- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Weight | Memory Types | Number of I/Os | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Nominal Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | On Chip Program ROM Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Speed Grade | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Max Junction Temperature (Tj) | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of PWM Channels | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Ambient Temperature Range High | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 P2020NXN2MHC NXP USA Inc. | 2810 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2020 | - | S-PBGA-B689 | - | - | 1.1V | 1.05V | 1V | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | 32 | - | - | - | - | - | YES | YES | - | - | FIXED POINT | - | YES | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
 LS1046AXN8T1A NXP USA Inc. | 2102 | - | Datasheet | 18 Weeks | - | - | - | 780-FBGA, FCBGA | YES | - | - | - | 76 | - | - | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 780 | - | - | - | - | BOTTOM | BALL | 250 | 1V | 0.8mm | - | 30 | - | - | S-PBGA-B780 | - | - | 1.03V | - | 0.97V | - | - | - | - | - | - | - | 1.8GHz | - | - | ARM® Cortex®-A72 | - | - | - | - | - | 14 | - | - | YES | - | - | 64 | - | - | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | - | - | - | - | I2C, PCI, SPI, UART, USB | - | - | Secure Boot, TrustZone® | - | - | - | SATA 6Gbps (1) | - | 2.61mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
 OMAPL137DZKBA3 Texas Instruments | 309 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Copper, Silver, Tin | Surface Mount | 256-BGA | - | 256 | - | Cache | 128 | - | - | -40°C~105°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.2V | - | 375MHz | - | OMAPL137 | - | - | - | - | - | - | - | - | SPI, USB | 3.45V | 900mV | 32kB | - | - | - | 128kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | - | 32b | 2 | - | ARM | - | YES | YES | - | - | FLOATING POINT | - | YES | - | 1.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | - | 105°C | Signal Processing; C674x, System Control; CP15 | - | 1 | 3 | - | NO | SINGLE | - | 85°C | LCD | - | - | 2.05mm | - | 17mm | 17mm | 1.36mm | - | - | ROHS3 Compliant | Lead Free | ||
 OMAPL138EZWTD4E Texas Instruments | 29 |
| Datasheet | 16 Weeks | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | - | 361-LFBGA | YES | 361 | - | - | - | - | - | -40°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328kB | MICROPROCESSOR CIRCUIT | ARM926EJ-S | - | - | - | 32b | - | - | ARM | - | - | - | - | - | - | 456 MHz | - | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | - | - | Signal Processing; C674x, System Control; CP15 | - | 1 | - | I2C; SPI; UART; USB | - | - | Boot Security, Cryptography | - | LCD | - | SATA 3Gbps (1) | 1.4mm | - | 16mm | 16mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
 MPC866PVR133A NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | - | - | - | 357-BBGA | YES | - | - | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC866 | - | S-PBGA-B357 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | - | 133MHz | - | MICROPROCESSOR, RISC | - | - | - | 32 | - | - | 32 | - | - | YES | YES | - | 32 | FIXED POINT | - | YES | - | 3.3V | - | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | - | - | Communications; CPM | - | - | - | - | - | - | - | - | - | - | - | - | 2.52mm | 25mm | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP5910JGDY2 Texas Instruments | 500 | - | Datasheet | 6 Weeks | - | - | Surface Mount | 289-BGA | - | 289 | - | FLASH | - | - | - | -40°C~85°C TC | Tray | - | OMAP-59xx | e0 | - | Active | 3 (168 Hours) | 289 | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | - | BOTTOM | BALL | 220 | 1.6V | 1mm | 150MHz | - | OMAP5910 | 289 | - | - | 1.6V | - | - | - | 1.675V | I2C, MMC, SDIO, UART, USB | - | - | 32kB | - | 170mA | - | 160kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM9TDMI | - | - | 16 | 32b | 6 | 25 | ARM | 16 | YES | YES | - | - | FIXED POINT | - | YES | - | 1.8V 2.75V 3.3V | - | - | 1 Core 32-Bit | No | SDRAM | USB 2.0 (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | - | - | Signal Processing; C55x, System Control; CP15 | MROM | - | - | - | NO | MULTIPLE | - | - | Keypad, LCD | 6 | - | - | 2.32mm | 19mm | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
 AM3715CUS100 Texas Instruments | 27 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | - | 423-LFBGA, FCBGA | YES | 423 | - | L2 Cache, RAM, ROM | 188 | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 1GHz | - | AM3715 | 423 | - | - | - | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.89V | 1.71V | 128MB | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 32b | - | - | ARM | - | YES | YES | - | - | FLOATING POINT | - | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | - | - | LCD | - | - | 1.4mm | - | 16mm | 16mm | 960μm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 MCIMX6QP6AVT1AA NXP USA Inc. | 2348 | - | Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6QP | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 26 | - | - | YES | YES | - | 64 | FLOATING POINT | - | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8313CVRAFFC NXP USA Inc. | 416 | - | Datasheet | 8 Weeks | - | - | - | 516-BBGA Exposed Pad | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8313 | - | S-PBGA-B516 | - | - | 1.5V | - | 0.95V | - | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | 32 | - | - | YES | YES | - | 32 | FLOATING POINT | - | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
OMAPL138EZCE4 Texas Instruments | 10 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | - | - | 361-LFBGA | YES | 361 | - | - | - | - | - | 0°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROPROCESSOR CIRCUIT | ARM926EJ-S | - | - | - | - | - | - | ARM | - | - | - | - | - | - | 456 MHz | - | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | - | - | Signal Processing; C674x, System Control; CP15 | - | 1 | - | I2C; SPI; UART; USB | - | - | Boot Security, Cryptography | - | LCD | - | SATA 3Gbps (1) | 1.3mm | - | 13mm | 13mm | 890μm | - | - | ROHS3 Compliant | Lead Free | ||
