- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Nominal Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Access Time | Data Bus Width | Halogen Free | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC68SEC000FU16 Freescale Semiconductor, Inc. (NXP Semiconductors) | 932 |
| - | - | - | - | QFP | YES | - | - | - | - | - | - | Bulk | - | - | e0 | - | - | 1 (Unlimited) | 64 | EAR99 | - | 70°C | 0°C | CAN ALSO OPERATE WITH 5V SUPPLY | - | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.8mm | - | 16MHz | NOT SPECIFIED | - | 64 | - | Not Qualified | - | - | 5V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR | - | - | - | 32 | 16 μs | - | Not Halogen Free | - | 24 | - | - | YES | 16 | FIXED POINT | NO | - | - | - | - | - | - | - | - | - | 1 | - | - | - | - | - | - | 2.45mm | - | - | - | - | RoHS Compliant | Contains Lead | ||
 BSC9131NSN1KHKB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 520-FBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Bulk | 2002 | QorIQ Qonverge BSC | e1 | - | Obsolete | 3 (168 Hours) | 520 | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 0.8mm | - | - | 30 | - | - | S-PBGA-B520 | - | - | 1.05V | - | - | 0.97V | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | - | 32 | - | - | - | - | 16 | - | YES | YES | 32 | FIXED POINT | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 (1) | AIC, DUART, I2C, MMC/SD, SPI, USIM | Signal Processing; SC3850 | - | - | - | - | - | - | - | 1.97mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6X3CVO08AC NXP USA Inc. | 535 |
| - | 15 Weeks | - | - | 400-LFBGA | - | - | - | - | - | - | -40°C~105°C TA | Tray | - | i.MX6SX | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 200MHz, 800MHz | - | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 ATSAMA5D27A-CU Microchip Technology | In Stock | - | Datasheet | 19 Weeks | Copper, Silver, Tin | Surface Mount | 289-LFBGA | - | 289 | - | External Program Memory, ROM | 128 | - | -40°C~85°C TA | Tray | 2016 | SAMA5D2 | - | yes | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz | - | ATSAMA5D27 | - | - | - | 1.2V | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | 1.32V | 1.1V | 160kB | Internal | - | - | 128kB | - | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | - | - | - | 32b | - | 6 | - | ARM | - | - | - | - | - | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | - | - | - | - | - | - | No SVHC | ROHS3 Compliant | - | ||
 MPC8379CVRALGA NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | 40 | MPC8379 | - | S-PBGA-B689 | - | - | 1.05V | 11.8/2.52.5/3.3V | - | 0.95V | - | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | - | 32 | - | - | - | - | 15 | - | YES | YES | 64 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | SATA 3Gbps (4) | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 LS1012ASE7HKA NXP USA Inc. | 2593 |
| Datasheet | 24 Weeks | - | - | 211-VFLGA | - | - | - | - | - | - | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (2) | 1 Core 64-Bit | - | DDR3L | USB 2.0 (1), USB 3.0 + PHY | - | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MIMX8MD6DVAJZAA NXP USA Inc. | 99 |
| Datasheet | 16 Weeks | - | - | 621-FBGA, FCBGA | - | - | - | - | - | Commercial grade | 0°C~95°C TJ | Tray | 2016 | i.MX8MD | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | 260 | - | - | compliant | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5GHz | - | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE | 2 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | - | - | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | - | - | - | - | - | - | RoHS Compliant | - | ||
 MC68302EH25CB1 NXP USA Inc. | 64 |
| Datasheet | - | - | - | 132-BQFP Bumpered | YES | - | - | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | 132 | - | - | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.635mm | - | - | - | MC68302 | - | S-PQFP-G132 | - | - | - | - | - | - | - | - | - | - | - | - | - | 25MHz | - | - | M68000 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 8/16-Bit | No | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 XOMAP3530BCBB Texas Instruments | 13 | - | Datasheet | - | - | Surface Mount | 515-VFBGA, FCBGA | - | 515 | - | FLASH | 188 | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | - | - | Obsolete | 3 (168 Hours) | 515 | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.8V | 0.4mm | - | 600MHz | - | OMAP3530 | 515 | - | - | 3V | - | - | - | - | 1.35V | I2C, MMC, SDIO, UART, USB | - | - | 256kB | - | 2mA | - | 64kB | MICROPROCESSOR | ARM® Cortex®-A8 | - | - | - | - | 32b | - | 12 | - | - | YES | YES | - | FLOATING POINT | YES | 1.8V 3.0V | - | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | - | - | - | LCD | - | - | 0.9mm | - | - | No | - | Non-RoHS Compliant | - | ||
 MPC860SRCZQ50D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | - | 30 | MPC860 | - | S-PBGA-B357 | - | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | - | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX6S6AVM10AC NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | - | - | 624-LFBGA | YES | - | - | - | - | - | -40°C~125°C TJ | Tray | - | i.MX6S | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | - | 1.5V | - | - | 1.4V | - | - | - | - | - | - | - | 1GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.6mm | 21mm | - | - | - | ROHS3 Compliant | - | ||
