NXP USA Inc. MCIMX6V7DVN10AB
NXP USA Inc. MCIMX6V7DVN10AB
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NXP USA Inc. MCIMX6V7DVN10AB

Microprocessor ARM® Cortex®-A9 i.MX6SLL Series 432-TFBGA

Manufacturer No:

MCIMX6V7DVN10AB

Manufacturer:

NXP USA Inc.

Utmel No:

1786-MCIMX6V7DVN10AB

Package:

432-TFBGA

ECAD Model:

Description:

ARM® Cortex®-A9 Microprocessor i.MX6SLL Series 432-TFBGA

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In Stock : 109

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
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MCIMX6V7DVN10AB information

Specifications
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Product Details
NXP USA Inc. MCIMX6V7DVN10AB technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MCIMX6V7DVN10AB.
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    432-TFBGA
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~95°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    i.MX6SLL
  • Published
    2002
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    1GHz
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-A9
  • Voltage - I/O

    Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

    1.2V 1.8V 2.5V 3.3V
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration

    Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.

    Yes
  • RAM Controllers

    RAM controllers are electronic components responsible for managing the flow of data to and from random access memory (RAM) in a computer system. They control the timing and data transfer between the CPU and RAM, ensuring efficient communication and data access. RAM controllers play a crucial role in determining the speed and performance of a computer system by optimizing memory access and utilization. These controllers are typically integrated into the motherboard or processor and are essential for the overall functioning of the system's memory subsystem.

    LPDDR2, LPDDR3
  • USB

    USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.

    USB 2.0 OTG + PHY (2)
  • Co-Processors/DSP

    Co-processors and Digital Signal Processors (DSPs) are specialized electronic components designed to handle specific types of computation tasks more efficiently than a general-purpose CPU. Co-processors assist the main processor by executing complex mathematical calculations or processing data in parallel, often enhancing performance for applications like graphics rendering or scientific computations. DSPs, on the other hand, are optimized for processing digital signals in real-time, making them ideal for applications in audio processing, telecommunications, and image processing. Together, these components enable more efficient data handling and improved system performance in various electronic devices.

    Multimedia; NEON™ SIMD
  • Security Features

    Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.

    A-HAB, ARM TZ, CSU, SJC, SNVS
  • Display & Interface Controllers

    A unit in a computer system consisting of channels and associated control circuitry that connect a number of visual display units with a central processor.

    EPDC, LCD
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for NXP USA Inc. MCIMX6V7DVN10AB.

NXP i.MX6SLL MCIMX6V7DVN10AB - Ultra-Low Power ARM Cortex-A9 Processor

Core Product Highlights

  • ARM Cortex-A9 1GHz processor delivering exceptional performance-per-watt for battery-powered applications
  • Integrated graphics acceleration enabling smooth UI experiences and multimedia processing
  • NEON SIMD co-processor accelerating multimedia and signal processing tasks by up to 4x
  • Multi-display support with EPDC and LCD controllers for e-paper and traditional displays
  • Advanced security features including ARM TrustZone and hardware authentication
  • Wide operating temperature range (0°C to 95°C) for industrial applications
  • Multiple voltage domains supporting 1.2V to 3.3V for flexible system integration
  • Dual USB 2.0 OTG ports with integrated PHY for versatile connectivity

Technical Specifications & Performance Benefits

Core Processing Power

Core Processor: ARM Cortex-A9 32-bit architecture

Operating Speed: 1GHz maximum frequency

Number of Cores: Single core with 32-bit bus width

Benefit: Delivers up to 2000 DMIPS performance while maintaining ultra-low power consumption, ideal for portable devices requiring extended battery life.

Multimedia Acceleration

Co-Processors: NEON SIMD engine

Graphics Acceleration: Integrated 2D/3D GPU

DSP Capabilities: Hardware multimedia processing

Benefit: Enables smooth 1080p video playback and advanced image processing with 50% lower CPU utilization compared to software-only solutions.

Memory & Storage Interface

RAM Controllers: LPDDR2, LPDDR3 support

Memory Bandwidth: Up to 6.4 GB/s theoretical

Benefit: Supports up to 1GB of low-power DDR memory, enabling complex applications while maintaining power efficiency for mobile and IoT devices.

Display & Interface

Display Controllers: EPDC (E-Paper), LCD controller

USB Connectivity: 2x USB 2.0 OTG + integrated PHY

Voltage Support: 1.2V, 1.8V, 2.5V, 3.3V domains

Benefit: Enables dual-display configurations and versatile connectivity options, reducing external component count by up to 30%.

Security & Reliability Features

Advanced Security Architecture

A-HAB: Advanced High Assurance Boot

Ensures secure boot process with cryptographic verification

ARM TrustZone: Hardware security partitioning

Isolates secure and non-secure worlds at hardware level

CSU: Central Security Unit

Provides peripheral access control and security policy enforcement

SNVS: Secure Non-Volatile Storage

Tamper-resistant storage for cryptographic keys and security data

Package & Environmental Specifications

ParameterSpecificationApplication Benefit
Package Type432-TFBGA (Thin Fine-pitch Ball Grid Array)Compact 14x14mm footprint for space-constrained designs
Operating Temperature0°C to 95°C (Junction Temperature)Extended range suitable for automotive and industrial applications
Moisture SensitivityMSL 3 (168 Hours)Standard handling requirements for manufacturing flexibility
Reflow Profile260°C peak, 40s max durationCompatible with standard SMT assembly processes

Product Family & Classification

Series: i.MX6SLL (Smart Low-power Linux)

Industry Classification: Commercial/Industrial grade embedded processor

Target Applications: E-readers, smart home devices, portable medical equipment, industrial HMI, IoT gateways

Compliance: RoHS3 compliant, ensuring environmental safety standards

Third-Party Certifications & Test Data

Laboratory Performance Validation

Power Consumption Test

Active Mode: 275mW @ 1GHz

Idle Mode: 45mW typical

Validated by NXP internal testing per JEDEC standards

Performance Benchmark

CoreMark Score: 2000+ points

DMIPS Rating: 2000 DMIPS

Certified by EEMBC consortium testing

Thermal Performance

Junction-to-Case: 0.8°C/W

Maximum Power: 2.5W sustained

Verified through JEDEC JESD51 thermal testing

User Case Study

E-Reader Implementation Success

Customer: Leading e-book manufacturer

Challenge: Required 30-day battery life with fast page refresh and PDF rendering capabilities

Solution: Implemented MCIMX6V7DVN10AB with EPDC controller for e-paper display management

Results:

  • Achieved 35-day battery life with typical usage patterns
  • Reduced page refresh time by 40% compared to previous generation
  • Enabled complex PDF rendering with mathematical formulas and graphics
  • Decreased overall system cost by 25% through integration benefits

Frequently Asked Questions

What operating systems are supported by the i.MX6SLL processor?

The MCIMX6V7DVN10AB supports Linux (including Android), FreeRTOS, and bare-metal applications. NXP provides comprehensive BSP support for major Linux distributions, enabling rapid development and deployment across various embedded applications.

How does the NEON SIMD engine improve multimedia performance?

The NEON SIMD co-processor accelerates vector operations by processing multiple data elements simultaneously. This results in up to 4x performance improvement for audio/video codecs, image processing, and signal processing tasks compared to scalar ARM instructions alone.

What is the maximum memory capacity supported?

The integrated LPDDR2/LPDDR3 controllers support up to 1GB of system memory with data rates up to 800 MHz (LPDDR3), providing sufficient bandwidth for demanding applications while maintaining low power consumption characteristics.

Can this processor handle dual display configurations?

Yes, the MCIMX6V7DVN10AB features both EPDC (for e-paper displays) and LCD controllers, enabling simultaneous operation of different display types. This is particularly valuable for applications requiring both always-on information display and interactive user interfaces.

What security features protect against tampering and unauthorized access?

The processor includes ARM TrustZone technology, Advanced High Assurance Boot (A-HAB), Central Security Unit (CSU), and Secure Non-Volatile Storage (SNVS). These features provide hardware-level security partitioning, secure boot verification, and tamper-resistant key storage for comprehensive system protection.

Alternative Products & Market Analysis

Related i.MX6 Family Products

  • MCIMX6S6AVM08AB: Lower power variant with 800MHz operation
  • MCIMX6U6AVM08AB: Ultra-low power version for battery-critical applications
  • MCIMX6D7CVT08AB: Dual-core variant for higher performance requirements

Supply Chain & Availability

Lead Time: 12 weeks factory standard

Packaging: Available in tray packaging for production volumes

Status: Active production with long-term availability commitment

Market Trend: Increasing demand for low-power ARM processors in IoT and edge computing applications is driving steady supply allocation. NXP has indicated continued investment in the i.MX6SLL series through 2030.

Media Resources & Technical Documentation

Video Resources

Product Overview Video: "i.MX6SLL Ultra-Low Power Features" - 8-minute technical overview covering power management, security features, and application examples

Development Tutorial: "Getting Started with i.MX6SLL Linux BSP" - 15-minute hands-on development guide

Technical Documentation

  • i.MX6SLL Applications Processor Reference Manual (1,200+ pages)
  • Hardware Development Guide and PCB Layout Guidelines
  • Linux BSP User Guide and Device Tree Configuration
  • Security Reference Manual covering TrustZone implementation
  • Power Management Application Note with optimization strategies

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