AMD NG80386DXL-25
AMD NG80386DXL-25
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AMD NG80386DXL-25

Manufacturer No:

NG80386DXL-25

Manufacturer:

AMD

Utmel No:

126-NG80386DXL-25

Package:

132-BQFP Bumpered

ECAD Model:

Description:

Microprocessor

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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NG80386DXL-25 information

Specifications
AMD NG80386DXL-25 technical specifications, attributes, parameters and parts with similar specifications to AMD NG80386DXL-25.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    132-BQFP Bumpered
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    132-PQFP (24.13x24.13)
  • Number of Terminals
    132
  • RoHS
    Non-Compliant
  • Package
    Bulk
  • Mfr
    Advanced Micro Devices
  • Product Status
    Active
  • Package Description
    BQFP, SPQFP132,1.1SQ
  • Package Style
    FLATPACK, BUMPER
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    SPQFP132,1.1SQ
  • Supply Voltage-Nom
    5 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Supply Voltage-Min
    4.5 V
  • Operating Temperature-Max
    100 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    NG80386DXL-25
  • Clock Frequency-Max
    50 MHz
  • Package Code
    BQFP
  • Package Shape
    SQUARE
  • Manufacturer
    AMD
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    ADVANCED MICRO DEVICES INC
  • Supply Voltage-Max
    5.5 V
  • Risk Rank
    5.61
  • Part Package Code
    QFP
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 100°C (TC)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    -
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A001.A.3
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    DYNAMIC BUS SIZING; BARREL SHIFTER; ADDER
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    CMOS
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Terminal Pitch

    The center distance from one pole to the next.

    0.635 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    132
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PQFP-G132
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    25MHz
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROPROCESSOR
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    Am386DXL
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    190 mA
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    4.572 mm
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    32
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    NO
  • Low Power Mode

    Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

    YES
  • External Data Bus Width

    The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.

    32
  • Format

    In electronic components, the parameter "Format" typically refers to the physical size, shape, and configuration of the component. It describes the overall dimensions and layout of the component, including factors such as package type, lead spacing, and mounting options. The format of an electronic component is important for determining how it can be installed, connected, and integrated into a circuit or system. Different formats are designed to meet specific requirements for space constraints, heat dissipation, electrical performance, and compatibility with other components. Manufacturers often provide detailed specifications for the format of their components to ensure proper selection and usage in electronic designs.

    FIXED POINT
  • Integrated Cache

    Integrated Cache refers to a type of memory storage that is built directly into a microprocessor or other electronic component. It is used to temporarily store frequently accessed data and instructions to speed up processing and reduce latency. The integrated cache is designed to provide quick access to data that the processor needs to perform its tasks efficiently. By storing data closer to the processor, the integrated cache helps improve overall system performance by reducing the time it takes to retrieve information from the main memory. The size and speed of the integrated cache can have a significant impact on the performance of the electronic component, making it an important parameter to consider when evaluating the capabilities of a device.

    NO
  • RAM (words)

    RAM (words) is a parameter used to describe the memory capacity of a random access memory (RAM) module in terms of the number of words it can store. In the context of electronic components, a word typically refers to the amount of data that can be processed or stored by the RAM module in a single operation. The RAM (words) specification indicates the total number of words that can be stored in the RAM module, with each word typically consisting of a fixed number of bits. This parameter is important for determining the overall memory capacity and performance of the RAM module in electronic devices.

    0
  • Voltage - I/O

    Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

    5V
  • Ethernet

    Ethernet is a widely used networking technology that allows devices to communicate with each other over a local area network (LAN). It is a set of standards that define how data is transmitted over a physical medium, typically using twisted-pair cables or fiber optics. Ethernet specifies the protocols for data transmission, addressing, and error detection, ensuring reliable and efficient communication between devices. It is commonly used in homes, businesses, and data centers to connect computers, printers, routers, and other networked devices. Ethernet has evolved over the years to support faster speeds and improved performance, making it a fundamental component of modern networking infrastructure.

    -
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Graphics Acceleration

    Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.

    No
  • RAM Controllers

    RAM controllers are electronic components responsible for managing the flow of data to and from random access memory (RAM) in a computer system. They control the timing and data transfer between the CPU and RAM, ensuring efficient communication and data access. RAM controllers play a crucial role in determining the speed and performance of a computer system by optimizing memory access and utilization. These controllers are typically integrated into the motherboard or processor and are essential for the overall functioning of the system's memory subsystem.

    -
  • USB

    USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.

    -
  • Additional Interfaces

    Additional Interfaces in electronic components refer to the extra connections or ports that allow the component to interact with other devices or systems. These interfaces can include various types of communication protocols such as USB, HDMI, Ethernet, or wireless connections like Bluetooth or Wi-Fi. The presence of additional interfaces expands the functionality and versatility of the electronic component, enabling it to send and receive data, signals, or power to and from external devices. Designers and users can utilize these interfaces to enhance the capabilities and connectivity of the electronic component within a larger system or network.

    -
  • Co-Processors/DSP

    Co-processors and Digital Signal Processors (DSPs) are specialized electronic components designed to handle specific types of computation tasks more efficiently than a general-purpose CPU. Co-processors assist the main processor by executing complex mathematical calculations or processing data in parallel, often enhancing performance for applications like graphics rendering or scientific computations. DSPs, on the other hand, are optimized for processing digital signals in real-time, making them ideal for applications in audio processing, telecommunications, and image processing. Together, these components enable more efficient data handling and improved system performance in various electronic devices.

    Math Engine; 387DX
  • Number of External Interrupts
    2
  • Security Features

    Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.

    -
  • Display & Interface Controllers

    A unit in a computer system consisting of channels and associated control circuitry that connect a number of visual display units with a central processor.

    -
  • SATA

    SATA stands for Serial Advanced Technology Attachment, which is a type of interface used to connect storage devices such as hard drives and solid-state drives (SSDs) to a computer's motherboard. It is a popular standard for connecting internal storage devices in desktops, laptops, and servers. SATA interfaces transfer data serially, meaning that data is sent one bit at a time, which allows for faster and more efficient data transfer compared to older parallel interfaces. SATA interfaces come in different versions, such as SATA I, SATA II, and SATA III, with each version offering different speeds and features. Overall, SATA is a widely used and reliable interface for connecting storage devices in modern electronic components.

    -
  • Width
    24.13 mm
  • Length
    24.13 mm
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