- Package
- Series
- Mfr
- Product Status
- Package / Case
- Number of I/Os
- Operating Temperature
- Peripherals
- Supplier Device Package
- Connectivity
- Core Processor
- Speed
Attribute column
Manufacturer
Microchip Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Base Product Number | Contact Finish Mating | Contact Sizes | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Termination | Temperature Coefficient | Connector Type | Type | Number of Positions | Terminal Finish | Color | Applications | Additional Feature | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Frequency Stability | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Lead Spacing | Power Supplies | Note | Load Capacitance | Speed | RAM Size | Operating Mode | Shell Size, MIL | Lead Style | Core Processor | Frequency Tolerance | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Includes | Total RAM Bits | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Module Capacity | Features | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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![]() M2S060-1FCSG325I Microchip | 2466 |
| - | Production (Last Updated: 2 months ago) | - | 325-TFBGA, FCBGA | YES | - | - | - | 325-FCBGA (11x11) | - | 325 | M2S060 | - | - | 64 kB | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060-1FCSG325I | 166 MHz | - | - | KYOCERA AVX | - | - | 3 | - | - | 200 | 56520 LE | Bulk | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | - | 5.8 | Compliant | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | * | - | - | e1 | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | CMOS | BOTTOM | - | BALL | - | 250 | - | 0.5 mm | compliant | - | 40 | - | - | - | S-PBGA-B325 | 200 | Not Qualified | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | - | - | - | 11 mm | 11 mm | - | - | - | - | ||
![]() M2S025T-FG484I Microchip | 2939 |
| - | Production (Last Updated: 2 months ago) | - | 484-BGA | - | - | - | - | 484-FPBGA (23x23) | - | - | M2S025 | - | - | - | - | - | - | - | - | - | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | - | 267 | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 25K Logic Modules | - | - | 256KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S090-1FGG484I Microchip | 2355 |
| - | - | - | 484-BGA | - | - | - | - | 484-FPBGA (23x23) | - | - | M2S090 | - | - | - | - | - | - | - | - | - | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | - | 267 | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 90K Logic Modules | - | - | 512KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S060-1FG676I Microchip | 2505 |
| - | Production (Last Updated: 2 months ago) | - | 676-BGA | - | - | - | - | 676-FBGA (27x27) | - | - | M2S060 | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | 387 | - | Tray | - | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 256KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S025-1VF256 Microchip | 2149 |
| - | Production (Last Updated: 2 months ago) | - | 256-LFBGA | - | - | - | - | 256-FPBGA (14x14) | - | - | M2S025 | - | - | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | SMD/SMT | - | 138 | 27696 LE | Tray | - | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S060-1FCS325 Microchip | 2009 |
| - | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 325-TFBGA, FCBGA | - | - | Circular | Aluminum | 325-FCBGA (11x11) | - | - | D38999/26ZA | - | 22D | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | Amphenol Aerospace Operations | - | - | - | - | - | 200 | 56520 LE | Bulk | - | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | - | -65°C ~ 175°C | - | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | - | - | - | - | - | Plug Housing | For Female Sockets | 6 | - | - | - | - | - | - | Threaded | - | Crimp | - | - | - | A | - | Shielded | - | Environment Resistant | - | - | - | - | - | Zinc Nickel | 9-35 | - | - | - | Black | - | - | - | - | Contacts Not Included | - | 166MHz | 64KB | - | A | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | Coupling Nut, Self Locking | - | - | - | - | - | - | - | ||
![]() M2S150T-1FCV484 Microchip | 2611 |
| - | - | Surface Mount, MLCC | 1808 (4520 Metric) | - | - | - | - | 484-FBGA (19x19) | - | - | M2S150 | - | - | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | Vishay Vitramon | - | - | - | - | - | 273 | 146124 LE | Tape & Reel (TR) | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | 1500V (1.5kV) | - | -55°C ~ 125°C | - | VJ OMD | 0.186 L x 0.080 W (4.72mm x 2.03mm) | ±5% | - | - | C0G, NP0 | - | - | - | - | - | Boardflex Sensitive | - | - | 12 pF | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | 1 Core | 512KB | - | Soft Termination, High Voltage | - | - | - | 0.086 (2.18mm) | - | - | - | ||
![]() M2S060-FG484I Microchip | 2686 |
| - | Production (Last Updated: 2 months ago) | - | 484-BGA | - | - | - | - | 484-FPBGA (23x23) | - | - | M2S060 | - | - | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | 267 | 56520 LE | Tray | - | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S090TS-FGG484 Microchip | 2149 |
| - | - | - | 484-BGA | - | - | - | - | 484-FPBGA (23x23) | - | - | M2S090 | - | - | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | 267 | 86316 LE | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 90K Logic Modules | - | 1 Core | 512KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S060-FG676I Microchip | 2319 |
| - | Production (Last Updated: 2 months ago) | - | 676-BGA | - | - | - | - | 676-FBGA (27x27) | - | - | M2S060 | - | - | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | PEI-Genesis | - | - | - | - | - | 387 | 56520 LE | Bulk | - | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S025TS-FGG484I Microchip | 2881 |
| - | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 484-BGA | - | - | - | Aluminum Alloy | 484-FPBGA (23x23) | - | - | KPT06 | Gold | - | - | - | - | - | - | - | - | - | - | - | ITT Cannon, LLC | - | - | - | - | - | 267 | - | Bulk | - | - | - | - | - | - | - | Metal | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | 1000VAC, 1400VDC | -55°C ~ 125°C | - | KPT | - | - | - | Solder Cup | - | Plug, Female Sockets | - | 21 | - | Olive Drab | - | - | - | - | Bayonet Lock | - | - | 13A | - | - | N (Normal) | - | - | - | Environment Resistant | - | - | - | - | - | Olive Drab Cadmium | 22-21 | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 256KB | - | Potted | - | - | - | - | 50.0µin (1.27µm) | - | - | ||
![]() M2S150T-FCSG536 Microchip | 2187 |
| - | - | - | 536-LFBGA, CSPBGA | - | - | - | - | 536-CSPBGA (16x16) | - | - | M2S150 | - | - | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | KYOCERA AVX | - | - | - | - | - | 293 | 146124 LE | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | 1 Core | 512KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S050TS-1FGG896I Microchip | 2095 |
| - | - | Surface Mount | 4-SMD, No Lead | - | - | - | - | 896-FBGA (31x31) | - | - | M2S050 | - | - | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | Suntsu Electronics, Inc. | - | - | - | SMD/SMT | - | 377 | 56340 LE | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 85°C | - | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | - | - | - | - | - | MHz Crystal | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 12 MHz | - | ±15ppm | - | - | - | - | - | - | - | 120 Ohms | - | - | - | 10pF | 166MHz | 64KB | Fundamental | - | - | ARM® Cortex®-M3 | ±15ppm | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | 0.026 (0.65mm) | - | - | - | - | - | - | ||
![]() M2S060-VF400 Microchip | 2641 |
| - | Production (Last Updated: 2 months ago) | Panel Mount | 400-LFBGA | - | Flange | - | Aluminum Alloy | 400-VFBGA (17x17) | - | - | CB2 | Silver | - | 64 kB | - | - | - | - | - | - | 166 MHz | - | - | ITT Cannon, LLC | - | - | - | - | - | 207 | 56520 LE | Bulk | - | - | - | - | - | - | - | Metal | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | 50V | -55°C ~ 125°C | - | MIL-DTL-5015, CB | - | - | - | Crimp | - | Receptacle, Male Pins | - | 22 | - | Black | - | - | - | - | Reverse Bayonet Lock | - | - | 22A, 41A | - | - | N (Normal) | - | - | - | IP67 - Dust Tight, Waterproof | - | - | - | - | - | Black Zinc Cobalt | 28-11 | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | - | - | - | - | - | - | - | ||
![]() M2S010T-VF400I Microchip | 31 |
| - | Production (Last Updated: 1 month ago) | - | 400-LFBGA | YES | - | - | - | 400-VFBGA (17x17) | - | 400 | SJT5 | - | - | 64 kB | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-VF400I | 166 MHz | - | - | Amphenol PCD | - | - | - | SMD/SMT | - | 195 | 12084 LE | Box | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 30 | 5.81 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | SJT | 4.144 L x 0.885 W x 0.900 H (105.26mm x 22.48mm x 22.86mm) | - | e0 | - | - | - | Rail | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | CMOS | BOTTOM | - | BALL | - | 240 | - | 0.8 mm | not_compliant | - | - | - | - | - | S-PBGA-B400 | 195 | Not Qualified | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 8 | - | - | 17 mm | 17 mm | - | - | - | - | ||
![]() M2S060TS-1FG676I Microchip | 2897 |
| - | Production (Last Updated: 2 months ago) | - | 676-BGA | YES | - | - | - | 676-FBGA (27x27) | - | 676 | M2S060 | - | - | 64 kB | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-1FG676I | 166 MHz | - | - | Microchip Technology | - | - | 3 | - | - | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.88 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | e0 | - | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | Field Programmable Gate Arrays | - | - | CMOS | BOTTOM | - | BALL | - | 240 | - | 1 mm | not_compliant | - | - | - | - | - | S-PBGA-B676 | 387 | Not Qualified | - | - | - | - | 1.2 V | - | - | 166MHz | 64KB | - | - | - | ARM® Cortex®-M3 | - | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | - | - | - | 27 mm | 27 mm | - | - | - | - | ||
![]() MPFS025TS-FCSG325I Microchip Technology | 26 | - | - | - | - | 325-TFBGA | - | - | - | - | 325-BGA (11x11) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | SMD/SMT | - | 108 I/O | 23000 LE | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | 230.4KB | - | - | - | RISC-V | - | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 23K Logic Modules | - | 5 Core | 128KB | - | - | - | - | - | - | - | - | - | ||
![]() MPFS025T-FCSG325I Microchip Technology | 12 | - | - | - | - | FCSG-325 | - | - | - | - | 325-BGA (11x11) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | SMD/SMT | MSL 3 - 168 hours | 108 I/O | 23000 LE | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | 230.4KB | - | - | - | RISC-V | - | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | 1843.2Kbit | - | FPGA - 23K Logic Modules | - | 5 Core | 128KB | - | - | - | - | - | - | - | - | - | ||
![]() MPFS025TL-FCSG325E Microchip Technology | 43 | - | - | - | - | 325-TFBGA | - | - | - | - | 325-BGA (11x11) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | SMD/SMT | - | 108 I/O | 23000 LE | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | 0°C ~ 100°C | Tray | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | 230.4KB | - | - | - | RISC-V | - | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 23K Logic Modules | - | 5 Core | 128KB | - | - | - | - | - | - | - | - | - | ||
![]() MPFS160TL-FCVG784I Microchip Technology | 2891 | - | - | - | - | BGA-784 | - | - | - | - | 784-FCBGA (23x23) | - | - | - | - | - | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | 0 C | - | SMD/SMT | - | 312 I/O | 161000 LE | Tray | - | - | - | - | - | - | - | - | Active | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | -40°C ~ 100°C | Tray | PolarFire™ | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | - | 1.4125MB | - | - | - | RISC-V | - | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | FPGA - 161K Logic Modules | - | 5 Core | 128kB | - | - | - | - | - | - | - | - | - |