GSI Technology GS816236DGD-200
GSI Technology GS816236DGD-200
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GSI Technology GS816236DGD-200

Memory IC GS816236DGD Memory IC

Manufacturer No:

GS816236DGD-200

Manufacturer:

GSI Technology

Utmel No:

2984-GS816236DGD-200

Package:

BGA-165

ECAD Model:

Description:

GS816236DGD Memory IC GS816236DGD Series

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User Guide

Purchase & Inquiry
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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
GS816236DGD-200 information

Specifications
Product Details
GSI Technology GS816236DGD-200 technical specifications, attributes, parameters and parts with similar specifications to GSI Technology GS816236DGD-200.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    BGA-165
  • Moisture Sensitive
    Yes
  • Maximum Clock Frequency
    200 MHz
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 70 C
  • Supply Voltage-Max
    3.6 V
  • Minimum Operating Temperature
    0 C
  • Factory Pack QuantityFactory Pack Quantity
    36
  • Supply Voltage-Min
    2.3 V
  • Mounting Styles
    SMD/SMT
  • Interface Type
    Parallel
  • Manufacturer
    GSI Technology
  • Brand
    GSI Technology
  • Tradename
    SyncBurst
  • RoHS
    Details
  • Memory Types
    SDR
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    GS816236DGD
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Type
    Pipeline/Flow Through
  • Subcategory
    Memory & Data Storage
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    18 Mbit
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    210 mA
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    6.5 ns
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    512 k x 36
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    SRAM
  • Product Category

    a particular group of related products.

    SRAM
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GS816236DGD-200 Overview

You can get memory ics in a Tray case. BGA-165 case encloses it. There is 18 Mbit of memory on the chip. This part is part of the GS816236DGD series of memory devices, which play a key role in its target applications. The device is able to run from a max supply current of 210 mA , so it can be used in any environment. There is a common misconception that this component is a type of Memory & Data Storage. The device that we are talking about here is what we generally refer to as the Pipeline/Flow Through-type device.

GS816236DGD-200 Features

Package / Case: BGA-165

GS816236DGD-200 Applications

There are a lot of GSI Technology
GS816236DGD-200 Memory applications.


  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory