- Moisture Sensitivity Level (MSL)
- Number of Cores/Bus Width
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RAM Controllers
- RoHS Status
- Series
- Speed
- Core Processor
- Published
Attribute column
Manufacturer
NXP Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MPC860TVR80D4 NXP USA Inc. | 325 | - | Datasheet | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
 MCIMX6DP4AVT8AB NXP USA Inc. | 2698 |
| Datasheet | 26 Weeks | 624-FBGA, FCBGA | YES | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | - | Active | 3 (168 Hours) | 624 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | S-PBGA-B624 | - | 1.5V | - | 1.225V | 852MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 LS1048ASE7Q1A NXP USA Inc. | 2076 |
| Datasheet | 18 Weeks | 780-BFBGA, FCBGA | - | - | - | - | - | 0°C~105°C | - | - | QorIQ® Layerscape | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 250 | - | - | - | 30 | - | - | - | - | - | - | 1.6GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | 10GbE (2), 1GbE (8) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (2) + PHY | - | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | - | ROHS3 Compliant | ||
 MPC850CZQ50BU NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | - | - | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | 40 | MPC850 | S-PBGA-B256 | - | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.35mm | 23mm | Non-RoHS Compliant | ||
 MPC8536BVJAVLA NXP USA Inc. | 2757 | - | Datasheet | 18 Weeks | 783-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | MPC8536 | S-PBGA-B783 | - | 1.05V | - | 0.95V | 1.5GHz | MICROPROCESSOR | PowerPC e500 | - | 32 | - | - | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | ||
 MPC8347EVVAJF NXP USA Inc. | 25000 | - | Datasheet | - | 672-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2009 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | S-PBGA-B672 | - | 1.26V | 1.22.53.3V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | - | Cryptography, Random Number Generator | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
MPC8555PXALF NXP USA Inc. | In Stock | - | Datasheet | - | 783-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A992 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | - | 30 | MPC8555 | S-PBGA-B783 | - | 1.26V | - | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | - | - | - | - | 64 | YES | YES | 64 | FLOATING POINT | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM | - | - | - | - | 3.75mm | 29mm | Non-RoHS Compliant | ||
 MCIMX6D4AVT10AC NXP USA Inc. | 10086 |
| Datasheet | - | 624-FBGA, FCBGA | YES | - | - | - | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX6 | S-PBGA-B624 | - | 1.5V | - | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | 16 | YES | YES | 64 | FIXED POINT | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||
 MPC8260AZUMHBB NXP USA Inc. | 127 | - | Datasheet | - | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 1994 | MPC82xx | - | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | - | 30 | PC8260 | S-PBGA-B480 | - | 2.2V | - | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | - | - | - | - | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 MCIMX6X4EVM10AC NXP USA Inc. | 11 |
| Datasheet | 15 Weeks | 529-LFBGA | - | - | - | - | - | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | 227MHz, 1GHz | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD, LVDS | - | - | - | ROHS3 Compliant | ||
MPC860SRVR66D4 NXP USA Inc. | 220 | - | Datasheet | - | 357-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | Not For New Designs | 3 (168 Hours) | 357 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | - | 30 | MPC860 | S-PBGA-B357 | - | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | - | 50MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.52mm | 25mm | ROHS3 Compliant | ||
MPC850DECZQ50BU NXP USA Inc. | 12 | - | Datasheet | 12 Weeks | 256-BBGA | YES | - | - | - | - | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | - | 40 | MPC850 | S-PBGA-B256 | - | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | - | - | 32 | - | - | - | - | 26 | YES | YES | 32 | FIXED POINT | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | - | - | - | - | 2.54mm | 23mm | Non-RoHS Compliant | ||
 MPC8572EVJATLE NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | 1023-BBGA, FCBGA | - | - | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC85xx | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MPC8572 | - | - | - | - | - | 1.2GHz | - | PowerPC e500 | - | - | - | - | - | - | - | - | - | - | - | - | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | No | DDR2, DDR3 | - | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE, Security; SEC | - | Cryptography, Random Number Generator | - | - | - | - | ROHS3 Compliant | ||
 MVF60NN151CMK50 NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | 364-LFBGA | YES | - | 131 | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | - | 40 | MVF60NN151 | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | 500MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | - | 16 | YES | YES | NO | YES | 16 | - | - | 16 | - | - | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | - | DCU, GPU, LCD, VideoADC, VIU | - | - | 17mm | ROHS3 Compliant | ||
XPC8260ZUIHBC NXP USA Inc. | 63 | - | Datasheet | - | 480-LBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2004 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 5A991 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | - | 30 | PC8260 | S-PBGA-B480 | - | 1.9V | - | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | - | - | - | - | 32 | YES | NO | 64 | FLOATING POINT | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | - | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | 1.65mm | 37.5mm | Non-RoHS Compliant | ||
 P3041NXN7NNC NXP USA Inc. | 144 | - | Datasheet | 12 Weeks | 1295-BBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | Active | 3 (168 Hours) | - | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | 30 | P3041 | S-PBGA-B1295 | - | 1.05V | - | 0.95V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133MHz | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | ||
 MIMX8MQ5DVAJZAA NXP USA Inc. | 104 | - | Datasheet | 15 Weeks | 621-FBGA, FCBGA | - | - | - | - | - | 0°C~95°C TJ | Tray | 2016 | i.MX8MQ | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | compliant | NOT SPECIFIED | - | - | - | - | - | - | 1.5GHz | - | ARM® Cortex®-A53 | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE | 4 Core 32-Bit | Yes | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | - | - | - | RoHS Compliant | ||
MPC8349EVVAGDB NXP USA Inc. | In Stock | - | - | 12 Weeks | 672-LBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Active | 3 (168 Hours) | 672 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8349 | S-PBGA-B672 | - | 1.26V | 1.22.5/3.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | - | - | - | - | 32 | YES | YES | 32 | FLOATING POINT | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | - | Cryptography, Random Number Generator | - | - | 1.69mm | 35mm | ROHS3 Compliant | ||
 MCIMX6X1EVK10AC NXP USA Inc. | 7 | - | Datasheet | 15 Weeks | 400-LFBGA | - | - | - | - | - | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | 227MHz, 1GHz | - | ARM® Cortex®-A9, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | - | - | ROHS3 Compliant | ||
 MC68MH360AI33L NXP USA Inc. | 288 |
| Datasheet | - | 240-BFQFP | - | 240-FQFP (32x32) | - | - | - | 0°C~70°C TA | Tray | 1995 | M683xx | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68MH360 | - | - | - | - | - | 33MHz | - | CPU32+ | - | - | - | - | - | - | - | - | - | - | - | - | 5.0V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | SCC, SMC, SPI | Communications; CPM | - | - | - | - | - | - | ROHS3 Compliant |