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Analog Devices Inc. HMC862ALP3E

Manufacturer No:

HMC862ALP3E

Manufacturer:

Analog Devices Inc.

Utmel No:

153-HMC862ALP3E

Package:

16-VFQFN Exposed Pad, CSP

Datasheet:

HMC862ALP3E

ECAD Model:

Description:

Prescaler 5V Divide By 1/2/4/8 24000MHz 16-Pin LFCSP EP Cut Tape

Quantity:

Unit Price: $22.606168

Ext Price: $22.61

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HMC862ALP3E information

Specifications
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Product Details
Analog Devices Inc. HMC862ALP3E technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. HMC862ALP3E.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    PRODUCTION (Last Updated: 1 week ago)
  • Factory Lead Time
    25 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    16-VFQFN Exposed Pad, CSP
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    16
  • Operating Temperature (Max.)
    85°C
  • Operating Temperature (Min.)
    -40°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Strip
  • Size / Dimension

    In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

    0.118Lx0.118W 3.00mmx3.00mm
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    16
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin (Sn)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5.5V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    100MHz~15GHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    HMC862
  • Pin Count

    a count of all of the component leads (or pins)

    16
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Telecom IC Type

    Telecom IC Type refers to integrated circuits specifically designed for telecommunications applications. These components facilitate various functions such as signal processing, data modulation and demodulation, and communication protocol handling. They can be used in devices like mobile phones, modems, and network equipment, ensuring reliable data transmission and reception. Telecom ICs support different standards and technologies, making them essential for modern communication systems.

    TELECOM CIRCUIT
  • Length
    3mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1mm
  • Width
    3mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Contains Lead
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Download datasheets and manufacturer documentation for Analog Devices Inc. HMC862ALP3E.

Product Description

Description

The HMC862ALP3E is a high-performance RF power divider/splitter designed by Analog Devices Inc. This component is part of the HMC862 series, which is renowned for its reliability and precision in RF applications. The HMC862ALP3E operates within a wide frequency range of 100 MHz to 15 GHz, making it suitable for various telecommunications and industrial applications.

Features

  • Wide Frequency Range: Operates from 100 MHz to 15 GHz, catering to diverse RF requirements.
  • High Pin Count: 16-pin configuration for efficient signal handling.
  • Exposed Pad Package: 16-VFQFN Exposed Pad, CSP (Chip Scale Package) for enhanced thermal management.
  • Lead-Free but Contains Lead: Note that while the product is labeled as "Lead Free," it actually contains lead.
  • Industrial Temperature Range: Operating temperature range of -40°C to 85°C, suitable for industrial environments.
  • Compliance with ROHS3: Meets the requirements of ROHS3 (Restriction of Hazardous Substances) for environmental sustainability.
  • Surface Mount Capable: Designed for surface mount technology (SMT) integration.

Applications

  1. Primary Applications:
  2. Telecommunications: The HMC862ALP3E is ideal for use in base stations, cell towers, and other telecommunications infrastructure where high-frequency signal splitting is required.
  3. Industrial Automation: Its industrial temperature range makes it suitable for use in control systems and automation equipment that operate in harsh environments.

  4. Secondary Applications:

  5. Test and Measurement Equipment: The component's wide frequency range makes it useful in test and measurement setups.
  6. Radar Systems: Can be employed in radar systems where precise signal splitting is necessary.

Alternative Parts

If the HMC862ALP3E is not available or if you need an alternative solution, consider the following parts: - HMC862ALP4E: Similar functionality with a different lead time. - HMC862ALP6E: Another variant with slightly different specifications.

Embedded Modules

The HMC862ALP3E is often used in various embedded modules due to its versatility and performance: - Base Station Modules: Used in base station modules for cellular networks. - Radar Modules: Integrated into radar modules for various applications including automotive radar systems. - Test Equipment Modules: Employed in test equipment modules designed for RF signal processing.

By combining these features and applications, the HMC862ALP3E stands out as a reliable choice for any RF power divider/splitter requirement within its specified frequency range.