Filters
  • Package
  • Series
  • Mfr
  • Product Status
  • Package / Case
  • Number of I/Os
  • Operating Temperature
  • Peripherals
  • Supplier Device Package
  • Connectivity
  • Core Processor
  • Speed

Attribute column

Manufacturer

Microchip Embedded - System On Chip (SoC)

View Mode:
873 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Lifecycle Status

Mounting Type

Package / Case

Surface Mount

Mounting Feature

Contact Shape

Shell Material

Supplier Device Package

Insert Material

Number of Terminals

Base Product Number

Contact Finish Mating

Contact Sizes

Data RAM Size

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Operating Supply Voltage

Maximum Operating Temperature

Mfr

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitivity Levels

Mounting Styles

MSL

Number of I/Os

Number of Logic Elements

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Primary Material

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Shipping Restrictions

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Typical Operating Supply Voltage

Voltage Rated

Voltage, Rating

Operating Temperature

Packaging

Series

Size / Dimension

Tolerance

JESD-609 Code

Termination

Temperature Coefficient

Connector Type

Type

Number of Positions

Terminal Finish

Color

Applications

Additional Feature

HTS Code

Capacitance

Fastening Type

Subcategory

Contact Type

Current Rating (Amps)

Technology

Terminal Position

Orientation

Terminal Form

Shielding

Peak Reflow Temperature (Cel)

Ingress Protection

Terminal Pitch

Reach Compliance Code

Frequency

Time@Peak Reflow Temperature-Max (s)

Frequency Stability

Shell Finish

Shell Size - Insert

JESD-30 Code

Number of Outputs

Qualification Status

Housing Color

Operating Supply Voltage

ESR (Equivalent Series Resistance)

Lead Spacing

Power Supplies

Note

Load Capacitance

Speed

RAM Size

Operating Mode

Shell Size, MIL

Lead Style

Core Processor

Frequency Tolerance

Peripherals

Program Memory Size

Connectivity

Architecture

Number of Inputs

Seated Height-Max

Programmable Logic Type

Includes

Total RAM Bits

Speed Grade

Primary Attributes

Number of Logic Cells

Number of Cores

Flash Size

Module Capacity

Features

Height Seated (Max)

Length

Width

Thickness (Max)

Contact Finish Thickness - Mating

Material Flammability Rating

Ratings

2466
  • 1:$172.210857
  • 10:$162.463073
  • 100:$153.267050
  • 500:$144.591556
  • View all price
-

Production (Last Updated: 2 months ago)

-

325-TFBGA, FCBGA

YES

-

-

-

325-FCBGA (11x11)

-

325

M2S060

-

-

64 kB

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S060-1FCSG325I

166 MHz

-

-

KYOCERA AVX

-

-

3

-

-

200

56520 LE

Bulk

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

-

Active

-

5.8

Compliant

Yes

-

1.26 V

1.14 V

1.2 V

-

-

-

-40°C ~ 100°C (TJ)

-

*

-

-

e1

-

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

LG-MIN, WD-MIN

8542.39.00.01

-

-

Field Programmable Gate Arrays

-

-

CMOS

BOTTOM

-

BALL

-

250

-

0.5 mm

compliant

-

40

-

-

-

S-PBGA-B325

200

Not Qualified

-

-

-

-

1.2 V

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

FPGA - 60K Logic Modules

56520

1 Core

256KB

-

-

-

11 mm

11 mm

-

-

-

-

2939
  • 1:$152.067631
  • 10:$143.460029
  • 100:$135.339650
  • 500:$127.678915
  • View all price
-

Production (Last Updated: 2 months ago)

-

484-BGA

-

-

-

-

484-FPBGA (23x23)

-

-

M2S025

-

-

-

-

-

-

-

-

-

-

1.26 V

-

Microchip Technology

1.14 V

-

-

-

-

267

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

Non-Compliant

-

-

-

-

-

1.2000 V

-

-

-40 to 100 °C

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

STD

FPGA - 25K Logic Modules

-

-

256KB

-

-

-

-

-

-

-

-

-

2355
  • 1:$379.572548
  • 10:$358.087309
  • 100:$337.818216
  • 500:$318.696431
  • View all price
-

-

-

484-BGA

-

-

-

-

484-FPBGA (23x23)

-

-

M2S090

-

-

-

-

-

-

-

-

-

-

1.26 V

-

Microchip Technology

1.14 V

-

-

-

-

267

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

1.2000 V

-

-

-40 to 100 °C

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

1

FPGA - 90K Logic Modules

-

-

512KB

-

-

-

-

-

-

-

-

-

2505
  • 1:$244.332366
  • 10:$230.502232
  • 100:$217.454936
  • 500:$205.146166
  • View all price
-

Production (Last Updated: 2 months ago)

-

676-BGA

-

-

-

-

676-FBGA (27x27)

-

-

M2S060

-

-

-

-

-

-

-

-

-

-

-

-

Microchip Technology

-

-

-

-

-

387

-

Tray

-

-

-

-

-

-

-

-

Active

-

-

Non-Compliant

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

-

256KB

-

-

-

-

-

-

-

-

-

M2S025-1VF256
M2S025-1VF256

Microchip

2149
  • 1:$124.129460
  • 10:$117.103264
  • 100:$110.474778
  • 500:$104.221488
  • View all price
-

Production (Last Updated: 2 months ago)

-

256-LFBGA

-

-

-

-

256-FPBGA (14x14)

-

-

M2S025

-

-

64 kB

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

SMD/SMT

-

138

27696 LE

Tray

-

-

-

-

-

-

-

-

Active

-

-

Non-Compliant

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 25K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

-

-

-

2009
  • 1:$153.474342
  • 10:$144.787115
  • 100:$136.591618
  • 500:$128.860017
  • View all price
-

Production (Last Updated: 2 months ago)

Free Hanging (In-Line)

325-TFBGA, FCBGA

-

-

Circular

Aluminum

325-FCBGA (11x11)

-

-

D38999/26ZA

-

22D

64 kB

-

-

-

-

-

-

166 MHz

-

-

Amphenol Aerospace Operations

-

-

-

-

-

200

56520 LE

Bulk

-

-

-

-

-

-

-

-

Active

-

-

Non-Compliant

-

-

-

-

-

-

-

-

-65°C ~ 175°C

-

Military, MIL-DTL-38999 Series III, Tri-Start™ TV

-

-

-

-

-

Plug Housing

For Female Sockets

6

-

-

-

-

-

-

Threaded

-

Crimp

-

-

-

A

-

Shielded

-

Environment Resistant

-

-

-

-

-

Zinc Nickel

9-35

-

-

-

Black

-

-

-

-

Contacts Not Included

-

166MHz

64KB

-

A

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

1 Core

256KB

-

Coupling Nut, Self Locking

-

-

-

-

-

-

-

2611
  • 1:$487.987733
  • 10:$460.365786
  • 100:$434.307345
  • 500:$409.723911
  • View all price
-

-

Surface Mount, MLCC

1808 (4520 Metric)

-

-

-

-

484-FBGA (19x19)

-

-

M2S150

-

-

64 kB

-

-

-

-

-

-

166 MHz

-

-

Vishay Vitramon

-

-

-

-

-

273

146124 LE

Tape & Reel (TR)

-

-

-

-

-

-

-

-

Obsolete

-

-

-

-

-

-

-

-

-

1500V (1.5kV)

-

-55°C ~ 125°C

-

VJ OMD

0.186 L x 0.080 W (4.72mm x 2.03mm)

±5%

-

-

C0G, NP0

-

-

-

-

-

Boardflex Sensitive

-

-

12 pF

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 150K Logic Modules

-

1 Core

512KB

-

Soft Termination, High Voltage

-

-

-

0.086 (2.18mm)

-

-

-

M2S060-FG484I
M2S060-FG484I

Microchip

2686
  • 1:$208.609875
  • 10:$196.801769
  • 100:$185.662046
  • 500:$175.152874
  • View all price
-

Production (Last Updated: 2 months ago)

-

484-BGA

-

-

-

-

484-FPBGA (23x23)

-

-

M2S060

-

-

64 kB

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

-

267

56520 LE

Tray

-

-

-

-

-

-

-

-

Active

-

-

Non-Compliant

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

-

-

-

2149
  • 1:$366.307124
  • 10:$345.572758
  • 100:$326.012036
  • 500:$307.558525
  • View all price
-

-

-

484-BGA

-

-

-

-

484-FPBGA (23x23)

-

-

M2S090

-

-

64 kB

-

-

-

-

-

-

166 MHz

-

-

Microchip Technology

-

-

-

-

-

267

86316 LE

Tray

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

SmartFusion®2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 90K Logic Modules

-

1 Core

512KB

-

-

-

-

-

-

-

-

-

M2S060-FG676I
M2S060-FG676I

Microchip

2319
  • 1:$218.364489
  • 10:$206.004235
  • 100:$194.343618
  • 500:$183.343036
  • View all price
-

Production (Last Updated: 2 months ago)

-

676-BGA

-

-

-

-

676-FBGA (27x27)

-

-

M2S060

-

-

64 kB

-

-

-

-

-

-

166 MHz

-

-

PEI-Genesis

-

-

-

-

-

387

56520 LE

Bulk

-

-

-

-

-

-

-

-

Active

-

-

Non-Compliant

-

-

-

-

-

-

-

-

-40°C ~ 100°C (TJ)

-

*

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

-

-

-

2881
  • 1:$169.095647
  • 10:$159.524195
  • 100:$150.494524
  • 500:$141.975966
  • View all price
-

Production (Last Updated: 2 months ago)

Free Hanging (In-Line)

484-BGA

-

-

-

Aluminum Alloy

484-FPBGA (23x23)

-

-

KPT06

Gold

-

-

-

-

-

-

-

-

-

-

-

ITT Cannon, LLC

-

-

-

-

-

267

-

Bulk

-

-

-

-

-

-

-

Metal

Active

-

-

Non-Compliant

-

-

-

-

-

-

-

1000VAC, 1400VDC

-55°C ~ 125°C

-

KPT

-

-

-

Solder Cup

-

Plug, Female Sockets

-

21

-

Olive Drab

-

-

-

-

Bayonet Lock

-

-

13A

-

-

N (Normal)

-

-

-

Environment Resistant

-

-

-

-

-

Olive Drab Cadmium

22-21

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 25K Logic Modules

-

-

256KB

-

Potted

-

-

-

-

50.0µin (1.27µm)

-

-

2187
  • 1:$430.475089
  • 10:$406.108575
  • 100:$383.121297
  • 500:$361.435186
  • View all price
-

-

-

536-LFBGA, CSPBGA

-

-

-

-

536-CSPBGA (16x16)

-

-

M2S150

-

-

64 kB

-

-

-

-

-

-

166 MHz

-

-

KYOCERA AVX

-

-

-

-

-

293

146124 LE

Bulk

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

0°C ~ 85°C (TJ)

-

*

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 150K Logic Modules

-

1 Core

512KB

-

-

-

-

-

-

-

-

-

2095
  • 1:$264.945050
  • 10:$249.948160
  • 100:$235.800151
  • 500:$222.452973
  • View all price
-

-

Surface Mount

4-SMD, No Lead

-

-

-

-

896-FBGA (31x31)

-

-

M2S050

-

-

64 kB

-

-

-

-

-

-

166 MHz

-

-

Suntsu Electronics, Inc.

-

-

-

SMD/SMT

-

377

56340 LE

Bulk

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 85°C

-

SXT224

0.098 L x 0.079 W (2.50mm x 2.00mm)

-

-

-

-

-

MHz Crystal

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

12 MHz

-

±15ppm

-

-

-

-

-

-

-

120 Ohms

-

-

-

10pF

166MHz

64KB

Fundamental

-

-

ARM® Cortex®-M3

±15ppm

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 50K Logic Modules

-

1 Core

256KB

-

-

0.026 (0.65mm)

-

-

-

-

-

-

M2S060-VF400
M2S060-VF400

Microchip

2641
  • 1:$165.058017
  • 10:$155.715110
  • 100:$146.901048
  • 500:$138.585894
  • View all price
-

Production (Last Updated: 2 months ago)

Panel Mount

400-LFBGA

-

Flange

-

Aluminum Alloy

400-VFBGA (17x17)

-

-

CB2

Silver

-

64 kB

-

-

-

-

-

-

166 MHz

-

-

ITT Cannon, LLC

-

-

-

-

-

207

56520 LE

Bulk

-

-

-

-

-

-

-

Metal

Active

-

-

Non-Compliant

-

-

-

-

-

-

-

50V

-55°C ~ 125°C

-

MIL-DTL-5015, CB

-

-

-

Crimp

-

Receptacle, Male Pins

-

22

-

Black

-

-

-

-

Reverse Bayonet Lock

-

-

22A, 41A

-

-

N (Normal)

-

-

-

IP67 - Dust Tight, Waterproof

-

-

-

-

-

Black Zinc Cobalt

28-11

-

-

-

-

-

-

-

-

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

-

-

-

FPGA - 60K Logic Modules

-

1 Core

256KB

-

-

-

-

-

-

-

-

-

31
-

Production (Last Updated: 1 month ago)

-

400-LFBGA

YES

-

-

-

400-VFBGA (17x17)

-

400

SJT5

-

-

64 kB

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S010T-VF400I

166 MHz

-

-

Amphenol PCD

-

-

-

SMD/SMT

-

195

12084 LE

Box

PLASTIC/EPOXY

LFBGA

VFBGA-400

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

-

Active

30

5.81

Non-Compliant

No

-

1.26 V

1.14 V

1.2 V

-

-

-

-40°C ~ 100°C (TJ)

-

SJT

4.144 L x 0.885 W x 0.900 H (105.26mm x 22.48mm x 22.86mm)

-

e0

-

-

-

Rail

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

-

-

Field Programmable Gate Arrays

-

-

CMOS

BOTTOM

-

BALL

-

240

-

0.8 mm

not_compliant

-

-

-

-

-

S-PBGA-B400

195

Not Qualified

-

-

-

-

1.2 V

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

FPGA - 10K Logic Modules

12084

1 Core

256KB

8

-

-

17 mm

17 mm

-

-

-

-

2897
  • 1:$277.613498
  • 10:$261.899526
  • 100:$247.075025
  • 500:$233.089646
  • View all price
-

Production (Last Updated: 2 months ago)

-

676-BGA

YES

-

-

-

676-FBGA (27x27)

-

676

M2S060

-

-

64 kB

-

MICROSEMI CORP

-

-

Microsemi Corporation

M2S060TS-1FG676I

166 MHz

-

-

Microchip Technology

-

-

3

-

-

387

56520 LE

Tray

PLASTIC/EPOXY

BGA

FBGA-676

BGA676,26X26,40

SQUARE

GRID ARRAY

Active

-

Active

30

5.88

Non-Compliant

No

-

1.26 V

1.14 V

1.2 V

-

-

-

-40°C ~ 100°C (TJ)

-

SmartFusion®2

-

-

e0

-

-

-

-

-

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

-

-

Field Programmable Gate Arrays

-

-

CMOS

BOTTOM

-

BALL

-

240

-

1 mm

not_compliant

-

-

-

-

-

S-PBGA-B676

387

Not Qualified

-

-

-

-

1.2 V

-

-

166MHz

64KB

-

-

-

ARM® Cortex®-M3

-

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

FPGA - 60K Logic Modules

56520

1 Core

256KB

-

-

-

27 mm

27 mm

-

-

-

-

MPFS025TS-FCSG325I
MPFS025TS-FCSG325I

Microchip Technology

26

-

-

-

-

325-TFBGA

-

-

-

-

325-BGA (11x11)

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

- 40 C

-

SMD/SMT

-

108 I/O

23000 LE

Tray

-

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-40°C ~ 100°C

Tray

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

230.4KB

-

-

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 23K Logic Modules

-

5 Core

128KB

-

-

-

-

-

-

-

-

-

MPFS025T-FCSG325I
MPFS025T-FCSG325I

Microchip Technology

12

-

-

-

-

FCSG-325

-

-

-

-

325-BGA (11x11)

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

SMD/SMT

MSL 3 - 168 hours

108 I/O

23000 LE

Tray

-

-

-

-

-

-

-

-

Active

-

-

-

-

-

-

-

-

-

-

-

-40°C ~ 100°C

Tray

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

230.4KB

-

-

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

1843.2Kbit

-

FPGA - 23K Logic Modules

-

5 Core

128KB

-

-

-

-

-

-

-

-

-

MPFS025TL-FCSG325E
MPFS025TL-FCSG325E

Microchip Technology

43

-

-

-

-

325-TFBGA

-

-

-

-

325-BGA (11x11)

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

SMD/SMT

-

108 I/O

23000 LE

Tray

-

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

0°C ~ 100°C

Tray

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

230.4KB

-

-

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 23K Logic Modules

-

5 Core

128KB

-

-

-

-

-

-

-

-

-

MPFS160TL-FCVG784I
MPFS160TL-FCVG784I

Microchip Technology

2891

-

-

-

-

BGA-784

-

-

-

-

784-FCBGA (23x23)

-

-

-

-

-

-

1

-

4 x 32 kB

16 kB, 4 x 32 kB

-

-

667 MHz, 667 MHz

-

+ 100 C

Microchip Technology

-

0 C

-

SMD/SMT

-

312 I/O

161000 LE

Tray

-

-

-

-

-

-

-

-

Active

-

-

-

-

This product may require additional documentation to export from the United States.

-

-

-

-

-

-

-40°C ~ 100°C

Tray

PolarFire™

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1 V

-

-

-

-

-

-

1.4125MB

-

-

-

RISC-V

-

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

-

-

-

-

-

-

FPGA - 161K Logic Modules

-

5 Core

128kB

-

-

-

-

-

-

-

-

-