Microchip Technology M2S010T-1VFG400I

SoC SmartFusion2 Series System On Chip

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

The center distance from one pole to the next.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

An indicator of formal certification of qualifications.

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

In electronic components, the parameter "Architecture" refers to the overall design and structure of the component. It encompasses the arrangement of internal components, the layout of circuitry, and the physical form of the component. The architecture of an electronic component plays a crucial role in determining its functionality, performance, and compatibility with other components in a system. Different architectures can result in variations in power consumption, speed, size, and other key characteristics of the component. Designers often consider the architecture of electronic components carefully to ensure optimal performance and integration within a larger system.

Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

Speed grade is a specification in electronic components that indicates the maximum operating speed at which the component can reliably function. It is commonly used for integrated circuits, particularly in digital logic devices and programmable logic devices. The speed grade is typically denoted by a number or letter code that correlates to the maximum frequency or propagation delay of the device, influencing its performance in high-speed applications. Components with higher speed grades are capable of faster processing and lower signal delay compared to those with lower grades.

Primary attributes in electronic components refer to the essential characteristics that define the performance and functionality of the component. These attributes typically include parameters such as voltage rating, current rating, resistance, capacitance, and power dissipation. Understanding these primary attributes is crucial for selecting the appropriate component for specific applications and ensuring reliable operation within the desired electrical specifications.

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

Flash size refers to the amount of non-volatile memory available in an electronic component, typically measured in bytes, kilobytes, megabytes, or gigabytes. It determines how much data or instructions can be stored permanently even when power is removed. Flash memory is commonly used in devices such as microcontrollers, smartphones, USB drives, and solid-state drives to store firmware, applications, and user data. The flash size can significantly impact the functionality and performance of a device, influencing how many applications can be installed or how much data can be retained.