P2020NXN2KFC NXP USA Inc. | 2671 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2020 | - | S-PBGA-B689 | - | - | 1.1V | 1.05V | 1V | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | 32 | - | - | - | - | - | YES | YES | - | - | FIXED POINT | - | YES | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9N12-CU Microchip Technology | 2000 |
| Datasheet | 6 Weeks | - | - | Surface Mount | 217-LFBGA | - | 217 | - | FLASH, ROM | 105 | - | Yes | -40°C~85°C TA | Tray | 1997 | SAM9N | e1 | yes | Active | 3 (168 Hours) | 217 | - | TIN SILVER COPPER | - | - | BOTTOM | BALL | 260 | 1V | 0.8mm | 400MHz | 40 | AT91SAM9N12 | - | - | - | - | - | 11.8/3.33.3V | - | - | EBI/EMI, I2C, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 128kB | Internal | - | - | 32kB | MICROPROCESSOR | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | 32 | 32b | 6 | 26 | ARM | - | YES | YES | - | - | FIXED POINT | - | YES | - | 1.8V 3.3V | - | - | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | 4 | - | - | - | - | - | LCD, Touchscreen | - | - | - | - | 15mm | - | - | - | No SVHC | ROHS3 Compliant | - | ||
 MPC8548EVJAUJD NXP USA Inc. | 2243 | - | Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | - | Active | 3 (168 Hours) | 783 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.1V | 1mm | - | - | MPC8548 | - | R-PBGA-B783 | - | - | 1.155V | - | 1.045V | - | - | - | - | - | - | - | 1.333GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | - | 32 | - | - | 16 | - | - | YES | YES | - | 64 | FLOATING POINT | - | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | - | Signal Processing; SPE, Security; SEC | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | 3.294mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM3356BZCZ60 Texas Instruments | 42 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | - | 324-LFBGA | YES | 324 | 1.713814g | L2 Cache, RAM, ROM | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 600MHz | - | AM3356 | - | - | - | 1.1V | - | - | - | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | - | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 32b | - | - | ARM | - | YES | YES | - | - | FIXED POINT | - | YES | - | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | - | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | Cryptography, Random Number Generator | - | LCD, Touchscreen | - | - | 1.4mm | - | 15mm | 15mm | 900μm | No | - | ROHS3 Compliant | Lead Free | ||
P2020NSN2MHC NXP USA Inc. | 2078 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2020 | - | S-PBGA-B689 | - | - | 1.1V | 1.05V | 1V | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | 32 | - | - | - | - | - | YES | YES | - | - | FIXED POINT | - | YES | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
AM3715CUSA Texas Instruments | 5000 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | - | 423-LFBGA, FCBGA | YES | 423 | - | ROM | 188 | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 800MHz | - | AM3715 | 423 | - | - | 1.1V | - | - | - | 1.8V | I2C, SPI, UART, USB | 1.5V | - | 32kB | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 16b | - | - | ARM | - | YES | YES | - | - | FLOATING POINT | - | YES | 65536 | - | 4 | - | 1 Core 32-Bit | Yes | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | - | - | LCD | - | - | 1.4mm | - | 16mm | 16mm | 960μm | No | - | ROHS3 Compliant | Lead Free | ||
P1020NXN2HFB NXP USA Inc. | 500 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2006 | QorIQ P1 | - | - | Active | 3 (168 Hours) | 689 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | 1V | 1mm | - | - | P1020 | - | S-PBGA-B689 | - | - | - | 1V | - | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6S4AVM08AC NXP USA Inc. | 9800 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA | YES | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6S | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.35V | 0.8mm | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 24MHz | 64 | - | - | 16 | - | - | YES | YES | - | 32 | FIXED POINT | - | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | - | - | 1.6mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX357CJQ5C NXP USA Inc. | In Stock | - | - | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | - | 4 | - | - | -40°C~85°C TA | Tray | 2005 | i.MX35 | - | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper - with Nickel barrier | 8542.31.00.01 | - | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX357 | - | S-PBGA-B400 | Not Qualified | - | 1.47V | - | 1.33V | - | - | - | - | - | - | - | 532MHz | - | MULTIFUNCTION PERIPHERAL | ARM1136JF-S | - | 24MHz | - | - | - | 26 | - | - | YES | - | - | 16 | - | - | - | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | - | Multimedia; GPU, IPU, VFP | - | - | - | 1-WIRE; CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB | - | - | Secure Fusebox, Secure JTAG, Tamper Detection | - | Keypad, KPP, LCD | - | - | - | 1.6mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX536AVV8C NXP USA Inc. | 4 | - | - | 15 Weeks | - | - | - | 529-FBGA | YES | - | - | - | - | Automotive grade | - | -40°C~125°C TJ | Tray | 2008 | i.MX53 | e2 | - | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | 40 | MCIMX536 | - | S-PBGA-B529 | Not Qualified | - | 1.15V | 1.11.31.8/3.3V | 1.05V | - | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 27MHz | 32 | - | - | 26 | - | - | YES | YES | AEC-Q100 | 32 | FLOATING POINT | - | YES | - | 1.3V 1.8V 2.775V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, DDR2, DDR3 | USB 2.0 (2), USB 2.0 + PHY (2) | 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART | - | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | - | Keypad, LCD | - | SATA 1.5Gbps (1) | - | 1.85mm | 19mm | - | - | - | - | ROHS3 Compliant | - |