MPC8378VRAGDA NXP USA Inc. | 44 | - | Datasheet | 12 Weeks | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | 40 | MPC8378 | - | S-PBGA-B689 | - | - | 1.05V | 11.8/2.52.5/3.3V | - | 0.95V | - | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | 66.66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 OMAPL138BZCEA3 Texas Instruments | In Stock | - | Datasheet | - | - | Surface Mount | 361-LFBGA | - | 361 | - | - | - | - | -40°C~105°C TJ | Tray | - | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 260 | 1V | 0.65mm | - | 375MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | - | 1.35V | - | - | 950mV | - | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | - | - | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | Lead Free | ||
 AT91SAM9G45B-CU-999 Microchip Technology | In Stock | - | Datasheet | - | - | - | 324-TFBGA | - | 324 | 324-TFBGA (15x15) | ROM | 160 | - | -40°C~85°C TA | Cut Tape (CT) | 2009 | SAM9G | - | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | -40°C | - | - | - | - | - | - | - | - | 400MHz | - | AT91SAM9G45 | - | - | - | 1.1V | - | - | - | - | - | EBI/EMI, Ethernet, I2C, IrDA, MMC, SPI, UART, USART, USB | - | - | 64kB | Internal | - | 400MHz | - | - | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | - | - | - | - | - | - | ARM | - | - | - | - | - | 1.8V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | No | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | LCD, Touchscreen | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 SVF511R3K1CMK4 NXP USA Inc. | 7 | - | - | 15 Weeks | - | - | 364-LFBGA | YES | - | - | - | - | - | -40°C~85°C TA | Tray | 2014 | Vybrid, VF5xxR | e1 | - | Active | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | - | - | 40 | SVF511 | - | S-PBGA-B364 | - | - | 3.6V | - | - | 3V | - | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | - | - | - | - | - | - | 16 | - | YES | YES | 16 | FLOATING POINT | YES | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | - | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | 1.5mm | 17mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8313EZQAFFC NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | - | - | 516-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e0 | - | Last Time Buy | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | 40 | MPC8313 | - | S-PBGA-B516 | - | - | 1.05V | 11.8/2.53.3V | - | 0.95V | - | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | 32 | - | - | - | - | 15 | - | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | - | - | - | Cryptography | - | - | - | 2.55mm | 27mm | - | - | - | Non-RoHS Compliant | - | ||
MPC880ZP133 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | 357-BBGA | YES | - | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | - | Obsolete | 3 (168 Hours) | 357 | 5A992 | TIN LEAD | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | - | 30 | MPC880 | - | S-PBGA-B357 | - | - | 1.9V | 1.83.3V | - | 1.7V | - | - | - | - | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | 3.3V | - | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - | ||
OMAPL138BZCEA3E Texas Instruments | In Stock | - | Datasheet | - | - | Surface Mount | 361-LFBGA | - | 361 | - | - | - | - | -40°C~105°C TJ | Tray | - | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 260 | 1V | 0.65mm | - | 375MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | - | 1.35V | - | - | - | - | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | - | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | - | - | - | - | - | - | ROHS3 Compliant | Lead Free | ||
 P4040NSN1PNB NXP USA Inc. | In Stock | - | Datasheet | - | - | - | 1295-BBGA, FCBGA | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2009 | QorIQ P4 | e1 | - | Obsolete | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | - | 30 | P4040 | - | S-PBGA-B1295 | - | - | 1.05V | - | - | 0.95V | - | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | - | 133.3MHz | - | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | - | 1Gbps (8), 10Gbps (2) | 4 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | - | 3.53mm | 37.5mm | - | - | - | ROHS3 Compliant | - | ||
 Z8L18020FSG Zilog | 500 |
| Datasheet | 13 Weeks | - | Surface Mount | 80-BQFP | - | 80 | - | ROMless | - | - | 0°C~70°C TA | Tray | 2000 | Z180 | e3 | yes | Active | 3 (168 Hours) | 80 | - | TIN | - | - | - | - | QUAD | GULL WING | 225 | 5V | 0.8mm | - | 20MHz | 30 | - | 80 | - | - | 5V | - | - | - | - | 5V | SCI, UART | - | - | - | - | - | - | - | MICROPROCESSOR | Z8L180 | - | - | 8 | - | 8b | - | 2 | - | Z8 | NO | YES | - | FIXED POINT | NO | 3.3V | - | - | 1 Core 8-Bit | No | DRAM | - | ASCI, CSIO, UART | - | - | - | - | - | - | - | 2.8mm | - | 20.1mm | 14.1mm | - | - | ROHS3 Compliant | Lead Free |