- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC8313VRAFF NXP USA Inc. | In Stock | - | Datasheet | - | 516-BBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 2007 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | - | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 133MHz | 32 | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
 MCIMX6D4AVT08AD NXP USA Inc. | 2454 |
| Datasheet | 15 Weeks | 624-FBGA, FCBGA | YES | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | - | S-PBGA-B624 | - | 1.5V | - | 1.225V | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 P1011NSE2HFB NXP USA Inc. | 594 | - | Datasheet | 12 Weeks | 689-BBGA Exposed Pad | YES | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1011 | S-PBGA-B689 | - | 1.05V | - | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | Cryptography, Random Number Generator | - | - | 2.46mm | 31mm | ROHS3 Compliant | ||
 MPC8245TZU266D NXP USA Inc. | 6 |
| Datasheet | 12 Weeks | 352-LBGA | YES | - | - | -40°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | - | 1.9V | 23.3V | 1.7V | 266MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 3.3V | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | 1.65mm | 35mm | Non-RoHS Compliant | ||
 MPC8280ZUUPEA NXP USA Inc. | 830 | - | Datasheet | 18 Weeks | 480-LBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | - | 1.6V | 1.53.3V | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | - | 32 | - | - | - | - | 32 | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 LS1043ASE7QQB NXP USA Inc. | 36 | - | Datasheet | 18 Weeks | 621-FBGA, FCBGA | YES | - | - | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 621 | - | - | ALSO OPERATES AT 1V NOMINAL SUPPLY | - | BOTTOM | BALL | 250 | 0.9V | 0.8mm | 30 | - | S-PBGA-B621 | - | 0.93V | - | 0.87V | 1.6GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A53 | - | 64 | - | - | - | - | 16 | YES | YES | 32 | FIXED POINT | YES | - | - | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | - | DDR3L, DDR4 | USB 3.0 (3) + PHY | - | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | 2.07mm | 21mm | ROHS3 Compliant | ||
 MCIMX357DVM5B NXP USA Inc. | 100000 |
| - | 15 Weeks | 400-LFBGA | YES | 4 | - | -20°C~70°C TA | Tray | 2008 | i.MX35 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | MCIMX357 | S-PBGA-B400 | Not Qualified | 1.47V | - | 1.33V | 532MHz | MULTIFUNCTION PERIPHERAL | ARM1136JF-S | 24MHz | - | - | - | - | - | - | YES | - | - | - | - | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | - | 1.6mm | 17mm | ROHS3 Compliant | ||
 MCIMX283CVM4BR2 NXP USA Inc. | 27 |
| Datasheet | 15 Weeks | 289-LFBGA | YES | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2002 | i.MX28 | e1 | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | MCIMX283 | S-PBGA-B289 | - | 1.55V | 1.41.8V | 1.35V | 454MHz | MICROPROCESSOR, RISC | ARM926EJ-S | 24MHz | 32 | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | Data; DCP | - | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | - | 1.37mm | 14mm | ROHS3 Compliant | ||
 MCIMX6X3EVN10AB NXP USA Inc. | 9 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | 179 | - | -20°C~105°C TJ | Tray | 2002 | i.MX6SX | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | S-PBGA-B400 | - | 1.5V | - | 1.35V | 227MHz, 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1000MHz | - | - | - | - | - | 15 | YES | - | 32 | - | - | - | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 6 | Multimedia; NEON™ MPE | CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | 1.53mm | 17mm | ROHS3 Compliant | ||
 MPC8321VRADDCA NXP USA Inc. | 185 | - | - | 12 Weeks | 516-BBGA | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | - | S-PBGA-B516 | - | 1.05V | - | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | - | Communications; QUICC Engine | - | - | - | - | 2.55mm | 27mm | ROHS3 Compliant | ||
MCIMX502CVM8B NXP USA Inc. | 27 |
