- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Frequency(Max) | Memory Types | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 OMAP2530CZAC400 Texas Instruments | 7 |
| - | 16 Weeks | - | - | - | - | - | - | - | - | - | - | - | 0°C~70°C TA | - | - | - | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | OMAP2530 | - | - | - | - | - | - | - | - | - | - | - | - | - | 400MHz | - | - | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2V | - | - | 1 Core 32-Bit | Yes | LPDDR | USB OTG (1) | 1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO | Multimedia; NEON™ SIMD | - | Boot Security, Secure JTAG | LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC68340CAG25E NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | - | 144-LQFP | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 1995 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MC68340 | - | - | - | - | - | - | - | - | - | - | - | - | - | 25MHz | - | - | CPU32 | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | - | - | 1 Core 32-Bit | No | DRAM | - | USART | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP3525DCUS Texas Instruments | In Stock | - | Datasheet | - | - | - | Surface Mount | 423-LFBGA, FCBGA | - | 423 | - | - | L2 Cache, ROM, SRAM | - | - | 0°C~90°C TJ | Tray | - | OMAP-35xx | e1 | no | Obsolete | 3 (168 Hours) | 423 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | - | OMAP3525 | 423 | - | - | - | - | - | - | 1.35V | I2C, MMC, SDIO, UART, USB | 1.35V | 985mV | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 32b | 12 | 26 | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | - | LCD | - | - | 1.4mm | 16mm | - | - | No | ROHS3 Compliant | Contains Lead | ||
 MPC8555CPXAJD NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e0 | - | Obsolete | 3 (168 Hours) | 783 | 5A992 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | - | 30 | MPC8555 | - | S-PBGA-B783 | - | 1.26V | - | - | 1.14V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 166MHz | 32 | - | - | 64 | - | YES | YES | 64 | FLOATING POINT | YES | - | 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM | - | - | - | - | - | 3.75mm | 29mm | - | - | - | Non-RoHS Compliant | - | ||
 MCIMX6Y0CVM05AB NXP USA Inc. | 1 | - | Datasheet | 18 Weeks | - | - | - | 289-LFBGA | - | - | - | - | - | - | Industrial grade | -40°C~105°C TJ | Tray | 2015 | i.MX6 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 528MHz | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (1) | I2C, SPI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC850DEVR50BU NXP USA Inc. | 2858 | - | Datasheet | - | - | - | - | 256-BBGA | YES | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | 40 | MPC850 | - | S-PBGA-B256 | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | 26 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | - | - | 2.35mm | 23mm | - | - | - | ROHS3 Compliant | - | ||
 MC9328MXLDVM15R2 NXP USA Inc. | In Stock | - | Datasheet | 26 Weeks | - | - | - | 256-LFBGA | - | - | - | - | - | - | - | -30°C~70°C TA | Tape & Reel (TR) | 1994 | i.MXL | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MC9328MXL | - | - | - | - | - | - | - | - | - | - | - | - | - | 150MHz | - | - | ARM920T | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MC9328MXLVP15R2 NXP USA Inc. | In Stock | - | Datasheet | 26 Weeks | - | - | - | 225-LFBGA | - | - | 225-MAPBGA (13x13) | - | - | - | - | 0°C~70°C TA | Tape & Reel (TR) | 1994 | i.MXL | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MC9328MXL | - | - | - | - | - | - | - | - | - | - | - | - | - | 150MHz | - | - | ARM920T | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.0V | - | - | 1 Core 32-Bit | No | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | - | - | - | LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 P1022NSN2EFB NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | P1022 | - | S-PBGA-B689 | - | 1.05V | - | - | 0.95V | - | - | - | - | - | - | 1.055GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | - | 32 | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | - | - | LCD | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | ROHS3 Compliant | - | ||
 MPC8540PX667LC NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 784-BBGA, FCBGA | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8540 | - | - | - | - | - | - | - | - | - | - | - | - | - | 667MHz | - | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100Mbps (1), 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | - | DUART, I2C, PCI, RapidIO | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 AM5718AABCXEQ1 Texas Instruments | 7 |
| Datasheet | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | - | - | 760-BFBGA, FCBGA | YES | 760 | - | - | - | - | Automotive grade | -40°C~125°C TJ | - | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 760 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5718 | - | - | - | 1.2V | - | - | 1.11V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | - | 38.4MHz | - | - | - | - | - | YES | YES | - | FIXED POINT | NO | 524288 | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | - | - | HDMI, LCD | SATA 3Gbps (1) | 2.96mm | - | 23mm | 23mm | 2.39mm | - | ROHS3 Compliant | - | ||
SPC5200CBV400 Freescale Semiconductor, Inc. (NXP Semiconductors) | 1 | - | - | - | - | - | - | BGA | YES | 272 | - | 400MHz | - | - | - | - | - | - | - | e0 | no | - | 3 (168 Hours) | 272 | - | Tin/Lead (Sn/Pb) | 85°C | -40°C | ALSO REQUIRES 3.3V SUPPLY | - | BOTTOM | BALL | 240 | 1.5V | - | 400MHz | 30 | - | 272 | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | MICROPROCESSOR | - | - | - | 32 | 32b | - | 32 | PowerPC | YES | YES | - | FLOATING POINT | YES | - | - | - | - | - | - | - | - | - | - | 1 | - | - | - | - | 2.65mm | 27mm | - | - | No | RoHS Compliant | - | ||
 MPC8349CZUAJDB NXP USA Inc. | In Stock | - | - | 12 Weeks | - | - | - | 672-LBGA | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e0 | - | Obsolete | 3 (168 Hours) | 672 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8349 | - | S-PBGA-B672 | - | 1.26V | 1.21.8/2.52.5/3.3V | - | 1.14V | - | - | - | - | - | - | 533MHz | - | MICROPROCESSOR | PowerPC e300 | - | 66MHz | 32 | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | 1.69mm | 35mm | - | - | - | Non-RoHS Compliant | - | ||
 ATSAMA5D44A-CUR Microchip Technology | In Stock | - | Datasheet | 19 Weeks | - | Copper, Silver, Tin | Surface Mount | 361-TFBGA | - | 361 | - | - | L2 Cache, ROM, SRAM | 152 | - | -40°C~85°C TA | Tape & Reel (TR) | 2014 | SAMA5D4 | e2 | yes | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | - | - | - | - | BOTTOM | BALL | - | 1.26V | 0.8mm | 528MHz | - | ATSAMA5D44 | - | - | 1.8V | - | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB | 1.98V | 1.62V | 128kB | Internal | 600 MHz | 128kB | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | - | - | 32b | 3 | 26 | ARM | YES | YES | - | FIXED POINT | YES | - | 1.2V 1.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | 1 | AES, SHA, TDES, TRNG | LCD, Touchscreen | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MPC8543VUANG NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 783-BBGA, FCBGA | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2009 | MPC85xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8543 | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 MPC8358VRAGDGA NXP USA Inc. | 7 | - | Datasheet | 12 Weeks | - | - | - | 668-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 668 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8358 | - | S-PBGA-B668 | - | 1.26V | - | - | 1.14V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300 | - | 66.67MHz | 32 | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | - | - | - | - | - | 2.46mm | 29mm | - | - | - | ROHS3 Compliant | - | ||
 SVF332R3K1CKU2 NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | - | - | - | 176-LQFP Exposed Pad | YES | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2014 | Vybrid, VF3xxR | e3 | - | Active | 3 (168 Hours) | 176 | 5A002.A.1 | Matte Tin (Sn) | - | - | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | - | - | S-PQFP-G176 | - | 3.6V | - | - | 3V | - | - | - | - | - | - | 266MHz, 133MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | - | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | - | - | 1.6mm | 24mm | - | - | - | ROHS3 Compliant | - | ||
MCIMX6X1EVO10AC NXP USA Inc. | 40 | - | Datasheet | 15 Weeks | - | - | - | 400-LFBGA | - | - | - | - | - | - | - | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 227MHz, 1GHz | - | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8321ZQAFDC NXP USA Inc. | In Stock | - | Datasheet | - | - | - | - | 516-BBGA | - | - | 516-FPBGA (27x27) | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC83xx | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MPC8321 | - | - | - | - | - | - | - | - | - | - | - | - | - | 333MHz | - | - | PowerPC e300c2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | - | ||
 MPC855TCZQ66D4 NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | - | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC855 | - | S-PBGA-B357 | - | 3.465V | 3.3V | - | 3.135V | - | - | - | - | - | - | 66MHz | - | MICROPROCESSOR, RISC | - | - | 50MHz | 32 | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | - | 2.52mm | 25mm | - | - | - | Non-RoHS Compliant | - |