- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Data Transfer Rate-Max | Display & Interface Controllers | Communication Protocol | SATA | Data Encoding/Decoding Method | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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![]() LS1012AXN7HKA NXP USA Inc. | 23 |
| Datasheet | 24 Weeks | - | - | - | 211-VFLGA | - | - | - | - | -40°C~105°C | - | 2016 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (2) | 1 Core 64-Bit | - | DDR3L | USB 2.0 (1), USB 3.0 + PHY | - | - | - | - | - | - | - | - | Secure Boot, TrustZone® | - | - | - | SATA 6Gbps (1) | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() T1023NXE7MQA NXP USA Inc. | 36 | - | Datasheet | 18 Weeks | - | - | - | 525-FBGA, FCBGA | - | - | - | - | -40°C~105°C TA | - | 2014 | QorIQ T1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | - | PowerPC e5500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (8) | 2 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | - | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8377EVRAJF NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | 0°C~125°C TA | Tray | 2005 | MPC83xx | e2 | - | Obsolete | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | 66.66MHz | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | Security; SEC 3.0 | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | SATA 3Gbps (2) | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() KU80L186EC13 Intel | In Stock | - | Datasheet | - | - | - | Surface Mount | 100-QFP | - | 80 | - | - | 0°C~70°C TA | Tray | 1996 | i186 | e0 | - | Obsolete | 4 (72 Hours) | 100 | - | Tin/Lead (Sn/Pb) | - | QUAD | GULL WING | - | 3V | 0.635mm | 13MHz | - | - | 100 | S-PQFP-G100 | - | - | - | - | - | 3V | - | 5V | 2.7V | - | - | - | - | MICROPROCESSOR | 80C186 | - | - | 36mA | 16 | 13 μs | - | - | - | - | - | 20 | - | NO | YES | 16 | FIXED POINT | NO | - | 3.0V | - | - | 1 Core 16-Bit | No | DRAM | - | Serial Communications Unit (SCU) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4.57mm | 19.05mm | - | - | - | - | Non-RoHS Compliant | - | ||
![]() P2041NSN7MMC NXP USA Inc. | 460 | - | Datasheet | 12 Weeks | - | - | - | 780-BBGA, FCBGA | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | - | 245 | - | - | - | 30 | P2041 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX355AJQ5CR2 NXP USA Inc. | 3800 |
| Datasheet | 15 Weeks | - | - | - | 400-LFBGA | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2008 | i.MX35 | e1 | - | Active | 3 (168 Hours) | - | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | - | 260 | - | - | - | 40 | MCIMX355 | - | - | - | - | - | - | - | - | - | - | - | - | - | 532MHz | - | - | ARM1136JF-S | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART | - | Multimedia; IPU, VFP | - | - | - | - | - | Secure Fusebox, Secure JTAG | - | Keypad, KPP, LCD | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8314EVRAFDA NXP USA Inc. | 40 | - | Datasheet | 10 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8314 | - | S-PBGA-B620 | - | - | 1.05V | 13.3V | 0.95V | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | - | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | Security; SEC 3.3 | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 2.46mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() OMAP3503ECBBA Texas Instruments | 36 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | - | Surface Mount | 515-VFBGA, FCBGA | - | 515 | L2 Cache, ROM, SRAM | - | -40°C~105°C TJ | Tray | - | OMAP-35xx | e1 | yes | Active | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | - | OMAP3503 | 515 | - | - | 1.8V | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | - | - | - | - | - | - | - | 32b | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | No | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | - | NO | SINGLE | - | - | LCD | - | - | - | 900μm | - | 12mm | 12mm | 610μm | - | - | ROHS3 Compliant | Lead Free | ||
![]() MCIMX280DVM4BR NXP USA Inc. | 2000 |
| Datasheet | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | -20°C~70°C TA | Tape & Reel (TR) | 2002 | i.MX28 | - | - | Active | 3 (168 Hours) | 289 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX280 | - | S-PBGA-B289 | - | - | 1.55V | - | 1.35V | - | - | - | - | - | - | 454MHz | - | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | - | - | - | - | - | - | - | - | 15 | - | YES | YES | 16 | FIXED POINT | YES | - | 1.