| Datasheet | 15 Weeks | 400-LFBGA | YES | - | - | 0°C~70°C TA | Tray | 2008 | i.MX50 | e1 | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.225V | 0.8mm | 40 | MCIMX502 | S-PBGA-B400 | Not Qualified | 1.275V | - | 1.175V | 800MHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 800MHz | - | - | - | - | - | - | YES | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | Boot Security, Cryptography, Secure JTAG | LCD | - | 1.6mm | 17mm | ROHS3 Compliant | ||
 MPC852TCVR80A NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 256-BBGA | YES | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | - | 1.9V | 1.83.3V | 1.7V | 80MHz | MICROPROCESSOR, RISC | - | 66MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | - | Communications; CPM | - | - | - | - | 2.54mm | 23mm | ROHS3 Compliant | ||
 MCIMX6V7DVN10AB NXP USA Inc. | 109 | - | Datasheet | 12 Weeks | 432-TFBGA | - | - | - | 0°C~95°C TJ | Tray | 2002 | i.MX6SLL | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | 1GHz | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2V 1.8V 2.5V 3.3V | - | 1 Core 32-Bit | Yes | LPDDR2, LPDDR3 | USB 2.0 OTG + PHY (2) | - | - | Multimedia; NEON™ SIMD | - | A-HAB, ARM TZ, CSU, SJC, SNVS | EPDC, LCD | - | - | - | ROHS3 Compliant | ||
MCIMX6D7CVT08AC NXP USA Inc. | 5 | - | Datasheet | - | 624-FBGA, FCBGA | YES | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6D | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | - | - | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MC68EN360AI25VL NXP USA Inc. | In Stock | - | Datasheet | 8 Weeks | 240-BFQFP | YES | 46 | - | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68EN360 | S-PQFP-G240 | - | 5.25V | - | 4.75V | 25MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | NO | 32 | - | - | 32 | - | - | - | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | - | Communications; CPM | - | - | - | - | 4.15mm | 31.305mm | ROHS3 Compliant | ||
 MPC8343VRAGDB NXP USA Inc. | 1858 | - | - | 12 Weeks | 620-BBGA Exposed Pad | YES | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8343 | S-PBGA-B620 | - | 1.26V | 1.22.53.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | 2.46mm | 29mm | ROHS3 Compliant | ||
 LS1021ASN7KQB NXP USA Inc. | 2830 |
| Datasheet | 18 Weeks | 525-FBGA, FCBGA | YES | - | - | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | Active | 3 (168 Hours) | 525 | 3A991.A.1 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | - | S-PBGA-B525 | - | 1.03V | - | 0.97V | 1.0GHz | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 3.0 (1) + PHY | - | - | - | - | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | ||
 MCIMX233CJM4C NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | 169-LFBGA | - | - | Industrial grade | -40°C~85°C TA | Tray | 2004 | i.MX23 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MCIMX233 | - | - | - | - | - | 454MHz | - | ARM926EJ-S | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.0V 2.5V 2.7V 3.0V 3.3V | - | 1 Core 32-Bit | No | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | Data; DCP | - | Cryptography, Hardware ID | LCD, Touchscreen | - | - | - | ROHS3 Compliant | ||
 MCIMX257CJN4A NXP USA Inc. | 3000 |
| Datasheet | 15 Weeks | 347-LFBGA | YES | 6 | - | -40°C~85°C TA | Tray | 2005 | i.MX25 | e1 | Active | 3 (168 Hours) | 347 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.5mm | 40 | MCIMX257 | S-PBGA-B347 | - | 1.52V | 1.2/1.51.8/3.3V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | - | - | - | - | 26 | YES | YES | 16 | FIXED POINT | YES | 128000 | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | I2C; USB | - | Keypad, LCD, Touchscreen | - | 1.52mm | 12mm | ROHS3 Compliant | ||
MCIMX6DP6AVT1AB NXP USA Inc. | 2571 |
| Datasheet | 12 Weeks | 624-FBGA, FCBGA | YES | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | - | Active | 3 (168 Hours) | 624 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | 40 | - | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant |