Microchip M2S025-1VF256
Microchip M2S025-1VF256
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Microchip M2S025-1VF256

SoC SmartFusion®2 Series System On Chip

Manufacturer No:

M2S025-1VF256

Manufacturer:

Microchip

Utmel No:

1610-M2S025-1VF256

Package:

256-LFBGA

ECAD Model:

Description:

0°C ~ 85°C (TJ) System On Chip SmartFusion®2 Series

Quantity:

Unit Price: $124.129460

Ext Price: $124.13

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 2149

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $124.129460

    $124.13

  • 10

    $117.103264

    $1,171.03

  • 100

    $110.474778

    $11,047.48

  • 500

    $104.221488

    $52,110.74

  • 1000

    $98.322159

    $98,322.16

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
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  • Individual packageStep4:Individual package
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M2S025-1VF256 information

Specifications
Product Details
Microchip M2S025-1VF256 technical specifications, attributes, parameters and parts with similar specifications to Microchip M2S025-1VF256.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    Production (Last Updated: 2 months ago)
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    256-LFBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    256-FPBGA (14x14)
  • RoHS
    Non-Compliant
  • Number of I/Os
    138
  • Package
    Tray
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    M2S025
  • Mfr
    Microchip Technology
  • Product Status
    Active
  • L1 Cache Instruction Memory
    -
  • Maximum Clock Frequency
    166 MHz
  • Number of Logic Elements
    27696 LE
  • Mounting Styles
    SMD/SMT
  • L1 Cache Data Memory
    -
  • Data RAM Size
    64 kB
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 85°C (TJ)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    SmartFusion®2
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    166MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    64KB
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-M3
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    DDR, PCIe, SERDES
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    256 kB
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Architecture

    In electronic components, the parameter "Architecture" refers to the overall design and structure of the component. It encompasses the arrangement of internal components, the layout of circuitry, and the physical form of the component. The architecture of an electronic component plays a crucial role in determining its functionality, performance, and compatibility with other components in a system. Different architectures can result in variations in power consumption, speed, size, and other key characteristics of the component. Designers often consider the architecture of electronic components carefully to ensure optimal performance and integration within a larger system.

    MCU, FPGA
  • Primary Attributes

    Primary attributes in electronic components refer to the essential characteristics that define the performance and functionality of the component. These attributes typically include parameters such as voltage rating, current rating, resistance, capacitance, and power dissipation. Understanding these primary attributes is crucial for selecting the appropriate component for specific applications and ensuring reliable operation within the desired electrical specifications.

    FPGA - 25K Logic Modules
  • Number of Cores
    1 Core
  • Flash Size

    Flash size refers to the amount of non-volatile memory available in an electronic component, typically measured in bytes, kilobytes, megabytes, or gigabytes. It determines how much data or instructions can be stored permanently even when power is removed. Flash memory is commonly used in devices such as microcontrollers, smartphones, USB drives, and solid-state drives to store firmware, applications, and user data. The flash size can significantly impact the functionality and performance of a device, influencing how many applications can be installed or how much data can be retained.

    256KB
0 Similar Products Remaining

This SoC is built on ARM® Cortex®-M3 core processor(s).

On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be 0°C ~ 85°C (TJ) on average for this SoC meaning.In addition, this SoC security combines FPGA - 25K Logic Modules.There is a flash of 256KB on it.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

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