- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Gates | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 A2F500M3G-FG484 Microchip Technology | In Stock | - | - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | A2F500 | - | 64 kB | 500000 | - | 60 | - | - | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | - | SMD/SMT | 204 I/O | - | 6000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | 1.5000 V | - | 0 to 85 °C | Tray | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 1 Core | - | 512KB | - | - | ||
A2F500M3G-FG256 Microchip Technology | In Stock | - | - | - | FPBGA-256 | - | 256-FPBGA (17x17) | - | A2F500 | - | 64 kB | 500000 | - | 90 | - | - | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | - | SMD/SMT | 117 I/O | - | 6000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | 1.5000 V | - | 0 to 85 °C | Tray | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 1 Core | - | 512KB | - | - | ||
M2S025TS-1FGG484 Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S025 | - | 64 kB | - | - | 60 | MICROSEMI CORP | - | - | M2S025TS-1FGG484 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 267 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 25K Logic Modules | - | 27696 | 1 Core | - | 256KB | 23 mm | 23 mm | ||
A2F200M3F-1CS288 Microchip Technology | In Stock | - | - | - | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F200 | 100 MHz | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | A2F200M3F-1CS288 | 100 MHz | - | - | Microchip Technology | - | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 2000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | N | No | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | - | 0°C ~ 85°C (TJ) | Tray | A2F200 | e0 | - | TIN LEAD SILVER | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | - | S-PBGA-B288 | 78 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | OTHER | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | ||
A2F500M3G-1CSG288 Microchip Technology | In Stock | - | - | - | 288-TFBGA, CSPBGA | - | 288-CSP (11x11) | - | A2F500 | - | 64 kB | - | - | 176 | - | - | - | - | 100 MHz | - | - | Microchip Technology | - | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 6000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | - | 0°C ~ 85°C (TJ) | Tray | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 1 Core | - | 512KB | - | - | ||
M2S010T-1VFG400I Microchip Technology | In Stock | - | - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | - | 64 kB | - | - | 90 | MICROSEMI CORP | - | - | M2S010T-1VFG400I | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | 3 | SMD/SMT | 195 | 1007 LAB | 12084 LE | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 2.5, 3.3 V | - | -40 to 100 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B400 | 195 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 10K Logic Modules | - | 12084 | 1 Core | - | 256KB | 17 mm | 17 mm | ||
M2S090-1FGG484 Microchip Technology | In Stock | - | - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S090 | - | 64 kB | - | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 267 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 90K Logic Modules | - | - | 1 Core | - | 512KB | - | - | ||
A2F500M3G-1FG256 Microchip Technology | In Stock | - | - | - | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | A2F500 | 100 MHz | 64 kB | - | - | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FG256 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 117 I/O | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | - | 0 to 85 °C | Tray | A2F500 | - | - | TIN LEAD/TIN LEAD SILVER | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B256 | 66 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | OTHER | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 17 mm | 17 mm | ||
M2S060-1FCS325I Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | - | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | M2S060-1FCS325I | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 200 | 4710 LAB | 56520 LE | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | - | 56520 | 1 Core | - | 256KB | 11 mm | 11 mm | ||
A2F500M3G-1PQ208I Microchip Technology | In Stock | - | - | - | 208-BFQFP | - | 208-PQFP (28x28) | - | A2F500M3G | - | 64 kB | - | - | 24 | - | - | - | - | 100 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | 113 I/O | - | 6000 LE | - | Tray | - | - | - | - | - | - | - | Obsolete | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | 0.183425 oz | -40°C ~ 100°C (TJ) | Tray | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | 500000 | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 1 Core | - | 512KB | - | - | ||
M2S050T-1FGG484I Microchip Technology | In Stock | - | - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | - | 64 kB | - | - | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | - | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 50K Logic Modules | - | 56340 | 1 Core | - | 256KB | 23 mm | 23 mm | ||
M2S050T-FGG896 Microchip Technology | In Stock | - | - | - | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | - | 64 kB | - | - | 27 | MICROSEMI CORP | - | - | M2S050T-FGG896 | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | - | SMD/SMT | 377 I/O | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 2.31 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 50K Logic Modules | - | 56340 | 1 Core | - | 256KB | 31 mm | 31 mm | ||
M2S005S-1FGG484T2 Microchip Technology | In Stock | - | - | - | BGA-484 | - | 484-FPBGA (23x23) | - | M2S005 | - | 64 kB | - | 191 kbit | 60 | MICROSEMI CORP | - | - | M2S005S-1FGG484T2 | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | - | SMD/SMT | 209 I/O | 505 LAB | 6060 LE | - | Tray | - | - | , | - | - | - | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 250 | - | compliant | - | - | - | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 5K Logic Modules | - | - | 1 Core | - | 128KB | - | - | ||
M2S025T-1FGG484I Microchip Technology | In Stock | - | - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S025 | - | 64 kB | - | - | 60 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 267 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | -40 to 100 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | ||
M2S010-1VFG400 Microchip Technology | In Stock | - | - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | - | 64 kB | - | - | 90 | MICROSEMI CORP | - | - | M2S010-1VFG400 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 195 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B400 | 195 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 10K Logic Modules | - | 12084 | 1 Core | - | 256KB | 17 mm | 17 mm | ||
M2S050-1VFG400I Microchip Technology | In Stock | - | - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S050 | - | 64 kB | - | - | 90 | MICROSEMI CORP | - | - | M2S050-1VFG400I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 207 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | - | 56340 | 1 Core | - | 256KB | 17 mm | 17 mm | ||
A2F500M3G-CS288 Microchip Technology | In Stock | - | - | - | 288-TFBGA, CSPBGA | - | 288-CSP (11x11) | - | A2F500 | - | 64 kB | - | - | 176 | - | - | - | - | 80 MHz | - | - | Microchip Technology | - | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 6000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | - | 0°C ~ 85°C (TJ) | Tray | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 1 Core | - | 512KB | - | - | ||
M2S005S-1VFG400T2 Microchip Technology | In Stock | - | - | - | BGA-400 | - | 400-VFBGA (17x17) | - | M2S005 | - | 64 kB | - | 191 kbit | 90 | - | - | - | - | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | Yes | - | SMD/SMT | 171 I/O | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | 0.652216 oz | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 5K Logic Modules | - | - | 1 Core | - | 128KB | - | - | ||
M2S010TS-1VF256I Microchip Technology | In Stock | - | - | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | - | 64 kB | - | - | 119 | MICROSEMI CORP | - | - | M2S010TS-1VF256I | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 138 | 1007 LAB | 12084 LE | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 10K Logic Modules | - | 12084 | 1 Core | - | 256KB | 14 mm | 14 mm | ||
M2S060T-1FCSG325 Microchip Technology | In Stock | - | - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | - | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | M2S060T-1FCSG325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | - | 56520 | 1 Core | - | 256KB | 11 mm | 11 mm |