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | Data; DCP | - | - | - | - | - | Boot Security, Cryptography, Hardware ID | - | Keypad | - | - | - | - | 1.37mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MVF30NN152CKU26 NXP USA Inc. | 40 | - | Datasheet | 15 Weeks | - | - | - | 176-LQFP Exposed Pad | YES | - | - | - | -40°C~85°C TA | Tray | - | Vybrid, VF3xx | - | yes | Active | 3 (168 Hours) | 176 | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | - | - | - | - | - | 3.6V | - | 3V | - | - | - | - | - | - | 266MHz | - | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | - | 24MHz | - | 32 | - | YES | YES | - | NO | - | - | - | - | - | - | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | - | - | - | - | - | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | - | 24mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8377CVRAJFA NXP USA Inc. | 2956 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | - | - | 32 | - | - | - | - | - | - | 15 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() ATSAMA5D22A-CU Microchip Technology | In Stock | - | Datasheet | 19 Weeks | - | Copper, Silver, Tin | Surface Mount | 196-TFBGA, CSBGA | - | 196 | External Program Memory, ROM | 72 | -40°C~85°C TA | Tray | 2016 | SAMA5D2 | e2 | yes | Obsolete | 3 (168 Hours) | 196 | - | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | - | BOTTOM | BALL | - | 1.2V | 0.75mm | 500MHz | - | ATSAMA5D22 | - | - | - | 1.2V | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | 1.32V | 1.1V | 160kB | Internal | - | 128kB | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | - | - | - | - | - | - | 32b | - | 6 | 26 | ARM | YES | YES | - | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | - | Multimedia; NEON™ MPE | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | - | Keyboard, LCD, Touchscreen | - | - | - | - | 1.2mm | 11mm | - | - | - | No SVHC | ROHS3 Compliant | - | ||
![]() MPC860PCVR50D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8560PX833LC NXP USA Inc. | 7 | - | Datasheet | - | - | - | - | 784-BBGA, FCBGA | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8560 | - | - | - | - | - | - | - | - | - | - | - | - | - | 833MHz | - | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | I2C, PCI, RapidIO, SPI, TDM, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
![]() MC68MH360ZQ25VL NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 357-BBGA | YES | - | - | - | 0°C~70°C TA | Tray | 1997 | M683xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 3A991 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | - | 40 | MC68MH360 | - | S-PBGA-B357 | - | - | 5.25V | - | 4.75V | - | - | - | - | - | - | 25MHz | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | - | 25MHz | - | - | - | - | - | - | - | - | 32 | - | YES | YES | 32 | - | - | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | - | Communications; CPM | - | - | MC68040; MC68030 | - | - | - | 1.25 MBps | - | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | - | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | - | 1.86mm | 25mm | - | - | - | - | Non-RoHS Compliant | - | ||
![]() MCIMX6X3EVK10ABR NXP USA Inc. | 32 |
| - | 15 Weeks | - | - | - | 400-LFBGA | - | - | - | - | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6SX | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 227MHz, 1GHz | - | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | - | Keypad, LCD, LVDS | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8260AVVPJDB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.5V | 1.27mm | - | 40 | PC8260 | - | S-PBGA-B480 | - | - | 2.7V | - | 2.4V | - | - | - | - | - | - | 300MHz | - | MICROPROCESSOR, RISC | PowerPC G2 | - | - | - | - | - | - | - | - | - | - | 32 | - | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6S5DVM10ABR NXP USA Inc. | 40 |
| Datasheet | 15 Weeks | - | - | - | 624-LFBGA | YES | - | - | - | 0°C~95°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | - | - | Not For New Designs | 3 (168 Hours) | 624 | - | - | 8542.31.00.01 | - | - | - | - | - | - | - | MCIMX6 | - | - | Not Qualified | - | - | 1.05/1.5V | - | - | - | - | - | - | - | 1.0GHz | - | GRAPHICS PROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
![]() OMAP3515ECUS72 Texas Instruments | 36 |
| Datasheet | 12 Weeks | ACTIVE (Last Updated: 6 days ago) | - | Surface Mount | 423-LFBGA, FCBGA | - | 423 | L2 Cache, ROM, SRAM | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | - | Active | 4 (72 Hours) | 423 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 720MHz | - | OMAP3515 | 423 | - | - | - | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | - | - | - | - | - | - | - | 32b | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | 64000 | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | - | - | NO | SINGLE | - | - | LCD | - | - | - | 1.4mm | - | 16mm | 16mm | 960μm | No | - | ROHS3 Compliant | Lead Free | ||
![]() MPC8544EVTANGA NXP USA Inc. | 2751 |
| Datasheet | - | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | 0°C~105°C TA | Tray | 2007 | MPC85xx | e2 | - | Obsolete | 3 (168 Hours) | 783 | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8544 | - | S-PBGA-B783 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 133MHz | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI | - | Signal Processing; SPE, Security; SEC | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 2.8mm | 29mm | - | - | - | - | ROHS3 Compliant | - |