

NXP USA Inc. LS1048ASE7Q1A
Microprocessor ARM® Cortex®-A53 QorIQ® Layerscape Series 780-BFBGA, FCBGA
Manufacturer No:
LS1048ASE7Q1A
Tiny WHSLManufacturer:
Utmel No:
1786-LS1048ASE7Q1A
Package:
780-BFBGA, FCBGA
Datasheet:
Description:
ARM® Cortex®-A53 Microprocessor QorIQ® Layerscape Series 780-BFBGA, FCBGA
Quantity:
Unit Price: $157.094486
Ext Price: $157.09
Delivery:





Payment:











In Stock : 2076
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$157.094486
$157.09
10
$148.202345
$1,482.02
100
$139.813533
$13,981.35
500
$131.899559
$65,949.78
1000
$124.433547
$124,433.55
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- TypeParameter
- Factory Lead Time18 Weeks
- Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
780-BFBGA, FCBGA - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
0°C~105°C - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
QorIQ® Layerscape - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
250 - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
30 - Speed
In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.
1.6GHz - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
ARM® Cortex®-A53 - Ethernet
Ethernet is a widely used networking technology that allows devices to communicate with each other over a local area network (LAN). It is a set of standards that define how data is transmitted over a physical medium, typically using twisted-pair cables or fiber optics. Ethernet specifies the protocols for data transmission, addressing, and error detection, ensuring reliable and efficient communication between devices. It is commonly used in homes, businesses, and data centers to connect computers, printers, routers, and other networked devices. Ethernet has evolved over the years to support faster speeds and improved performance, making it a fundamental component of modern networking infrastructure.
10GbE (2), 1GbE (8) - Number of Cores/Bus Width4 Core 64-Bit
- RAM Controllers
RAM controllers are electronic components responsible for managing the flow of data to and from random access memory (RAM) in a computer system. They control the timing and data transfer between the CPU and RAM, ensuring efficient communication and data access. RAM controllers play a crucial role in determining the speed and performance of a computer system by optimizing memory access and utilization. These controllers are typically integrated into the motherboard or processor and are essential for the overall functioning of the system's memory subsystem.
DDR4 - USB
USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.
USB 3.0 (2) + PHY - Security Features
Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.
Secure Boot, TrustZone® - SATA
SATA stands for Serial Advanced Technology Attachment, which is a type of interface used to connect storage devices such as hard drives and solid-state drives (SSDs) to a computer's motherboard. It is a popular standard for connecting internal storage devices in desktops, laptops, and servers. SATA interfaces transfer data serially, meaning that data is sent one bit at a time, which allows for faster and more efficient data transfer compared to older parallel interfaces. SATA interfaces come in different versions, such as SATA I, SATA II, and SATA III, with each version offering different speeds and features. Overall, SATA is a widely used and reliable interface for connecting storage devices in modern electronic components.
SATA 6Gbps (1) - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant