Advantech Corp AIMB-701VG-00A1E
Advantech Corp AIMB-701VG-00A1E
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Advantech Corp AIMB-701VG-00A1E

Manufacturer No:

AIMB-701VG-00A1E

Manufacturer:

Advantech Corp

Utmel No:

57-AIMB-701VG-00A1E

Package:

LGA

ECAD Model:

Description:

LGA 1155 INTEL 3RD GENERATION

Quantity:

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DHLTNTUPSFedExSF-Express

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In Stock : Please Inquire

Please send RFQ , we will respond immediately.

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User Guide

Purchase & Inquiry
Package
Shipping Information
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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
AIMB-701VG-00A1E information

Specifications
Documents & Media
Advantech Corp AIMB-701VG-00A1E technical specifications, attributes, parameters and parts with similar specifications to Advantech Corp AIMB-701VG-00A1E.
  • Type
    Parameter
  • Factory Lead Time
    13 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    LGA
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~60°C
  • Published
    2012
  • Size / Dimension

    In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

    12 x 9.6 304.8mmx244mm
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    2.9GHz ~ 3.4GHz
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    Intel Core i7/i5/i3/Pentium
  • Ethernet

    Ethernet is a widely used networking technology that allows devices to communicate with each other over a local area network (LAN). It is a set of standards that define how data is transmitted over a physical medium, typically using twisted-pair cables or fiber optics. Ethernet specifies the protocols for data transmission, addressing, and error detection, ensuring reliable and efficient communication between devices. It is commonly used in homes, businesses, and data centers to connect computers, printers, routers, and other networked devices. Ethernet has evolved over the years to support faster speeds and improved performance, making it a fundamental component of modern networking infrastructure.

    10/100/1000Mbps
  • USB

    USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.

    USB 2.0 (10)
  • Form Factor

    an aspect of design which defines and prescribes the size, shape, and other physical specifications of hardware components, particularly in electronics and electronic packaging

    ATX
  • Number of Cores
    1
  • RAM Capacity/Installed

    RAM Capacity/Installed refers to the amount of Random Access Memory (RAM) that is physically present and available for use in an electronic component, such as a computer or a smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM capacity determines how much data can be processed and accessed quickly by the device, impacting its overall performance and multitasking capabilities. Having a higher RAM capacity allows for smoother and more efficient operation of the device, as it can store and access more data simultaneously.

    16GB/0GB
  • Storage Interface

    The Storage Device Interface (SDI) is a framework for driver software for many of the hardware devices on a system. Besides organizing, simplifying, and standardizing the way device drivers are written, SDI also makes it easier to administer a wide variety of both devices and interfaces.

    SATA 2.0 (4)
  • Video Outputs

    Video Outputs in electronic components refer to the ports or connectors that allow the device to transmit video signals to an external display or monitor. These outputs are essential for connecting devices such as computers, gaming consoles, DVD players, and cameras to TVs, projectors, or other display devices. Common types of video outputs include HDMI, DisplayPort, VGA, DVI, and composite video. The quality and compatibility of video outputs can significantly impact the visual experience and overall performance of the connected devices.

    VGA
  • Expansion Site/Bus

    The parameter "Expansion Site/Bus" in electronic components refers to a designated interface or pathway that allows additional hardware components or peripherals to connect to a primary device or system. This site serves as a means to expand the functionality and capabilities of the existing system by enabling the addition of more components, such as memory boards, graphics cards, or communication interfaces. It facilitates the integration of various modules, enhancing the overall performance and versatility of the electronic system.

    PCI, PCIe
  • Digital I/O Lines

    Digital I/O Lines, also known as digital input/output lines, refer to the pins or connections on an electronic component that can be used to send or receive digital signals. These lines can be configured to either input data (receive signals) or output data (send signals) in the form of binary values (0s and 1s). The number of digital I/O lines available on a component determines the amount of digital data that can be processed or controlled. These lines are commonly used in microcontrollers, sensors, and other electronic devices to interface with external components and peripherals.

    8
  • Cooling Type

    Cooling Type refers to the method used to dissipate heat generated by electronic components to prevent overheating and ensure optimal performance. There are several common cooling types, including air cooling, liquid cooling, and passive cooling. Air cooling uses fans or heat sinks to transfer heat away from the component, while liquid cooling uses a liquid coolant to absorb and dissipate heat. Passive cooling relies on natural convection or thermal conductivity to dissipate heat without the need for additional components. The choice of cooling type depends on factors such as the power consumption, size constraints, and environmental conditions of the electronic component.

    Heat Sink
  • RS-232 (422, 485)

    RS-232, RS-422, and RS-485 are all standard serial communication protocols used in electronic components to transmit data between devices. RS-232 is a common standard for serial communication that uses voltage levels to represent data. RS-422 is a differential standard that uses two wires to transmit data, allowing for longer cable lengths and higher data rates compared to RS-232. RS-485 is also a differential standard but allows for multiple devices to communicate on the same bus, making it suitable for multi-point and multi-drop applications. Overall, these standards define the electrical characteristics and communication protocols for serial data transmission in electronic components.

    2
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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