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- Packaging
- Moisture Sensitivity Level (MSL)
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Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Manufacturer Package Identifier | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Number of Cores | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC860DEZQ80D4 NXP USA Inc. | 164 | - | Datasheet | - | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | 80MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX6S4AVM08ABR NXP USA Inc. | 40 |
| Datasheet | 15 Weeks | - | - | 624-LFBGA | YES | - | - | - | - | - | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | - | - | Not For New Designs | 3 (168 Hours) | 624 | - | - | 8542.31.00.01 | - | - | - | - | - | - | - | MCIMX6 | - | - | Not Qualified | - | - | 1.05/1.5V | - | - | - | - | - | - | 800MHz | - | GRAPHICS PROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8533EVTANG NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~90°C TA | Tray | 2006 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | 783 | 3A001.A.3 | - | 8542.31.00.01 | BOTTOM | BALL | - | 1V | 1mm | - | - | MPC8533 | - | S-PBGA-B783 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | 800MHz | - | MICROPROCESSOR | PowerPC e500v2 | 133MHz | 32 | - | - | - | - | - | 16 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | - | DUART, HSSI, I2C, PCI | - | Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.8mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8358VVAGDGA NXP USA Inc. | 2104 |
| Datasheet | 12 Weeks | - | - | 740-LBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8358 | - | S-PBGA-B740 | - | - | 1.26V | 1.8/2.53.3V | 1.14V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | - | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.69mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 AM5716AABCXQ1 Texas Instruments | 39 | - | Datasheet | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | - | 760-BFBGA, FCBGA | YES | 760 | FCBGA 760 | - | - | Automotive grade | -40°C~125°C TJ | - | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 760 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5716 | - | - | - | - | 1.2V | - | 1.11V | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | NO | - | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | - | Multimedia; GPU, IPU, VFP | - | - | - | - | - | SATA 3Gbps (1) | 2.96mm | - | 23mm | 23mm | 2.39mm | - | ROHS3 Compliant | - | ||
 MCIMX6D5EYM12AE NXP USA Inc. | 11 |
| Datasheet | 15 Weeks | - | - | 624-LFBGA, FCBGA | YES | - | - | - | - | - | -20°C~105°C TJ | Tray | 2002 | i.MX6D | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | 1.6mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 P1014NSN5DFB NXP USA Inc. | 27 |
| Datasheet | 12 Weeks | - | - | 425-FBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 425 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | P1014 | - | S-PBGA-B425 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | 1.9mm | 19mm | - | - | - | ROHS3 Compliant | - | ||
 ATSAMA5D28C-D1G-CU Microchip Technology | 40 | - | Datasheet | - | - | - | 289-LFBGA | YES | - | - | - | - | - | -40°C~85°C TA | Tray | - | SAMA5D2 | - | - | Active | 3 (168 Hours) | 289 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.8V | 0.8mm | - | - | ATSAMA5D28 | - | S-PBGA-B289 | - | - | 1.9V | - | 1.7V | - | - | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 16 | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 65536 | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | 9 | Multimedia; NEON™ MPE | - | 16 | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 51 | - | - | 1.2mm | 14mm | - | - | - | ROHS3 Compliant | - | ||
MPC860DEZQ66D4 NXP USA Inc. | In Stock | - | Datasheet | 26 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 3A991 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (2) | 1 Core 32-Bit | No | DRAM | - | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 AM3703CBPA Texas Instruments | 36 | - | Datasheet | - | NRND (Last Updated: 2 days ago) | - | 515-WFBGA, FCBGA | YES | 515 | - | ROM | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Not For New Designs | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.1V | - | 800MHz | - | AM3703 | 515 | - | - | 1.1V | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | - | 32kB | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | - | - | 32b | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | 65536 | - | 4 | - | 1 Core 32-Bit | No | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | 1 | - | - | LCD | - | - | 700μm | - | 12mm | 12mm | 500μm | - | Non-RoHS Compliant | Lead Free | ||
MC68EN360ZQ25L NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 357-BBGA | YES | - | - | - | 46 | - | 0°C~70°C TA | Tray | 1995 | M683xx | e0 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | - | 40 | MC68EN360 | - | S-PBGA-B357 | - | - | 5.25V | - | 4.75V | - | - | - | - | - | 25MHz | - | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | - | NO | - | 32 | - | - | - | 32 | - | - | - | 5.0V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | - | Communications; CPM | - | - | - | - | - | - | - | 1.86mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
MPC855TVR50D4R2 NXP USA Inc. | 25000 | - | Datasheet | - | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tape & Reel (TR) | 1997 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC855 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
MPC866PZP100A NXP USA Inc. | 8750 |
| Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | MPC866 | - | S-PBGA-B357 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | 100MHz | - | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MPC8377VRALG NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~125°C TA | Tray | 2007 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | - | - | - | - | - | - | 15 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
MPC8377ECVRANG NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | -40°C~125°C TA | Tray | 2012 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | - | 1.05V | 1.051.8/2.52.5/3.3V | 0.95V | - | - | - | - | - | 800MHz | - | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | Security; SEC 3.0 | - | - | Cryptography, Random Number Generator | - | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8349EZUALFB NXP USA Inc. | 132 | - | - | 12 Weeks | - | - | 672-LBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e0 | - | Obsolete | 3 (168 Hours) | 672 | 5A002.A.1 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8349 | - | S-PBGA-B672 | - | - | 1.26V | 1.22.5/3.3V | 1.14V | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | 1.69mm | 35mm | - | - | - | Non-RoHS Compliant | - | ||
MPC860PVR66D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | ROHS3 Compliant | - | ||
P1022NXN2HFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | P1022 | - | S-PBGA-B689 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | 1.055GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | - | - | - | - | LCD | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
OMAP3530DZCBB Texas Instruments | In Stock | - | Datasheet | - | - | Surface Mount | 515-VFBGA, FCBGA | - | 515 | - | L2 Cache, ROM, SRAM | - | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | - | Obsolete | 3 (168 Hours) | 515 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | - | OMAP3530 | 515 | - | - | - | - | - | - | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | - | - | 32b | - | 12 | 26 | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | - | - | LCD | - | - | - | 0.9mm | - | - | - | No | ROHS3 Compliant | Contains Lead | ||
 LS1088AXN7MQA NXP USA Inc. | 2787 | - | Datasheet | 18 Weeks | - | - | 780-BFBGA, FCBGA | - | - | - | - | - | - | -40°C~105°C | - | - | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 250 | - | - | - | 30 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10GbE (2), 1GbE (8) | 8 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | - | - | Secure Boot, TrustZone® | - | - | SATA 6Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | - |