- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Housing Material | Number of Terminals | Base Product Number | Brand | Breakdown Voltage / V | Clock Frequency-Max | Contact Materials | Contact Sizes | Data Converters | Data RAM Size | Data RAM Type | Development Kit | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of Elements | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Processor Series | Product Status | Reflow Temperature-Max (s) | Reverse Stand-off Voltage | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Voltage Rating DC | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Contact Finish | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Operating Frequency | Operating Supply Voltage | Polarity | Panel Cutout Dimensions | Power Supplies | Temperature Grade | Interface | Leakage Current | Oscillator Type | Element Configuration | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Power Line Protection | Core Size | Program Memory Size | Connectivity | Output Power | Max Reverse Leakage Current | Number of Decks | Clamping Voltage | Architecture | Data Bus Width | Peak Pulse Current | Max Surge Current | Peak Pulse Power | Number of Inputs | Operating Force | Direction | Organization | Test Current | Seated Height-Max | Programmable Logic Type | Product Type | Operating Temperature Range | Contact Timing | EEPROM Size | Total RAM Bits | Reverse Breakdown Voltage | Index Stops | Circuit per Deck | Depth Behind Panel | Speed Grade | Number of Poles per Deck | Angle of Throw | Sensitivity | Number of ADC Channels | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Bidirectional Channels | Number of Equivalent Gates | Flash Size | Min Breakdown Voltage | Module Capacity | Features | Product Category | Device Core | Length | Width | Actuator Length | Radiation Hardening | REACH SVHC | Flammability Rating | Ratings |
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![]() M2S010T-VF400I Microchip | 31 |
| - | Production (Last Updated: 1 month ago) | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | - | 400 | SJT5 | - | - | - | - | - | - | 64 kB | - | - | - | - | - | MICROSEMI CORP | - | - | - | Microsemi Corporation | M2S010T-VF400I | 166 MHz | - | - | - | Amphenol PCD | - | - | - | - | SMD/SMT | - | - | 195 | - | 12084 LE | - | - | Box | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 30 | - | 5.81 | Non-Compliant | No | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | SJT | 4.144 L x 0.885 W x 0.900 H (105.26mm x 22.48mm x 22.86mm) | e0 | - | Rail | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | - | S-PBGA-B400 | 195 | Not Qualified | - | - | - | - | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | 195 | - | - | - | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | 12084 | 1 Core | - | - | 256KB | - | 8 | - | - | - | 17 mm | 17 mm | - | - | - | - | - | ||
![]() M2S060-FGG484 Microchip | 2112 |
| - | Production (Last Updated: 2 months ago) | - | - | 484-BGA | - | - | 484-FPBGA (23x23) | - | - | - | M2S060 | Microchip Technology / Atmel | - | - | - | - | - | 64 kB | - | - | - | - | 60 | - | - | - | - | Microchip | - | 166 MHz | - | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | - | - | 267 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | SmartFusion2 | 1.2 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | SoC FPGA | - | - | - | - | - | - | - | - | STD | - | - | - | - | FPGA - 60K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - | SoC FPGA | - | - | - | - | - | - | - | - | ||
![]() PIC32CX1025SG41128-I/Z2X Microchip Technology | 473 | - | - | - | - | - | TQFP-128 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | EV06X38A | - | - | 1000 | - | CAN, Ethernet, USB | - | - | - | - | 120 MHz | - | - | + 85 C | Microchip Technology | - | - 40 C | - | - | SMD/SMT | - | - | 99 I/O | - | - | - | - | Tray | - | - | - | - | - | - | - | PIC32CX | Active | - | - | - | Details | - | - | - | - | 3.63 V | 1.71 V | - | - | - | - | - | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.71 V to 3.63 V | - | - | - | - | - | - | - | - | - | - | - | - | - | Flash | - | - | 1 MB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - 40 C to + 85 C | - | - | - | - | - | - | - | - | - | - | - | 32 Channel | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS025T-FCVG484I Microchip Technology | 60 |
| - | - | - | - | FCVG-484 | - | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | - | + 100 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | MSL 3 - 168 hours | - | 108 I/O | - | 23000 LE | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | - | - | - | 230.4KB | - | RISC-V | DMA, PCI, PWM | - | - | - | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1843.2Kbit | - | - | - | - | - | - | - | - | - | FPGA - 23K Logic Modules | - | - | 5 Core | - | - | 128KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() A2F060M3E-1FG256I Microchip | In Stock | - | - | - | - | - | - | YES | - | - | - | - | 256 | - | - | - | 100 MHz | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | Microsemi Corporation | A2F060M3E-1FG256I | - | - | - | - | - | - | - | - | 3 | - | - | - | - | - | - | - | - | - | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | - | 20 | - | 5.84 | - | No | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | - | S-PBGA-B256 | 66 | Not Qualified | - | - | - | - | - | 1.5,1.8,2.5,3.3 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 66 | - | - | 1536 CLBS, 60000 GATES | - | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1536 | 1536 | - | - | 60000 | - | - | - | - | - | - | 17 mm | 17 mm | - | - | - | - | - | ||
![]() A2F200M3F-CSG288I Microchip | In Stock | - | - | - | External | - | 288-TFBGA, CSPBGA | - | - | 288-CSP (11x11) | ABS | ABS | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 31, FPGA - 78 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | Grey | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | STD | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | - | - | - | 256KB | - | - | - | - | - | - | 80 mm | - | - | No SVHC | UL94 HB | IP65 | ||
![]() M2S010T-VFG400I Microchip | 36 |
| - | - | Surface Mount | - | 400-LFBGA | YES | 2 | 400-VFBGA (17x17) | - | - | 400 | M2S010 | - | 12.2 V | - | - | - | - | 64 kB | - | - | - | - | - | MICROSEMI CORP | - | - | - | Microsemi Corporation | M2S010T-VFG400I | 166 MHz | - | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | - | 1 | 195 | - | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 40 | 11 V | 5.77 | Compliant | Yes | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | 150 °C | -55 °C | Zener | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | - | - | S-PBGA-B400 | 195 | Not Qualified | - | - | 11 V | Bidirectional | - | 1.2 V | - | - | 5 µA | - | Single | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | No | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 5 µA | - | 18.2 V | MCU, FPGA | - | 82.4 A | 82.4 A | 1.5 kW | 195 | - | Bidirectional | - | 1 mA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | 12.2 V | - | - | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | 12084 | 1 Core | 1 | - | 256KB | 12.2 V | - | - | - | - | 17 mm | 17 mm | - | No | - | - | - | ||
![]() M2S005-1VF256 Microchip | 11 |
| - | - | - | Panel Mount | 256-LFBGA | - | - | 256-FPBGA (14x14) | - | - | - | M2S005 | - | - | - | Silver Alloy | - | - | 64 kB | - | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | - | - | SMD/SMT | - | - | 161 | - | 6060 LE | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 28V | 0°C ~ 85°C (TJ) | - | 44 | - | - | Active | - | 4 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1A (AC/DC) | -- | Solder Lug | - | - | - | Flatted (6.35mm Dia) | - | - | - | -- | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | - | - | - | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | -- | - | MCU, FPGA | - | - | - | - | - | 5.761 ~ 83gfm | - | - | - | - | - | - | - | Shorting (MBB) | - | - | - | Fixed | 3P4T | -- | - | 3 | 30° | - | - | FPGA - 5K Logic Modules | - | - | 1 Core | - | - | 128KB | - | - | Shaft and Panel Sealed | - | - | - | - | 11.10mm | - | - | - | - | ||
![]() A2F200M3F-1FGG256I Microchip | 31 | - | - | - | - | - | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | - | 256 | A2F200 | - | - | 100 MHz | - | - | - | - | - | - | 200000 | 200000 | - | MICROSEMI CORP | - | - | - | ABB | ACH580-BCR-027A-6+E213+K465+L512 | - | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | 3 | - | - | - | MCU - 25, FPGA - 66 | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 30 | - | 5.24 | - | Yes | - | - | - | 1.575 V | 1.425 V | 1.5 V | - | 1.5000 V | - | -40 to 100 °C | - | SmartFusion® | - | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | - | S-PBGA-B256 | 66 | Not Qualified | - | - | - | - | - | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | - | - | - | - | 100MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | - | - | MCU, FPGA | - | - | - | - | 66 | - | - | 4608 CLBS, 200000 GATES | - | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | 1 | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | - | - | 200000 | 256KB | - | - | - | - | - | 17 mm | 17 mm | - | - | - | - | - | ||
![]() A2F200M3F-1FG256I Microchip | 45 | - | - | - | - | - | 256-LBGA | - | - | 256-FPBGA (17x17) | - | - | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 25, FPGA - 66 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | - | - | - | 256KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() A2F500M3G-CSG288 Microchip | 45 |
| - | - | - | - | 288-TFBGA, CSPBGA | - | - | 288-CSP (11x11) | - | - | - | A2F500 | - | - | - | - | - | - | - | - | - | 500000 | - | - | - | - | - | - | - | - | - | - | 1.575 V | - | Microchip Technology | 1.425 V | - | - | - | - | - | - | MCU - 31, FPGA - 78 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | 1.5000 V | - | 0 to 85 °C | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | - | - | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | STD | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | - | - | - | 512KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S025T-FG484I Microchip | 2939 |
| - | Production (Last Updated: 2 months ago) | - | - | 484-BGA | - | - | 484-FPBGA (23x23) | - | - | - | M2S025 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | - | - | - | 267 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | Non-Compliant | - | - | - | - | - | - | - | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | STD | - | - | - | - | FPGA - 25K Logic Modules | - | - | - | - | - | 256KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S090-1FGG484I Microchip | 2355 |
| - | - | - | - | 484-BGA | - | - | 484-FPBGA (23x23) | - | - | - | M2S090 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | - | - | - | 267 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | - | - | FPGA - 90K Logic Modules | - | - | - | - | - | 512KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S060-1FG676I Microchip | 2505 |
| - | Production (Last Updated: 2 months ago) | - | - | 676-BGA | - | - | 676-FBGA (27x27) | - | - | - | M2S060 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | 387 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | Non-Compliant | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | - | - | 256KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S025-1VF256 Microchip | 2149 |
| - | Production (Last Updated: 2 months ago) | - | - | 256-LFBGA | - | - | 256-FPBGA (14x14) | - | - | - | M2S025 | - | - | - | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | - | - | SMD/SMT | - | - | 138 | - | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | Non-Compliant | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() MPFS160T-FCVG484T2 Microchip | In Stock | - | - | - | - | - | 484-BFBGA, FCBGA | - | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | MCU - 136, FPGA - 108 | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TJ) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4125MB | - | RISC-V | DMA, PCI, PWM | - | - | - | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | - | - | - | - | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | - | - | - | - | 128KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() PIC32MZ1025W104132-I/NX Microchip | 139 | - | - | - | - | Surface Mount | DQFN-132 | - | - | 132-VQFN (10x10) | - | - | - | PIC32MZ1025 | Microchip Technology / Atmel | - | - | - | - | A/D 20x12b SAR | 256 kB | SRAM | - | - | - | 168 | - | CAN, I2C, SPI, UART | - | - | Microchip | - | 80 MHz | 54 Mbps | - | + 85 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | MSL 3 - 168 hours | - | 64 I/O | - | - | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | 88 mA | 287 mA | 3.63 V | 2.97 V | - | - | - | - | -40°C ~ 85°C (TA) | Tray | PIC® 32MZ | - | - | - | Wi-Fi | - | - | - | - | - | - | - | Wireless & RF Integrated Circuits | Si | - | - | - | - | - | - | - | - | - | - | - | - | 2.4 GHz | - | - | - | - | - | CAN, Ethernet, I2C, I2S, SPI, UART, USB | - | Internal | - | 200MHz | 256K x 8 | 2.97V ~ 3.63V | MIPS32® M-Class | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | Flash | - | 32-Bit Single-Core | 1MB | CANbus, Ethernet, I²C, IrDA, SPI, SQI, UART/USART, USB OTG | 21.5 dBm | - | - | - | - | 32bit | - | - | - | - | - | - | - | - | - | - | RF System on a Chip - SoC | - | - | - | - | - | - | - | - | - | - | - | - 76 dBm | 20 Channel | - | - | - | - | - | - | - | - | - | - | RF System on a Chip - SoC | PIC32 MZ | - | - | - | - | - | - | - | ||
![]() M2S025T-VFG400 Microchip | 2864 |
| - | - | - | - | 400-LFBGA | - | - | 400-VFBGA (17x17) | - | - | - | M2S025 | - | - | - | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | - | - | - | - | - | 207 | - | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - | - | - | - | - | - | - | - | - | - | ||
![]() M2S060TS-1FG676I Microchip | 2897 |
| - | Production (Last Updated: 2 months ago) | - | - | 676-BGA | YES | - | 676-FBGA (27x27) | - | - | 676 | M2S060 | - | - | - | - | - | - | 64 kB | - | - | - | - | - | MICROSEMI CORP | - | - | - | Microsemi Corporation | M2S060TS-1FG676I | 166 MHz | - | - | - | Microchip Technology | - | - | - | 3 | - | - | - | 387 | - | 56520 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | - | 5.88 | Non-Compliant | No | - | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | - | S-PBGA-B676 | 387 | Not Qualified | - | - | - | - | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | 387 | - | - | - | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 56520 | 1 Core | - | - | 256KB | - | - | - | - | - | 27 mm | 27 mm | - | - | - | - | - | ||
![]() M2S060-FG676I Microchip | 2319 |
| - | Production (Last Updated: 2 months ago) | - | - | 676-BGA | - | - | 676-FBGA (27x27) | - | - | - | M2S060 | - | - | - | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | - | PEI-Genesis | - | - | - | - | - | - | - | 387 | - | 56520 LE | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | Non-Compliant | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | - | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | - | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - | - | - | - | - | - | - | - | - | - |