FIXED POINT | - | YES | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | 2.52mm | 25mm | - | - | Non-RoHS Compliant | - | ||
 MPC8250ACVVMHBC NXP USA Inc. | 11 | - | Datasheet | 12 Weeks | - | 480-LBGA Exposed Pad | YES | - | - | - | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 480 | - | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 2V | 1.27mm | - | 40 | MPC8250 | - | S-PBGA-B480 | - | 2.2V | - | - | 1.9V | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | - | PowerPC G2 | - | 32 | - | 32 | - | YES | NO | 64 | FLOATING POINT | - | YES | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | ROHS3 Compliant | - | ||
T1042NSN7PQB NXP USA Inc. | 2208 | - | Datasheet | 18 Weeks | - | 780-FBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2014 | QorIQ T1 | - | - | Active | 3 (168 Hours) | 780 | - | 3A991.A.1 | - | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 250 | 1V | 0.8mm | - | - | - | - | S-PBGA-B780 | - | 1.03V | - | - | 0.97V | - | - | - | - | 1.4GHz | - | MICROPROCESSOR, RISC | - | PowerPC e5500 | 133.3MHz | 32 | - | 16 | - | YES | YES | 64 | FIXED POINT | - | YES | - | - | 1Gbps (5) | 4 Core 64-Bit | No | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | - | - | SATA 3Gbps (2) | 2.07mm | 23mm | - | - | ROHS3 Compliant | - | ||
MPC880ZP66 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | - | - | TIN LEAD | - | - | - | - | - | BOTTOM | BALL | - | 1.8V | 1.27mm | - | - | MPC880 | - | S-PBGA-B357 | - | 1.9V | 1.83.3V | - | 1.7V | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | 32 | - | YES | YES | 32 | FIXED POINT | - | YES | 3.3V | - | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | 2.52mm | 25mm | - | - | Non-RoHS Compliant | - | ||
 PRIXP425BC Intel | 25 |
| Datasheet | - | Surface Mount | 492-BBGA | - | 492 | - | - | - | 0°C~70°C TA | Tray | 2004 | - | e1 | - | Obsolete | 3 (168 Hours) | 492 | - | 3A991.A.2 | TIN SILVER COPPER | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 1.3V | 1.27mm | 400MHz | 40 | - | 492 | - | - | - | - | - | - | 1.3V | - | - | - | 533 MHz | - | MICROPROCESSOR, RISC | - | Xscale | - | 32 | - | 32 | - | YES | NO | 32 | FIXED POINT | - | YES | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | SDRAM | USB 1.1 (1) | HSS, MII, PCI, UART, UTOPIA 2 | Communications; Network Processor Engine, Math Engine; Multiply-Accumulate | - | - | - | Cryptography | - | - | 2.59mm | 35mm | - | - | RoHS Compliant | Lead Free | ||
 P1025NSN5DFB NXP USA Inc. | 2116 | - | Datasheet | 12 Weeks | - | 561-FBGA | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | P1025 | - | - | - | - | - | - | - | - | - | - | - | 667MHz | - | - | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 LS1088ASE7Q1A NXP USA Inc. | 2142 | - | Datasheet | 18 Weeks | - | 780-BFBGA, FCBGA | - | - | - | - | - | 0°C~105°C | - | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | 250 | - | - | - | 30 | - | - | - | - | - | - | - | - | - | - | - | - | 1.6GHz | - | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | 10GbE (2), 1GbE (8) | 8 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | - | - | ROHS3 Compliant | - | ||
 OMAPL138EZWTA4 Texas Instruments | In Stock | - | Datasheet | - | - | 361-LFBGA | YES | 361 | - | - | - | -40°C~105°C TJ | Tray | - | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR CIRCUIT | - | ARM926EJ-S | - | - | - | - | ARM | - | - | - | - | 456 MHz | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | - | - | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | - | - | - | - | ROHS3 Compliant | Lead Free |