- Organization
- Memory Size
- Mounting Styles
- Package / Case
- Supply Voltage-Max
- Supply Voltage-Min
- Interface Type
- Maximum Operating Temperature
- Minimum Operating Temperature
- Supply Current-Max
- Maximum Clock Frequency
- Manufacturer
Attribute column
Manufacturer
GSI Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Brand | Clock Frequency-Max (fCLK) | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Data Rate | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Product Category | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 GS8162Z36BGB-200 GSI Technology | In Stock | - | - | - | - | YES | - | 119 | 6.5 ns | - | - | - | - | GSI TECHNOLOGY | - | GSI Technology | GS8162Z36BGB-200 | - | - | - | - | - | - | - | - | 3 | - | - | - | 524288 words | 512000 | 70 °C | - | PLASTIC/EPOXY | BGA | ROHS COMPLIANT, FPBGA-119 | - | RECTANGULAR | GRID ARRAY | Obsolete | BGA | NOT SPECIFIED | 5.59 | Compliant | Yes | - | - | - | 2.5 V | - | - | - | - | - | - | - | e1 | Yes | 3A991.B.2.B | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | - | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | - | 2.75 V | - | COMMERCIAL | 2.25 V | - | 4 | SYNCHRONOUS | - | - | - | - | 512KX36 | - | 1.99 mm | 36 | 19 b | - | 18 Mb | - | 18874368 bit | - | PARALLEL | - | ZBT SRAM | - | - | 22 mm | 14 mm | No | ||
GS832036T-166I GSI Technology | In Stock | - | - | - | - | YES | - | 100 | 8 ns | - | 166 MHz | - | - | GSI TECHNOLOGY | - | GSI Technology | GS832036T-166I | - | - | - | - | - | - | - | - | 3 | - | - | - | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | NOT SPECIFIED | 5.77 | Non-Compliant | No | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | - | 3A991.B.2.B | - | - | - | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | - | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | - | - | SYNCHRONOUS | 0.19 mA | - | - | - | 1MX36 | 3-STATE | 1.6 mm | 36 | - | - | - | 0.08 A | 37748736 bit | - | PARALLEL | COMMON | CACHE SRAM | 3.14 V | - | 20 mm | 14 mm | - | ||
GS8673ED18BK-625 GSI Technology | In Stock | - | - | - | BGA-260 | - | - | - | - | GSI Technology | - | - | 8 | - | Parallel | GSI Technology | - | 625 MHz | - | - | + 85 C | DDR | - | 0 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | 1.4 V | 1.3 V | - | - | SigmaSIO DDR-II | - | - | - | Bulk | GS8673ED18BK | - | - | - | SigmaQuad-IIIe B4 | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | 1.35 V | - | - | - | - | 72 Mbit | - | - | 2.11 A | - | 1.25 Gb/s | - | 4 M x 18 | - | - | - | 22 b | SRAM | 72 Mb | - | - | - | - | - | - | - | SRAM | - | - | No | ||
GS8321Z36E-200 GSI Technology | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 70 °C | 0 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | - | - | - | - | - | - | - | 20 b | - | 36 Mb | - | - | - | - | - | - | - | - | - | - | No | ||
GS84018AGT-150I GSI Technology | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
GS816236BGD-150 GSI Technology | In Stock | - | - | - | - | YES | - | 165 | 7.5 ns | - | - | - | - | GSI TECHNOLOGY | - | GSI Technology | GS816236BGD-150 | - | - | - | - | - | - | - | - | 3 | - | - | - | 524288 words | 512000 | 70 °C | - | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | NOT SPECIFIED | 5.56 | Compliant | Yes | - | - | - | 2.5 V | - | - | - | - | - | - | - | e1 | Yes | 3A991.B.2.B | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | - | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | unknown | 165 | R-PBGA-B165 | Not Qualified | - | 2.7 V | - | COMMERCIAL | 2.3 V | - | 4 | SYNCHRONOUS | - | - | - | - | 512KX36 | - | 1.4 mm | 36 | 19 b | - | 18 Mb | - | 18874368 bit | - | PARALLEL | - | CACHE SRAM | - | - | 15 mm | 13 mm | No | ||
GS8342R08BD-250 GSI Technology | In Stock | - | - | 10 Weeks | BGA-165 | YES | - | 165 | 0.45 ns | GSI Technology | 250 MHz | DDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342R08BD-250 | 250 MHz | 250 MHz | 1.9 V | + 70 C | DDR | 1.7 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 8 Bit | 4 MWords | 4000000 | 70 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.35 | Compliant | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaDDR-II | 1.8000 V | Commercial grade | 0 to 85 °C | Bulk | GS8342R08BD | e0 | - | 3A991.B.2.B | SigmaDDR-II B4 | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.8 V | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 36 Mbit | 1 | SYNCHRONOUS | 395 mA | - | - | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 20 Bit | SRAM | 36 Mbit | 0.175 A | 33554432 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | No | ||
GS816236DGD-200 GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | - | GSI Technology | - | - | 36 | - | Parallel | GSI Technology | - | 200 MHz | - | - | + 70 C | SDR | - | 0 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 3.6 V | 2.3 V | - | - | SyncBurst | - | - | - | Tray | GS816236DGD | - | - | - | Pipeline/Flow Through | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 18 Mbit | - | - | 210 mA | 6.5 ns | - | - | 512 k x 36 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
GS8161E36DGD-250I GSI Technology | In Stock | - | - | - | BGA-165 | - | - | - | - | GSI Technology | - | - | 36 | - | Parallel | GSI Technology | - | 250 MHz | - | - | + 85 C | SDR | - | - 40 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 3.6 V | 2.3 V | - | - | SyncBurst | - | - | - | Tray | GS8161E36DGD | - | - | - | DCD Pipeline/Flow Through | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 18 Mbit | - | - | 250 mA, 270 mA | 5.5 ns | - | - | 512 k x 36 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
GS8162Z36BD-200I GSI Technology | In Stock | - | - | - | - | YES | - | 165 | 6.5 ns | - | - | - | - | GSI TECHNOLOGY | - | GSI Technology | GS8162Z36BD-200I | - | - | - | - | - | - | - | - | - | - | - | - | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 15 MM, 1 MM PITCH, FPBGA-165 | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | NOT SPECIFIED | 5.63 | Compliant | No | - | - | - | 2.5 V | - | - | - | - | - | - | - | e0 | No | 3A991.B.2.B | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | - | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | not_compliant | 165 | R-PBGA-B165 | Not Qualified | - | 2.75 V | - | INDUSTRIAL | 2.25 V | - | 4 | SYNCHRONOUS | - | - | - | - | 512KX36 | - | 1.4 mm | 36 | 19 b | - | 18 Mb | - | 18874368 bit | - | PARALLEL | - | ZBT SRAM | - | - | 15 mm | 13 mm | No | ||
GS8640Z18GT-250 GSI Technology | In Stock | - | - | - | TQFP-100 | - | - | - | - | GSI Technology | - | SDR | 18 | - | Parallel | GSI Technology | - | 250 MHz | 153.8@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 4 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | TQFP | 3.6 V | 2.3 V | - | Synchronous | NBT SRAM | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | Tray | GS8640Z18GT | - | - | - | NBT Pipeline/Flow Through | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 100 | - | - | - | - | - | - | - | 72 Mbit | 2 | - | 230 mA, 315 mA | 6.5 ns | - | Flow-Through/Pipelined | 4 M x 18 | - | - | - | 22 Bit | SRAM | 72 Mbit | - | - | Commercial | - | - | - | - | SRAM | - | - | - | ||
GS8662T36E-200I GSI Technology | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8 V | - | - | - | - | - | 1 | - | - | - | - | - | - | - | - | - | 21 b | - | 72 Mb | - | - | - | - | - | - | - | - | - | - | No | ||
GS8673ED18BK-625S GSI Technology | In Stock | - | - | 12 Weeks | BGA-260 | YES | - | 260 | - | GSI Technology | - | - | 8 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8673ED18BK-625S | 625 MHz | - | - | + 85 C | DDR | - | 0 C | Yes | - | - | SMD/SMT | - | 4194304 words | 4000000 | 85 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Not Recommended | - | NOT SPECIFIED | 5.8 | Compliant | No | - | 1.4 V | 1.3 V | 1.35 V | - | SigmaSIO DDR-II | - | - | - | Tray | GS8673ED18BK | - | - | 3A991.B.2.B | SigmaQuad-IIIe B4 | - | 70 °C | 0 °C | - | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | - | R-PBGA-B260 | - | 1.35 V | 1.4 V | - | OTHER | 1.3 V | 72 Mbit | - | SYNCHRONOUS | 2.11 A | - | 1.25 Gb/s | - | 4 M x 18 | - | 2.3 mm | 18 | 20 b | SRAM | 72 Mb | - | 75497472 bit | - | PARALLEL | - | DDR SRAM | - | SRAM | 22 mm | 14 mm | No | ||
GS832236E-150IT GSI Technology | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | Tape & Reel | - | - | - | - | - | - | 85 °C | -40 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4 | - | - | - | - | - | - | - | - | - | 20 b | - | 36 Mb | - | - | - | - | - | - | - | - | - | - | No | ||
GS8673EQ18BK-625S GSI Technology | In Stock | - | - | 12 Weeks | BGA-260 | YES | - | 260 | - | GSI Technology | - | - | 8 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8673EQ18BK-625S | 625 MHz | - | - | + 85 C | QDR-III | - | 0 C | Yes | - | - | SMD/SMT | - | 4194304 words | 4000000 | 85 °C | - | PLASTIC/EPOXY | HBGA | HBGA, | - | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Not Recommended | - | NOT SPECIFIED | 5.78 | Compliant | No | - | 1.4 V | 1.3 V | 1.35 V | - | SigmaQuad-IIIe | - | - | - | Tray | GS8673EQ18BK | - | - | 3A991.B.2.B | SigmaQuad-IIIe B2 | - | 70 °C | 0 °C | - | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | - | R-PBGA-B260 | - | 1.35 V | 1.4 V | - | OTHER | 1.3 V | 72 Mbit | - | SYNCHRONOUS | 2.11 A | - | - | - | 4 M x 18 | - | 2.3 mm | 18 | 21 b | SRAM | 72 Mb | - | 75497472 bit | - | PARALLEL | - | DDR SRAM | - | SRAM | 22 mm | 14 mm | No | ||
GS72116AGP-7I GSI Technology | In Stock | - | - | 6 Weeks | - | YES | 44 | 44 | 7 ns | - | - | - | - | GSI TECHNOLOGY | - | GSI Technology | GS72116AGP-7I | - | - | - | - | - | - | - | - | 3 | - | - | - | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | 0.400 INCH, ROHS COMPLIANT, TSOP2-44 | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | NOT SPECIFIED | 5.71 | Compliant | Yes | - | - | - | 3.3 V | - | - | - | - | - | - | - | - | Yes | 3A991.B.2.B | - | Pure Matte Tin (Sn) | 85 °C | -40 °C | - | 8542.32.00.41 | - | CMOS | DUAL | GULL WING | 260 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | Not Qualified | 3.3 V | 3.6 V | - | INDUSTRIAL | 3 V | - | 1 | ASYNCHRONOUS | - | - | - | - | 128KX16 | - | 1.2 mm | 16 | 17 b | - | 2 Mb | - | 2097152 bit | - | PARALLEL | - | STANDARD SRAM | - | - | 18.41 mm | 10.16 mm | No | ||
GS8673EQ36BK-550S GSI Technology | In Stock | - | - | 12 Weeks | BGA-260 | YES | - | 260 | - | GSI Technology | - | - | 8 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8673EQ36BK-550S | 550 MHz | - | - | + 85 C | QDR-III | - | 0 C | Yes | - | - | SMD/SMT | - | 2097152 words | 2000000 | 85 °C | - | PLASTIC/EPOXY | HBGA | HBGA, | - | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Not Recommended | - | NOT SPECIFIED | 5.8 | Compliant | No | - | 1.4 V | 1.3 V | 1.35 V | - | SigmaQuad-IIIe | - | - | - | Tray | GS8673EQ36BK | - | - | 3A991.B.2.B | SigmaQuad-IIIe B2 | - | 70 °C | 0 °C | - | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | - | R-PBGA-B260 | - | 1.35 V | 1.4 V | - | OTHER | 1.3 V | 72 Mbit | - | SYNCHRONOUS | 2.67 A | - | - | - | 2 M x 36 | - | 2.3 mm | 36 | 20 b | SRAM | 72 Mb | - | 75497472 bit | - | PARALLEL | - | DDR SRAM | - | SRAM | 22 mm | 14 mm | No | ||
GS8321Z36GE-133I GSI Technology | In Stock | - | - | - | - | YES | - | 165 | 8.5 ns | - | 133 MHz | - | - | GSI TECHNOLOGY | - | GSI Technology | GS8321Z36GE-133I | - | - | - | - | - | - | - | - | 3 | - | - | - | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 15 X 17 MM, 1 MM PITCH, FPBGA-165 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | NOT SPECIFIED | 8.41 | - | Yes | - | - | - | 2.5 V | - | - | - | - | - | - | - | e1 | Yes | 3A991.B.2.B | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | - | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | - | - | SYNCHRONOUS | 0.21 mA | - | - | - | 1MX36 | 3-STATE | 1.5 mm | 36 | - | - | - | 0.08 A | 37748736 bit | - | PARALLEL | COMMON | ZBT SRAM | 2.3 V | - | 17 mm | 15 mm | - | ||
GS8673ET18BK-725S GSI Technology | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 70 °C | 0 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.35 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 72 Mb | - | - | - | - | - | - | - | - | - | - | No | ||
GS72116ATP-7 GSI Technology | In Stock | - | - | - | - | YES | - | 44 | 7 ns | - | - | - | - | GSI TECHNOLOGY | - | GSI Technology | GS72116ATP-7 | - | - | - | - | - | - | - | - | 3 | - | - | - | 131072 words | 128000 | 70 °C | - | PLASTIC/EPOXY | TSOP2 | TSOP2, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | NOT SPECIFIED | 8.66 | - | No | - | - | - | 3.3 V | - | - | - | - | - | - | - | e0 | - | 3A991.B.2.B | - | TIN LEAD | - | - | - | 8542.32.00.41 | - | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | Not Qualified | - | 3.6 V | - | COMMERCIAL | 3 V | - | - | ASYNCHRONOUS | - | - | - | - | 128KX16 | - | 1.2 mm | 16 | - | - | - | - | 2097152 bit | - | PARALLEL | - | STANDARD SRAM | - | - | 18.41 mm | 10.16 mm | - |