AVX Corporation CP0805A0881AWTR

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Parameter "Composition" in electronic components refers to the specific materials and substances used in the construction of the component. It encompasses the chemical and physical elements that make up the component, influencing its electrical, thermal, and mechanical properties. The composition can affect the performance, reliability, and durability of the component in various applications. Understanding the composition is essential for optimizing the design and functionality of electronic devices.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

Construction in electronic components refers to the design and materials used in the manufacturing of the components. It encompasses the physical structure, arrangement, and integration of various parts like substrates, conductors, and insulators. The construction impacts the performance, reliability, and thermal properties of the component, influencing how it interacts with electrical signals and other components in a circuit. Different construction techniques can also affect the size, weight, and cost of the electronic component.

In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

Case Code (Metric) in electronic components refers to a standardized system that specifies the dimensions of surface-mount devices (SMD) in millimeters, consisting of a four-digit number where the first two digits represent the width and the last two digits represent the height of the component, measured in tenths of a millimeter. The metric case codes are standardized by organizations such as the EIA and IEC, and are often compared to the Imperial code which uses inches, allowing for easier identification and selection of components across different regions and industries. This coding system is widely used in the design and manufacturing of electronic devices, particularly in applications requiring compact and efficient component layouts, and is essential for engineers and designers to ensure proper component selection and facilitate the assembly process in electronic manufacturing.

The term "Case Code (Imperial)" in electronic components refers to a standardized system used to specify the physical dimensions and package types of components, particularly capacitors and resistors. This code helps manufacturers and engineers identify the size and form factor of the component, ensuring compatibility with circuit designs and PCB layouts. In the context of electronic components, the Case Code (Imperial) typically follows a numerical format that indicates the length and width of the component in inches. For example, a Case Code of 1206 signifies a component that measures 0.12 inches by 0.06 inches. This coding system is essential for selecting the correct components for specific applications, as it provides a quick reference to the physical characteristics of the part, including its footprint and mounting style.

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

The parameter "RF/Microwave Device Type" in electronic components refers to the specific type or category of devices designed to operate within the radio frequency (RF) and microwave frequency ranges. These devices are engineered to handle high-frequency signals and are commonly used in various applications such as wireless communication, radar systems, satellite communication, and more. Examples of RF/Microwave device types include amplifiers, filters, mixers, oscillators, antennas, and transceivers. Understanding the RF/Microwave device type is crucial for selecting the appropriate component that meets the requirements of a particular RF system or application.

Isolation in electronic components refers to the ability of a component to prevent the flow of electrical current between two points that are at different potentials. It is crucial for ensuring safety and preventing electrical hazards in electronic circuits. Isolation can be achieved through various methods such as using insulating materials, physical barriers, or optical isolation techniques. Proper isolation helps to protect sensitive components and circuits from damage due to voltage spikes, noise, or short circuits. It is particularly important in high-voltage applications and when dealing with components that are connected to different power sources.

VSWR-Max stands for Voltage Standing Wave Ratio Maximum, which is a parameter used in electronic components, particularly in RF and microwave applications. It measures how effectively power is transmitted from a source through a transmission line to a load, indicating the level of reflected power due to impedance mismatches. A lower VSWR-Max value signifies better impedance matching and higher efficiency, while a higher value indicates poor matching, leading to greater signal reflections and potential performance issues. Manufacturers specify VSWR-Max to help ensure components operate within acceptable limits for optimal functionality.

Insertion Loss (dB) is a parameter used to measure the amount of signal loss that occurs when a component is inserted into a transmission line or circuit. It is typically expressed in decibels (dB) and represents the difference in signal power before and after the insertion of the component. A higher insertion loss value indicates greater signal attenuation or reduction in signal strength. Insertion loss is an important consideration in electronic components such as filters, amplifiers, and connectors, as it can impact the overall performance and efficiency of a system. Minimizing insertion loss is often a key design goal to ensure optimal signal integrity and transmission quality.

Input Power-Max (CW) is a parameter used to specify the maximum continuous wave power that an electronic component can handle without being damaged. This parameter is crucial in determining the power handling capability of the component under continuous wave operation. It is typically measured in watts and provides important information for designing circuits and systems to ensure that the component operates within its safe power limits. Exceeding the specified Input Power-Max (CW) can lead to overheating, degradation, or even permanent damage to the component.

In telecommunications, return loss is a measure in relative terms of the power of the signal reflected by a discontinuity in a transmission line or optical fiber.

The parameter "Coupler Type" in electronic components refers to the method by which signals are transferred between two circuits or systems. It defines the physical and functional characteristics of the coupling mechanism, which can be electrical, optical, or mechanical. Common examples include capacitive, inductive, or transformer couplers in electrical applications and fiber optic couplers in optical applications. The choice of coupler type affects factors such as signal integrity, impedance matching, and cross-talk.

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.