Filters
  • Moisture Sensitivity Level (MSL)
  • Mounting Type
  • Package / Case
  • Packaging
  • Part Status
  • Applications
  • RoHS Status
  • Factory Lead Time
  • Operating Temperature
  • Peak Reflow Temperature (Cel)
  • Time@Peak Reflow Temperature-Max (s)
  • Published

Attribute column

Manufacturer

NXP PMIC - Power Management - Specialized

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791 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Mounting Type

Package / Case

Surface Mount

Supplier Device Package

Usage Level

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Applications

HTS Code

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Base Part Number

Pin Count

JESD-30 Code

Number of Outputs

Qualification Status

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of Channels

Analog IC - Other Type

Adjustable Threshold

Current - Supply

Output Voltage 1

Supply Current-Max (Isup)

Dropout Voltage1-Nom

Voltage Tolerance-Max

Output Current1-Max

Telecom IC Type

Input Voltage Absolute-Max

Adjustability

Source Url Status Check Date

Height Seated (Max)

Length

Width

RoHS Status

MC32PF1550A1EPR2
MC32PF1550A1EPR2

NXP USA Inc.

4290
Datasheet

14 Weeks

Surface Mount

40-VFQFN Exposed Pad

-

-

Industrial grade

-40°C~85°C

Tape & Reel (TR)

-

-

-

Active

3 (168 Hours)

-

-

-

Embedded Systems, Low-Power IoT, Mobile/Wearable Devices

-

3.8V~7V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

POWER SUPPLY MANAGEMENT CIRCUIT

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC35FS4503NAE
MC35FS4503NAE

NXP USA Inc.

25
Datasheet

16 Weeks

Surface Mount

48-LQFP Exposed Pad

-

-

-

-40°C~150°C TA

Tray

-

Automotive, AEC-Q100

-

Active

3 (168 Hours)

-

-

-

System Basis Chip

-

1V~5V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

INTERFACE CIRCUIT

-

-

-

-

-

-

ROHS3 Compliant

TDA3681ATH/N1S,518
TDA3681ATH/N1S,518

NXP USA Inc.

In Stock

-

Datasheet

14 Weeks

Surface Mount

20-SOIC (0.433, 11.00mm Width) Exposed Pad

-

20-HSOP

-

-40°C~85°C

Tape & Reel (TR)

2002

-

-

Not For New Designs

3 (168 Hours)

-

-

-

Ignition Buffer, Regulator

-

9.5V~18V

-

-

-

-

-

-

-

-

TDA3681

-

-

-

-

-

-

-

-

-

110μA

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC35FS4501NAE
MC35FS4501NAE

NXP USA Inc.

100000
Datasheet

17 Weeks

Surface Mount

48-LQFP Exposed Pad

-

-

-

-40°C~150°C TA

Tray

-

Automotive, AEC-Q100

-

Active

3 (168 Hours)

-

-

-

System Basis Chip

-

1V~5V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

INTERFACE CIRCUIT

-

-

-

-

-

-

ROHS3 Compliant

TDA3629/Y,112
TDA3629/Y,112

NXP USA Inc.

In Stock

-

Datasheet

-

Through Hole

8-DIP (0.300, 7.62mm)

-

-

-

-40°C~105°C

Tube

1996

-

-

Obsolete

1 (Unlimited)

-

-

-

Automotive

-

8V~18V

-

-

-

-

-

-

unknown

-

TDA3629

8

-

-

-

-

-

-

-

-

6mA

-

-

-

-

-

-

-

-

2013-06-14 00:00:00

-

-

-

ROHS3 Compliant

MC35FS6502CAE
MC35FS6502CAE

NXP USA Inc.

25
Datasheet

16 Weeks

Surface Mount

48-LQFP Exposed Pad

-

-

-

-40°C~150°C TA

Tray

-

Automotive, AEC-Q100

-

Active

3 (168 Hours)

-

-

-

System Basis Chip

-

1V~5V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

INTERFACE CIRCUIT

-

-

-

-

-

-

ROHS3 Compliant

MC35FS6511CAE
MC35FS6511CAE

NXP USA Inc.

In Stock

-

Datasheet

16 Weeks

Surface Mount

48-LQFP Exposed Pad

-

-

-

-40°C~150°C TA

Tray

-

Automotive, AEC-Q100

-

Active

3 (168 Hours)

-

-

-

System Basis Chip

-

1V~5V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

INTERFACE CIRCUIT

-

-

-

-

-

-

ROHS3 Compliant

MC34903CP3EKR2
MC34903CP3EKR2

NXP USA Inc.

In Stock

-

Datasheet

16 Weeks

Surface Mount

32-SSOP (0.295, 7.50mm Width) Exposed Pad

-

-

-

-40°C~125°C

Tape & Reel (TR)

2009

-

-

Obsolete

3 (168 Hours)

-

EAR99

-

System Basis Chip

8542.39.00.01

5.5V~28V

-

-

-

-

-

-

-

-

MC34903

-

-

-

-

-

-

-

-

-

2mA

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

TDA3606AT/N1,112
TDA3606AT/N1,112

NXP USA Inc.

In Stock

-

Datasheet

-

Surface Mount

20-SOIC (0.295, 7.50mm Width)

YES

-

-

-40°C~85°C

Tube

1998

-

e4

Obsolete

1 (Unlimited)

20

-

NICKEL PALLADIUM GOLD

Processor

8542.31.00.01

5.6V~25V

DUAL

GULL WING

260

1

14.4V

1.27mm

unknown

30

TDA3606

20

R-PDSO-G20

-

Not Qualified

25V

5.6V

3

POWER SUPPLY SUPPORT CIRCUIT

NO

95μA

-

0.12mA

-

-

-

-

-

-

-

2.65mm

12.8mm

7.5mm

ROHS3 Compliant

TDA3608TH/N3C,518
TDA3608TH/N3C,518

NXP USA Inc.

In Stock

-

Datasheet

-

Surface Mount

20-SOIC (0.433, 11.00mm Width) Exposed Pad

YES

-

-

-40°C~85°C

Tape & Reel (TR)

2001

-

e4

Obsolete

3 (168 Hours)

20

-

SILVER

Processor

8542.31.00.01

9.5V~18V

DUAL

GULL WING

245

1

14.4V

1.27mm

-

30

TDA3608

20

R-PDSO-G20

-

Not Qualified

18V

9.5V

-

ANALOG CIRCUIT

-

500μA

-

-

-

-

-

-

-

-

-

3.5mm

15.9mm

11mm

ROHS3 Compliant

MC32PF1550A2EP
MC32PF1550A2EP

NXP USA Inc.

548
-

14 Weeks

Surface Mount

40-VFQFN Exposed Pad

-

-

-

-40°C~85°C

Tray

-

-

-

Active

3 (168 Hours)

-

-

-

Embedded Systems, Low-Power IoT, Mobile/Wearable Devices

-

3.8V~7V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

POWER SUPPLY MANAGEMENT CIRCUIT

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC34PF1550A1EP
MC34PF1550A1EP

NXP USA Inc.

49
-

14 Weeks

Surface Mount

40-VFQFN Exposed Pad

-

-

-

-40°C~105°C

Tray

-

-

-

Active

3 (168 Hours)

-

-

-

Embedded Systems, Low-Power IoT, Mobile/Wearable Devices

-

3.8V~7V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

POWER SUPPLY MANAGEMENT CIRCUIT

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC34905CS5EKR2
MC34905CS5EKR2

NXP USA Inc.

In Stock

-

Datasheet

99 Weeks

Surface Mount

32-SSOP (0.295, 7.50mm Width) Exposed Pad

-

-

-

-40°C~125°C

Tape & Reel (TR)

2009

-

-

Obsolete

3 (168 Hours)

-

EAR99

-

System Basis Chip

8542.39.00.01

5.5V~28V

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

2mA

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

TDA3608TH/N3C,512
TDA3608TH/N3C,512

NXP USA Inc.

