Amphenol A850491821Z06B
Amphenol A850491821Z06B
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Amphenol A850491821Z06B

Manufacturer No:

A850491821Z06B

Manufacturer:

Amphenol

Utmel No:

143-A850491821Z06B

Package:

165-LBGA

ECAD Model:

Description:

A850491821Z06B datasheet pdf and Accessories product details from Amphenol stock available at Utmel

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The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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A850491821Z06B information

Specifications
Product Details
Amphenol A850491821Z06B technical specifications, attributes, parameters and parts with similar specifications to Amphenol A850491821Z06B.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    165-LBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    165-FBGA (15x17)
  • Package
    Tray
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    CY7C1413
  • Mfr
    Infineon Technologies
  • Product Status
    Obsolete
  • Memory Types
    Volatile
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Manufacturer
    Amphenol
  • Brand
    Amphenol Pcd
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 70°C (TA)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    -
  • Subcategory
    Circular Connectors
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    SRAM - Synchronous, QDR II
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.7V ~ 1.9V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    36Mbit
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    250 MHz
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    SRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    -
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Circular MIL Spec Backshells
  • Product Category

    a particular group of related products.

    Circular MIL Spec Backshells
  • Memory Organization

    Memory organization in electronic components refers to the way data is stored and accessed within the memory system. It includes the structure and arrangement of memory cells, addressing schemes, data organization, and access methods. The memory organization determines how data is stored in different memory locations, how it is retrieved, and how it is managed. Different types of memory, such as RAM, ROM, and cache memory, have specific memory organizations tailored to their intended functions and performance requirements. Overall, memory organization plays a crucial role in the efficiency and effectiveness of data storage and retrieval in electronic devices.

    2M x 18
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A850491821Z06B Overview

In order to make it more convenient, it has been included in the 165-LBGA package. This device has a mounting type of Surface Mount. A temperature setting of 0°C ~ 70°C (TA) ensures reliable performance. Subcategory 0 is home to this device. In the - series, this electrical component is found. It has the supplier package 165-FBGA (15x17).

A850491821Z06B Features

165-LBGA
- Series
Surface Mount
Operating Temperature Range: 0°C ~ 70°C (TA)

A850491821Z06B Applications

There are a lot of Amphenol
A850491821Z06B Microcontroller applications.
A850491821Z06B MCU is usually applied for Measurement and control field, Consumer electronics products, Network communication, mobile communication, Office automation equipment and computer peripherals, Industrial control Instrumentation and process control, Agriculture, transportation, Navigation control, Network application, Metering & measurement, Day to day life, Safety, Medical instruments and Automobile industry.


  • To enhance power efficiency
  • Coupling or blocking
  • Smoothing
  • Decoupling or bypassing
  • Noise filtering
  • DC/DC, DC/AC, and AC/AC converters
  • Frequency converters
  • Spot welding
  • Flashtube ignition
  • DC link