In Stock

-

Datasheet

-

Surface Mount

20-SOIC (0.433, 11.00mm Width) Exposed Pad

YES

-

-

-40°C~85°C

Tube

2001

-

e4

Obsolete

3 (168 Hours)

20

-

SILVER

Processor

8542.31.00.01

9.5V~18V

DUAL

GULL WING

245

1

14.4V

1.27mm

-

30

TDA3608

20

R-PDSO-G20

-

Not Qualified

18V

9.5V

-

ANALOG CIRCUIT

-

500μA

-

-

-

-

-

-

-

-

-

3.5mm

15.9mm

11mm

ROHS3 Compliant

MC34PF1550A2EP
MC34PF1550A2EP

NXP USA Inc.

548
-

14 Weeks

Surface Mount

40-VFQFN Exposed Pad

-

-

-

-40°C~105°C

Tray

-

-

-

Active

3 (168 Hours)

-

-

-

Embedded Systems, Low-Power IoT, Mobile/Wearable Devices

-

3.8V~7V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

POWER SUPPLY MANAGEMENT CIRCUIT

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC34PF1550A3EP
MC34PF1550A3EP

NXP USA Inc.

585
-

14 Weeks

Surface Mount

40-VFQFN Exposed Pad

-

-

-

-40°C~105°C

Tray

-

-

-

Active

3 (168 Hours)

-

-

-

Embedded Systems, Low-Power IoT, Mobile/Wearable Devices

-

3.8V~7V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

POWER SUPPLY MANAGEMENT CIRCUIT

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

TDA3683J/N2C,112
TDA3683J/N2C,112

NXP USA Inc.

In Stock

-

Datasheet

-

Through Hole

23-SIP Formed Leads

-

DBS23P

-

-40°C~85°C

Tube

2001

-

-

Obsolete

1 (Unlimited)

-

-

-

Ignition Buffer, Regulator

-

9V~18V

-

-

-

-

-

-

-

-

TDA3683

-

-

-

-

-

-

-

-

-

300μA

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC34903CS5EKR2
MC34903CS5EKR2

NXP USA Inc.

In Stock

-

Datasheet

16 Weeks

Surface Mount

32-SSOP (0.295, 7.50mm Width) Exposed Pad

-

-

-

-40°C~125°C

Tape & Reel (TR)

2009

-

-

Obsolete

3 (168 Hours)

-

EAR99

-

System Basis Chip

8542.39.00.01

5.5V~28V

-

-

-

-

-

-

-

-

MC34903

-

-

-

-

-

-

-

-

-

2mA

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

TDA3606T/N1,112
TDA3606T/N1,112

NXP USA Inc.

In Stock

-

Datasheet

-

Surface Mount

8-SOIC (0.154, 3.90mm Width)

YES

-

-

-40°C~85°C

Tube

1998

-

-

Obsolete

1 (Unlimited)

8

-

-

Processor

-

5.6V~25V

DUAL

GULL WING

-

-

-

1.27mm

-

-

TDA3606

-

R-PDSO-G8

1

Not Qualified

-

-

-

-

-

95μA

5V

-

0.4V

5%

0.03A

-

25V

FIXED

-

-

-

-

ROHS3 Compliant

MC32PF1550A2EPR2
MC32PF1550A2EPR2

NXP USA Inc.

In Stock

-

-

14 Weeks

Surface Mount

40-VFQFN Exposed Pad

-

-

-

-40°C~85°C

Tape & Reel (TR)

-

-

-

Active

3 (168 Hours)

-

-

-

Embedded Systems, Low-Power IoT, Mobile/Wearable Devices

-

3.8V~7V

-

-

260

-

-

-

-

40

-

-

-

-

-

-

-

-

POWER SUPPLY MANAGEMENT CIRCUIT

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant